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Jordan Valley Semiconductors (JVS) develops, serves, manufactures and sells X-ray and VUV metrology solutions (XRF, XRR, XRD, WAXRD,HRXRD,SAXS & VUV) to semiconductors manufacturers, such as logic (IDM and foundries)and memory (DRAM, Flash) fabs as well as hard disk drives, HBLED fabs and other compound semiconductors and related fields. Our metrology tools cover front end of the line (FEOL - SiGe, HiK, Metal gate), back end of the line (BEOL - Copper Seed Barrier, Tungsten and Aluminum) wafer level pack

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Jordan Valley Semiconductors UK Limited

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Jordan Valley Semiconductors UK Limited

Graeme Gibson

Belmont●●●●●●●ss Park

Du●●am , County Durham, DH1 1TW

GB

44.01●●●●●24700
gr●●●●●●●●●●●@jvsemi.co.uk

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Jordan Valley Semiconductors (JVS) develops, serves, manufactures and sells X-ray and VUV metrology solutions (XRF, XRR, XRD, WAXRD,HRXRD,SAXS & VUV) to semiconductors manufacturers, such as logic (IDM and foundries)and memory (DRAM, Flash) fabs as well as hard disk drives, HBLED fabs and other compound semiconductors and related fields. Our metrology tools cover front end of the line (FEOL - SiGe, HiK, Metal gate), back end of the line (BEOL - Copper Seed Barrier, Tungsten and Aluminum) wafer level pack
<META>
KEYWORDS
1 X-ray
2 Metrology
3 X-ray metrology
4 Spectrometry
5 Semiconductor
6 silicon
7 Compound semiconductors
8 XRR
9 XRF
10 XRD
CONTENT
Page content here
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PAGE
semiconductors,jvsensus,compound,d1 evolution,delta x,qc velox,qc rt,qc tt,rads software,request info,applications,wafer level packaging,semiconductors feol,strain metrology,silicides,defect imaging,semiconductor beol,cu seed barrier,cu microstructure
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Home | bedex-ray.com Reviews

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Jordan Valley Semiconductors (JVS) develops, serves, manufactures and sells X-ray and VUV metrology solutions (XRF, XRR, XRD, WAXRD,HRXRD,SAXS & VUV) to semiconductors manufacturers, such as logic (IDM and foundries)and memory (DRAM, Flash) fabs as well as hard disk drives, HBLED fabs and other compound semiconductors and related fields. Our metrology tools cover front end of the line (FEOL - SiGe, HiK, Metal gate), back end of the line (BEOL - Copper Seed Barrier, Tungsten and Aluminum) wafer level pack

INTERNAL PAGES

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1

Request Info

http://www.bedex-ray.com/products/request-info

UBM, RDL and Micro Bumps. High-Resolution XRD for LED and Thin-Films Process Control. Triple Axis and RSM. MRAM, GMR and HDD. Please let us know which information you would like us to send you (such as brochures, quotation, software demo, etc). Please let us know your name. We require your email address to send you the information you requested. Not required, but if you would like us to call you please leave your number. Please let us know your message. Please enter the code shown.

2

JVX6200iF Galaxy

http://www.bedex-ray.com/products/semiconductors/jvx6200if-galaxy

UBM, RDL and Micro Bumps. High-Resolution XRD for LED and Thin-Films Process Control. Triple Axis and RSM. MRAM, GMR and HDD. The JVX6200iF Galaxy Production-line proven X-ray metrology platform for μ-bump Sn/Ag composition. Micro spot XRF for Wafer Level Packaging metrology. Thickness, elemental analysis and composition of thin and thick metal layers for the FEOL, BEOL and WLP. High brightness XRF source with high efficiency detector Si(Li) for heavy metals (Sn, Ag etc). Μ-bumps ( 20µm) Sn-Ag composition.

3

QC-RT

http://www.bedex-ray.com/products/compound/qc-rt

UBM, RDL and Micro Bumps. High-Resolution XRD for LED and Thin-Films Process Control. Triple Axis and RSM. MRAM, GMR and HDD. X-Ray Diffraction Imaging (XRDI) reflection inspection system that detects crystalline defects in patterned and blanket wafers. Identify defects on wafers during manufacture without dislocation etching. Identify defects on substrate surfaces and epilayers. Patented, fully digital reflection topography system. Can mount part 450mm wafers. Unique edge exclusion zone monitoring.

4

D1 Evolution

http://www.bedex-ray.com/products/compound/d1-evolution

UBM, RDL and Micro Bumps. High-Resolution XRD for LED and Thin-Films Process Control. Triple Axis and RSM. MRAM, GMR and HDD. Jordan Valley’s D1 Evolution is the latest generation of flexible X-ray diffraction instruments for thin-film materials research, process development, and quality control. High intensity with high resolution. Automation of sample alignment, measurement and analysis. Works with leading edge analysis software ( RADS. Supports wide range of thin film applications:. The D1 Evolution c...

5

QC-TT

http://www.bedex-ray.com/products/compound/qc-tt

UBM, RDL and Micro Bumps. High-Resolution XRD for LED and Thin-Films Process Control. Triple Axis and RSM. MRAM, GMR and HDD. X-Ray Diffraction Imaging (XRDI) inspection system that detects crystalline defects in patterned and blanket wafers. Identify cracks which will cause breakage BEFORE the breakage occurs. Detect slip, which may cause overlay issues, on 300mm wafers in minutes. Identify dislocations on wafers during manufacture without dislocation etching. Can mount part 450mm wafers.

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UBM, RDL and Micro Bumps. High-Resolution XRD for LED and Thin-Films Process Control. Triple Axis and RSM. MRAM, GMR and HDD. Leading Equipment Manufacturer Selects JVX7300RF-W for Process Develop…. Multiple Foundries in Asia Select JVX7300HR X-ray Metrology Tool. Leading HDD Manufacturer Adopts Jordan Valley's JVX7300RF (XRR&XRF…. AIXTRON, Inc. Selects Jordan Valley QC3 for Advanced MOCVD Process Met…. JVS Wins More Market Share in Advanced Wafer Level Packaging. Repeat Orders for Sub-20nm JVX7300HR.

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