3dic-conf.org
2015 3DIC / IEEE
May 30, 2015 24:00 (Japan Time / GMT 9:00). Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, 3D IC process, monolithic 3D integration, heterogeneous 3D integration, Capacitive coupling, Inductive coupling, multilevel epitaxial growth, etc. 3D IC Circuits Technology:. 3D SOC, 3D Memory, 3D Processor, 3D DSP, 3D FPGA, 3D RF and microwave/millimeter wave, 3D analog circuits, 3D Biomedical circuits etc. The deadline for Abstract Submission.
3dic.fnal.gov
3DIC at Fermilab
Consortium for Development of Vertically Integrated (3D) Readout Electronics and Sensors. Vertical integration or 3D for short is defined as the integration of thinned and bonded silicon integrated circuits with vertical interconnects between IC layers. Handbook of 3D Integration. Edited by Philip Garrou, Christopher Bower, and Peter Ramm, Wiley-VCH, 2008.
3dic.org
Cutting-Edge 3DIC Technologies - 3DIC.org
Date is a type. And predefined property provided by Semantic MediaWiki. To represent date values. SMIC Signs License Agreement For Invensas' DBI Technology. Imec and EVG demonstrate 1.8µm pitch overlay accuracy for wafer-to-wafer hybrid bonding. Qualcomm Announces 10nm FinFET Centriq 2400 Server Processor With 48 Cores. World's First Qubit Device Fabricated In Standard CMOS Process. Date is a type. And predefined property provided by Semantic MediaWiki. To represent date values. San Francisco, USA.
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