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EV Group (EVG) 3D Interconnect - Bonder - Aligner - Coater

EV Group (EVG)  3D Interconnect, EVG GEMINI: the only field-proven automated production wafer bonder for 3D integration in the semiconductor industry designed for processing wafer sizes up to 300mm with maximum flexibility. Void-free bonding with sub-micron to micron-level alignment accuracy, Easy conversion to different wafer sizes, Modular design with a minimized footprint;

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EV GROUP

IBG Immobili●●●●●●●●●●●●ligungs GmbH

St.Flo●●●●●●am Inn , Upper Austria, 4782

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EV GROUP

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IBG Immobili●●●●●●●●●●●●ligungs GmbH

St.Flo●●●●●●am Inn , Upper Austria, 4782

AT

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EV GROUP

EV GROUP

IBG Immobili●●●●●●●●●●●●ligungs GmbH

St.Flo●●●●●●am Inn , Upper Austria, 4782

AT

do●●●●●●●●●●●●●●●●@evgroup.com

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EV Group (EVG) 3D Interconnect - Bonder - Aligner - Coater | 3d-interconnect.com Reviews
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EV Group (EVG)  3D Interconnect, EVG GEMINI: the only field-proven automated production wafer bonder for 3D integration in the semiconductor industry designed for processing wafer sizes up to 300mm with maximum flexibility. Void-free bonding with sub-micron to micron-level alignment accuracy, Easy conversion to different wafer sizes, Modular design with a minimized footprint;
<META>
KEYWORDS
1 3D Interconnect
2 3D-IC
3 EVG
4 EV Group
5 wafer bonder
6 wafer bonding
7 bonder
8 bonding
9 semiconductor process equipment
10 MEMS
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ev group,imprint,pitch 51m soi,ev group evg,invent,innovate,implement
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EV Group (EVG) 3D Interconnect - Bonder - Aligner - Coater | 3d-interconnect.com Reviews

https://3d-interconnect.com

EV Group (EVG)  3D Interconnect, EVG GEMINI: the only field-proven automated production wafer bonder for 3D integration in the semiconductor industry designed for processing wafer sizes up to 300mm with maximum flexibility. Void-free bonding with sub-micron to micron-level alignment accuracy, Easy conversion to different wafer sizes, Modular design with a minimized footprint;

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Advanced Packaging and 3D Interconnect. GEMINI Automated Production Wafer Bonder. CEA Liti - MINATEC / Alliance, SiOł bonding,. For more information please contact: 3Dinterconnect@EVGroup.com. You would like to enlarge your profit? Void-free bonding with sub-micron to micron-level alignment accuracy. Easy conversion to different wafer sizes. Modular design with a minimized footprint. Solutions for the semiconductor and related microelectronics industries. There are no limits; only limiting thoughts.

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