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3D-IC Alliance Home PageThe 3D-IC Alliance is a consortium that promotes standards in 3D-ICs
http://www.3d-ic.org/
The 3D-IC Alliance is a consortium that promotes standards in 3D-ICs
http://www.3d-ic.org/
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3D-IC Alliance Home Page | 3d-ic.org Reviews
https://3d-ic.org
The 3D-IC Alliance is a consortium that promotes standards in 3D-ICs
3d-ic.org
Standards
http://www.3d-ic.org/standards.html
Standards for 3D-ICs (Three-Dimensional Integrated Circuits). IMIS - Intimate Memory Interface Specification. Physical standard of interface characteristics for mounting memory onto any host device in a 3D configuration. Includes a system of pin definitions, specifying locations and order, made as generic as possible in order to cover a wide range of implementations; also includes a set of surface preparation requirements to cover various categories of bonding methods. Press Release, July 2008.
Membership
http://www.3d-ic.org/membership.html
Click here to download a membership application in Adobe .pdf format. Mail your completed application to:. 1415 Bond Street, Suite 111. Naperville, IL 60563. Or fax it to:.
Events
http://www.3d-ic.org/events.html
IEEE International System-on-Chip Conference. 6-9 September 2016, Seattle, WA. 15-16 September 2016, Stuttgart, Germany. IMAPS: Advances in Semiconductor Packaging. 22 September 2016, Marcy, NY. International Microelectronics Assembly and Packaging (IMAPS). 10-13 October 2016, Pasadena, CA. IEEE SOI-3D-Subthreshold (S3S) Microelectronics Technology Unified Conference. 10-13 October 2016, Burlingame, CA. International Wafer-Level Packaging Conference (IWLPC). 18-20 October 2016, San Jose, CA. 12-15 June 2...
Literature
http://www.3d-ic.org/literature.html
Papers, Articles, and Blogs about 3D-ICs. Listed in reverse chronological order). Die Stacking Options for 2.5D. IFTLE, 17 August 2016. Semiconductor Engineering, 27 July 2016. Comparing High Density Packaging Technologies. IFTLE, 26 July 2016. Moore’s law scaling dead by 2021, to be replaced by 3D integration. Extreme Tech, 26 July 2016. Stacking Logic On Logic. Semiconductor Engineering, 21 July 2016. Semiconductor Engineering, 21 July 2016. 3D InCites, 15 July 2016. EE Times, 14 July 2016. Challenges ...
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3D Integrated Circuit
3D-IC Alliance Home Page
Si2 (semiconductor standards consortium) has an Open3D Technical Advisory Board. 3D InCites Knowledge Portal. Technology features, white papers, book reviews, market research). 3D InCites 3D by Design blog. 3D-ICs Community reports news, blogs and papers. Global Semiconductor Alliance (GSA) has a 3D-IC Working Group. 3D Interconnect Wiki maintains a 3D Standards Dashboard. About the 3D-IC Alliance. Non-members are invited to join the 3D-IC Alliance. Page This standard reflects our initial focus on the st...
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3D ICOM – Ihr innovativer Compositehersteller
Wer ist 3D ICOM? Innovativer Hersteller von Composite. Wir sind Zulieferer im Technologiebereich Faserverbundstofftechnologie (Composite) für die Bereiche Flugzeugbau, Wehrtechnik sowie besondere, interdisziplinäre Projekte und Nischenlösungen. Was liefert 3D ICOM? Wir liefern Leichtbaukomponenten und -systeme aus Glasfaser- und Kohlenstofffaserverbundwerkstoffen für die Luftfahrtindustrie. Welchen Umfang haben die Dienstleistungen von 3D ICOM? Von der Idee bis zum fertigen Produkt.
3D ICOM – Ihr innovativer Compositehersteller
Wer ist 3D ICOM? Innovativer Hersteller von Composite. Wir sind Zulieferer im Technologiebereich Faserverbundstofftechnologie (Composite) für die Bereiche Flugzeugbau, Wehrtechnik sowie besondere, interdisziplinäre Projekte und Nischenlösungen. Was liefert 3D ICOM? Wir liefern Leichtbaukomponenten und -systeme aus Glasfaser- und Kohlenstofffaserverbundwerkstoffen für die Luftfahrtindustrie. Welchen Umfang haben die Dienstleistungen von 3D ICOM? Von der Idee bis zum fertigen Produkt.
