Amkor Technology is the world's leading supplier of outsourced semiconductor interconnect services. With over 35 years of continuous improvement, growth and innovation, Amkor has become a trusted partner for most of the world’s leading semiconductor suppliers.
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PERFECT PRIVACY, LLC
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PERFECT PRIVACY, LLC
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Amkor Technology: Semiconductor IC Test | Wafer Level Packaging | Wafer Probe | Wafer Bumping | Flip Chip | RF Design | RF Test | amkor.com Reviews
https://amkor.com
Amkor Technology is the world's leading supplier of outsourced semiconductor interconnect services. With over 35 years of continuous improvement, growth and innovation, Amkor has become a trusted partner for most of the world’s leading semiconductor suppliers.
Amkor Technology PLM
Amkor Technology: web.data
Amkor's Web.data is an Extranet service for our customers. It enables customers to view a variety of information about their products as they move through Amkor's factories. This service is available only to Amkor's active customers who have product in our factories. If you fit this profile and wish to obtain access to our Web.data system, please fill out an account request. Do not use your web browser's back button to navigate. Doing so may cause any information entered to be lost.
amkor.com
Amkor Technology: 2015 Amkor Customer Symposium
http://www.amkor.com/go/events/2015-amkor-customer-symposium
2015 Amkor Customer Symposium. 2015 Amkor Customer Symposium. San Jose, CA USA. Amkor is Everywhere – Connecting People and Technology. For additional information on Amkor’s Customer Symposium, please contact your Amkor Account Manager or email us at: Marketing@amkor.com. Conflict Minerals Policy Statement. Commitment to Human Rights.
Amkor Technology: MEMS Manufacturing 2015
http://www.amkor.com/go/events/mems-manufacturing-2015
Santa Clara, California. Amkor Technology invites you to join us at the MEMS Manufacturing 2015 on August 5-6 in Santa Clara, California. Adrian Arcedera, VP, MEMS, Sensors and PBGA Products at Amkor, will be presenting MEMS Packaging Standardization. For additional information on this event, please visit: http:/ www.memsmanufacturing.com/. Conflict Minerals Policy Statement. Commitment to Human Rights.
Amkor Technology: Copper Pillar Fine Pitch Flip Chip | Cu Pillar | Copper Bump | Cu Bump
http://www.amkor.com/go/packaging/all-packages/fine-pitch-copper-pillar-flip-chip/fine-pitch-copper-pillar-flip-chip
Fine Pitch Copper Pillar Flip Chip. Fine Pitch Copper Pillar Flip Chip. Fine pitch capable down to 50 μm in-line and 40 μm/80 μm staggered. Cost reduction achievable in many designs by reducing substrate. Superior electromigration performance for high current carrying capacity applications. Test at wafer level prior to copper pillar bump. Compatible with bond pad opening/pitch and pad metallization of die designed for wire bond which enables quick time-to-market for conversion to flip chip. 20 - 50 μm.
Amkor Technology: ChipArray BGA Package | FBGA | CABGA | CTBGA | CVBGA
http://www.amkor.com/go/chiparray
ChipArray BGA (CABGA FBGA CVBGA CTBGA). Amkor’s ChipArray Ball Grid Array (CABGA) packages are laminate based packages that are compatible with SMT mounting processes world wide. The near chip size CABGA fine-pitch BGA (fBGA) offers a broad selection of ball array pitches (≥ 0.4 mm pitch), ball counts and body sizes (1.5 mm to 27 mm body), single and multi-die layouts, stacked die (1-16) and passive component integration. For more information on the ChipArray and fBGA packages, ChipArray SiP.
Amkor Technology: International Microwave Symposium 2015
http://www.amkor.com/go/events/international-microwave-symposium-2015
International Microwave Symposium 2015. International Microwave Symposium 2015. Phoenix, AZ USA. Amkor Technology invites you to join us at IMS 2015. IEEE MTT International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. And System-in-Package ( SiP. Amkor will also be exhibiting at this year's show in Booth #1609. For additional information on the upcoming show, visit: http:/ www.ims2015.org/.
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IMAPS - HiTEN 2017 - International Conference on High Temperature Electronics Network
http://www.imaps.org/hiten
Session Chair Manual (PDF). Journal of Micro and Elect Pkg. International Conference and Exhibition on. High Temperature Electronics Network (HiTEN 2017). July 10-12, 2017. Cambridge, United Kingdom. Abstract Deadline Extended: January 31, 2017. Colinjohnston@materials.ox.ac.uk. Alison Crossley, University of Oxford (UK). Andy Longford, Panda Europe IMAPS UK (UK). Patrick McCluskey, CALCE (US). Denis Flandre, UCL (B). Bernd Michel, FHG-IZM (D). Randy Norman, Perma Works (US). Ovidiu Vermessan, SINTEF (N).
Exhibition
http://www.empc2013.com/exhibition-empc-2013
Book an Exhibition Stand. The Exhibition will take place at the EUROPOLE WTC in Grenoble from Monday 9th to Thursday 12th September. This provides an excellent opportunity for delegates to familiarise themselves with the latest materials, equipment and services in the Microelectronics Industry. The exhibition is positioned adjacent to the Technical Sessions and refreshments will be served in the exhibition area in order to maximise the amount of time delegates spend within the exhibition. If you are deli...
About - ESPAT
http://espat.weebly.com/about.html
The European Semiconductor Assembly and Test Special Interest Group represents those who have, or have interest in investing in, semiconductor packaging, assembly and test manufacturing capabilities and capacities in Europe. The main goal of the ESPAT Group is to promote the sustainable development of organizations working in the field of semiconductor back-end technology and supply in Europe. Develop and maintain a strong back-end network in Europe;. Organize an Annual Technical Workshop in Europe;.
DesktopExpos Packaging Equipment & Supplies Show
http://www.desktopexpo.com/tsPACKAGING.htm
Equipment and Supplies Expo. Exhibit and Advertise On This Site. Point and click on the companies named below. For a specific brand or product? Use your browser's EDIT. Menu and select FIND. To receive exhibiting information. On how to exhibit globally. Gulf States Business Solutions Group. Folding carton packaging design. Selective flux dot coating. Solder and Flux bearing leads. Multilayer and double-sided PCB fab facility. Research, Industrial and Medical. Electronic Assembly Process and Productivity.
DesktopExpos Packaging Equipment & Supplies Show
http://www.desktopexpos.com/tsPACKAGING.htm
Equipment and Supplies Expo. Exhibit and Advertise On This Site. Point and click on the companies named below. For a specific brand or product? Use your browser's EDIT. Menu and select FIND. To receive exhibiting information. On how to exhibit globally. Gulf States Business Solutions Group. Folding carton packaging design. Selective flux dot coating. Solder and Flux bearing leads. Multilayer and double-sided PCB fab facility. Research, Industrial and Medical. Electronic Assembly Process and Productivity.
June 2009 | Jobs Site
http://sheila-jobtips.blogspot.com/2009_06_01_archive.html
Friday, June 19, 2009. Find a Job: FREE Company Website 1. Many newly graduates have no idea on how to start searching for their first jobs. My First blog:. Tips to Find Your First Job. Fast will help you find manufacturing ECOZONES where many companies are located. This blog contains details of each company made to help you search jobs easier. 1)AG&P SEZ Location San Roque, Bauan, Batangas. Location San Roque, Bauan, Batangas. Developer/Operator : Altlantic Gulf and Pacific Co. of Manila, Inc. This is t...
欢迎登陆《中国集成电路》网站 - 中国集成电路
http://www.cicmag.com/bbx/1226773-1226773.html
2016 第十四届 中国通信集成电路技术与应用研讨会 AETF 2016. 第二十二届 中国集成电路设计业2016年会暨长沙集成电路产业创新发展高峰论坛 ICCAD 2016. 第十四届 中国国际半导体博览会暨高峰论坛 IC CHINA 2016. 版权所有 北京亚龙鼎芯广告有限公司 上海芯媒会务服务有限公司 上海亚讯商务咨询有限公司 投稿邮件: luodan@cicmag.com. 电话:010 64372248，021-64280672 传真 010-64372248，021-64692062.
IC Assembly & Test
http://www.equipic.com/about/ic-assembly-test
Equip IC Supply Chain. Turnkey ASIC Services for Fabless Semiconductor Companies and ‘System Houses’. IC Assembly & Test. News & Events. IC Assembly & Test. Assembly and Test Services:. Provides test, sort, reliability tests, assembly and bumping services. Are our preferred test houses, experienced in developing test programs and testing our customers’ ASICs. And other assembly houses are our selected partners for packaging our customers’ ICs. We are able to offer QFP, QFN and BGA bonding type packag...
IMAPS - ATW on Automotive Microelectronics and Packaging 2015
http://www.imaps.org/automotive
Session Chair Manual (PDF). Journal of Micro and Elect Pkg. 4th Advanced Technology Workshop and Tabletop Exhibition on. Automotive Microelectronics and Packaging. The Dearborn Inn, A Marriott Hotel. Dearborn, Michigan 48124 - USA. June 3-4, 2015. All photos courtesy of Heraeus. Kyocera America, Inc. Thank you to our Premier Sponsors:. And Thanks to our Media Sponsor:. Wednesday, June 3. Registration: 7:00 am - 6:00 pm. Continental Breakfast: 7:00 am - 8:00 am. Welcome and Introduction: 8:00 - 8:15 am.
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Advocatenkantoor Koopman Alkmaar, ontslagvergoeding Alkmaar, arbeidsconflict Alkmaar, arbeidsrecht Alkmaar, ontslag op staande voet Alkmaar, arbeidsgeschil Alkmaar
Tel 072 541 10 70. Fax 072 541 10 71. SPECIALISTEN IN ARBEIDSRECHT EN INCASSO. Advocatenkantoor Koopman in Alkmaar is een algemeen advocatenkantoor gericht op ondernemers uit het midden- en kleinbedrijf en particulieren. Advocatenkantoor Koopman combineert jarenlange ervaring in adviezen aan zelfstandig ondernemers en particulieren met een scherp zakelijk inzicht. Kortom: we spreken de taal van de ondernemer. Nieuwe wet kan leiden tot …. De Wet Werk en Zekerheid die begin juli van kracht wordt, kan ervoo...
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AMK Offset Printer
Welcome to AMK Offset Printer. AMK Offset Printer can help with a multitude of issues regarding today’s Heatset Web Offset printing machines. AMK Offset Printer specializes in helping customers resolve print, tension, cutoff, and folding issues concerning modern high-speed Heatset Web Offset printing. Our goal is to help the customer get the quality and speeds out of their machines that will allow them to compete in today's market. Click on Individual Pictures to Display Larger Image.
Amkor Technology Korea
Amkor Technology: Semiconductor IC Test | Wafer Level Packaging | Wafer Probe | Wafer Bumping | Flip Chip | RF Design | RF Test
Industry demands for higher levels of integration and lower costs coupled with a growing awareness of complete system configuration have continued to drive the popularity of System in Package solutions. Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. With more than 1 billion SiP devices assembled and tested over more than 10 years, Amkor Technology has a proven track record as the industry leader in SiP assembly technology. Amkor Technology to...
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Chladící zařízení, vitríny, pokladní boxy, vstupní systémy, gastro | AMKOR
Amkor - chladící technika, gastro. Amkor - certifikát ISO 9001. V sortimentu chladících zařízení naleznete veškeré vybavení pro prodejny potravin, řeznictví, cukrárny, restaurace a další gastronomické provozovny, kde je nutné uchovávat větší množství potravin nebo surovin, které vyžadují regulovaný a kontrolovaný teplotní režim. Pro více informací volejte nebo piště! 420 558 350 431. Zajímá Vás náš sortiment? Prohlédněte si infromace o produktech, které nabízíme. AMKOR Trading spol. s r. o. Snahou naší f...
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