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MICRONNECT.EU

Micronnect b.v. Micronnect b.v. Your supplier for wire bonding, die bonding, flipchip bonding, plasma cleaning, bonding tools, capillaries, stampings, bonding wire solder, balls ceramic substrates, metallizations

Micronnect liefert Ihnen und ber t Sie f r viele Bondprodukte in ganz Europa

http://www.micronnect.eu/

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Micronnect b.v. Micronnect b.v. Your supplier for wire bonding, die bonding, flipchip bonding, plasma cleaning, bonding tools, capillaries, stampings, bonding wire solder, balls ceramic substrates, metallizations | micronnect.eu Reviews
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Micronnect liefert Ihnen und ber t Sie f r viele Bondprodukte in ganz Europa
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2 bonding
3 wire bonder
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5 wire bonds
6 wedge bonding
7 die bonders
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9 die bonds
10 die attach
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equipment,fine wire bonder,die bonder,flichip bonder,bond tester,scriber,micro spot welding,spot welding heads,micro arc welding,tools,die bonding tools,fine wire wedges,large wire wedges,capillaries,welding electrodes,wire and ribbon,metal stampings
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Micronnect b.v. Micronnect b.v. Your supplier for wire bonding, die bonding, flipchip bonding, plasma cleaning, bonding tools, capillaries, stampings, bonding wire solder, balls ceramic substrates, metallizations | micronnect.eu Reviews

https://micronnect.eu

Micronnect liefert Ihnen und ber t Sie f r viele Bondprodukte in ganz Europa

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micronnect.eu micronnect.eu
1

Micronnect b.v. Micronnect b.v. Your supplier for wire bonding, die bonding, flipchip bonding, plasma cleaning, bonding tools, capillaries, stampings, bonding wire solder, balls ceramic substrates, metallizations

http://www.micronnect.eu/diebondingtools.php?language=en

Micronnect has much experience in tools for a wide variety of applications. You find part of that experience in all our quotations in the extensive technical information for each specific tool. This procedure reduces the risk ordering wrong tools. We invite you to contact us if you wish more specific information on any tool aspect of your application prior to a quotation or thereafter. Micronnect supplies the next die-bonding tools:. Middot; Vacuum pickup tools. Middot; Die collets.

2

Micronnect b.v. Micronnect b.v. Your supplier for wire bonding, die bonding, flipchip bonding, plasma cleaning, bonding tools, capillaries, stampings, bonding wire solder, balls ceramic substrates, metallizations

http://www.micronnect.eu/spotweldingheads.php?language=en

The welding heads are available in three basic configurations:. Opposed: In line welding electrodes with single welding head and fixed lower electrode. Parallel Gap: Parallel welding electrodes mounted in a compliant tip assembly. Twin: Parallel welding electrodes with twin welding modules for individual force control and compliance. MacGregor offers next weld heads:. Middot;Precision modular opposed and parallel gap weld heads (2 to 500 N). Middot;Universal welds heads for general applications.

3

Micronnect b.v. Micronnect b.v. Your supplier for wire bonding, die bonding, flipchip bonding, plasma cleaning, bonding tools, capillaries, stampings, bonding wire solder, balls ceramic substrates, metallizations

http://www.micronnect.eu/waferbonder.php?language=en

SST International offers programmable wafer bonders for high-reliability bonding of silicon, gallium-arsenide and glass wafers up to 150 mm (6 inches) in diameter. Both systems provide precise automatic control of heating and cooling at temperatures up to 500 °C (1000 °C optional). Bellows actuated clamping platens present uniform mechanical bonding forces up to 3400 N (22 kN optional) to the wafer pair.

4

Micronnect b.v. Micronnect b.v. Your supplier for wire bonding, die bonding, flipchip bonding, plasma cleaning, bonding tools, capillaries, stampings, bonding wire solder, balls ceramic substrates, metallizations

http://www.micronnect.eu/finewirebonder.php?language=en

Micronnect delivers West·Bond thin-wire wedge bonders, ball bonders, insulated wire bonders, as well as convertible machines that do thin-wire wedge, deep access, ball bonding, and stud bumping by changing only the wire clamp (no bond head need be changed). All West·Bond wedge bonders include an angled-feed wire clamp and a deep-access wire clamp. We supply the following machine types:. Middot; Manual machines. Middot; Z-motorized machines. Middot; Semi-automatic machines. Middot; Automatic machines.

5

Micronnect b.v. Micronnect b.v. Your supplier for wire bonding, die bonding, flipchip bonding, plasma cleaning, bonding tools, capillaries, stampings, bonding wire solder, balls ceramic substrates, metallizations

http://www.micronnect.eu/scriber.php?language=en

The JFP motorized stage scriber S200 scribes silicon and other breakable materials, such as glass and ceramic substrates. After joy-stick alignment, the machine scribes the whole wafer automatically in one direction. After scribing, products need to be singulated manually. The vibration free stand isolates both machines from external shocks.

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webstyleengineering.com webstyleengineering.com

WEBSTYLE ENGINEERING - webdesign - software and database engineering

http://www.webstyleengineering.com/portfolio.html/nl-3

MICRONNECT B.V. Official distributor for bonding products in Europe. Ontworpen en ontwikkeld in 2007. Upgrade: 2012-2013. Redactionele inhoud in het Engels. De website toont machines en onderdelen voor de micro-elektronica die door MICRONNECT B.V. aan onderzoeks- en industriële laboratoria worden verkocht. Deze website benadrukt de activiteit van MICRONNECT B.V. door:. Het bieden van een duidelijk overzicht van alle machines, producten en. Diensten van MICRONNECT B.V. Van MICRONNECT B.V.

webstyleengineering.com webstyleengineering.com

WEBSTYLE ENGINEERING - webdesign - software and database engineering

http://www.webstyleengineering.com/portfolios.html/nl

Voor meer info, klik op de beelden aan de rechter kant. Upgrade website FOREVER FOTOGRAPFIE. CATHERINE PRAUD, vertaling naar het Frans. MARIE-JOSÉ WERNERS, fotografe. Maryse.grousson.pagesperso-orange.fr. Upgrade Mirjam van Overbeek, Kunst en Design. Julia Boix-Vives, kunstenares. FOREVER FOTOGRAFIE, Laura Dekker, fotograaf gespecialiseerd in senior-portretten. Mirjam van Overbeek, Kunst en Design. Vereniging Maria Middelares, Dahliatuin Eindhoven. Upgrade L'Autre Agenda, mobile applicatie.

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Micronnect b.v. Micronnect b.v. Your supplier for wire bonding, die bonding, flipchip bonding, plasma cleaning, bonding tools, capillaries, stampings, bonding wire solder, balls ceramic substrates, metallizations

Click for more info. Micronnect is distributor of electronic packaging products in Europe. We sell products from DeWeyl, JFP Microtechnic, Coorstek-Gaiser, Coining, SPT, West·Bond, and MacGregor. Additionally we offer you consulting and equipment service, based on some 20 years of experience in electronic packaging. Middot; Equipment for die and wire bonding, bond testing, flipchip bonding,. Micro resistance and parallel-gap welding, micro arc spot welding;. Middot; Tools for die bonding.

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Micronnect b.v. Micronnect b.v. Your supplier for wire bonding, die bonding, flipchip bonding, plasma cleaning, bonding tools, capillaries, stampings, bonding wire solder, balls ceramic substrates, metallizations

Click for more info. Micronnect is distributor of electronic packaging products in Europe. We sell products from DeWeyl, JFP Microtechnic, Coorstek-Gaiser, Coining, SPT, West·Bond, and MacGregor. Additionally we offer you consulting and equipment service, based on some 20 years of experience in electronic packaging. Middot; Equipment for die and wire bonding, bond testing, flipchip bonding,. Micro resistance and parallel-gap welding, micro arc spot welding;. Middot; Tools for die bonding.

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Micronnect b.v. Micronnect b.v. Your supplier for wire bonding, die bonding, flipchip bonding, plasma cleaning, bonding tools, capillaries, stampings, bonding wire solder, balls ceramic substrates, metallizations

Click for more info. Micronnect is distributor of electronic packaging products in Europe. We sell products from DeWeyl, JFP Microtechnic, Coorstek-Gaiser, Coining, SPT, West·Bond, and MacGregor. Additionally we offer you consulting and equipment service, based on some 20 years of experience in electronic packaging. Middot; Equipment for die and wire bonding, bond testing, flipchip bonding,. Micro resistance and parallel-gap welding, micro arc spot welding;. Middot; Tools for die bonding.

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