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5G: Plunging into open-ended test requirements. Mobile broadband technology is beginning to crawl from commonly known 4th Generation Wireless (4G) transmission standards to fifth generation wireless IMT2020 standardization, also known as 5G. This 5G network technology will influence semiconductor test in two directions, an evolutionary track and a revolutionary paradigm shift. September 21, 2016. Is a final test solution for WLCSP devices needed? June 22, 2016. May 3, 2016. April 19, 2016. Today, everybo...

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5G: Plunging into open-ended test requirements. Mobile broadband technology is beginning to crawl from commonly known 4th Generation Wireless (4G) transmission standards to fifth generation wireless IMT2020 standardization, also known as 5G. This 5G network technology will influence semiconductor test in two directions, an evolutionary track and a revolutionary paradigm shift. September 21, 2016. Is a final test solution for WLCSP devices needed? June 22, 2016. May 3, 2016. April 19, 2016. Today, everybo...
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Welcome to the Xcerra Blog - Xcerra Blog | blog.xcerra.com Reviews

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5G: Plunging into open-ended test requirements. Mobile broadband technology is beginning to crawl from commonly known 4th Generation Wireless (4G) transmission standards to fifth generation wireless IMT2020 standardization, also known as 5G. This 5G network technology will influence semiconductor test in two directions, an evolutionary track and a revolutionary paradigm shift. September 21, 2016. Is a final test solution for WLCSP devices needed? June 22, 2016. May 3, 2016. April 19, 2016. Today, everybo...

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1

5G semiconductor test

http://blog.xcerra.com/5g-plunging-open-ended-test-requirements

5G: Plunging into open-ended test requirements. September 21, 2016. R&D activities in studies beyond 6GHz frequency bands have been restrained because of the mmWave characteristics of limited transmission and wavelength. Studies on standards beyond 6GHz have lived in academia and the military but had limited consumer application. With limited consumer application there was not a great wave of interest in 5G as an acceptable standard. So, what has changed? What role do you see OTA testing playing?

2

ATE Archives - Xcerra Blog

http://blog.xcerra.com/tag/ate

Semiconductor ATE – Part 3: The Future. Think different. January 15, 2013. This posting is the third and final post in a series of three articles and reflects no one’s opinion but my own! Http:/ blog.xcerra.com/wp-content/uploads/2015/07/nighthawkct logo white denmark-resized-600.png. Http:/ blog.xcerra.com/wp-content/uploads/2015/08/logo-xcerra1.png. Semiconductor ATE - Part 3: The Future. Think different. Semiconductor ATE – Part 2: Where LTXC leads, others typically follow. January 10, 2013.

3

IPC Standards for Electronics Manufacturing

http://blog.xcerra.com/ipc-standards-electronics-manufacturing

IPC Standards for Electronics Manufacturing. August 1, 2015. IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards ensures manufacturer, customers and suppliers use the same terminology. The standards for Printed Circuit Boards are categorized into chapters about. High Speed / High Frequency. IPC provides a graphical overview about all these. Download the IPC poster here. IPC Standards for Electronics Manufacturing.

4

Semicon Europa 2016 Call for Papers is Open

http://blog.xcerra.com/semicon-europa-2016-call-papers-open

Semicon Europa 2016 Call for Papers is Open. March 8, 2016. Semicon Europa returns to Grenoble, France this year from Oct 25 27 and you are invited to respond to the Call for Papers for the technical sessions and presentations. Technical presentation abstracts are due April 29. How will the latest generation of Advanced Packages be reliably handled and tested in high volume manufacturing? Http:/ blog.xcerra.com/wp-content/uploads/2016/03/semicon-europa-2016.png. Http:/ blog.xcerra.com/wp-content/...Feel ...

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PCB Test Archives - Xcerra Blog

http://blog.xcerra.com/category/pcb-test

Blog posts related to PCB test. Embedded Components in “Bare” Boards. May 3, 2016. Today some of the bare board manufacturers have to produce and test new designs with embedded components on a daily basis. The resulting challenge of a de-facto in-circuit test on what once was a bare board is solved successfully by closely cooperating with both their customers and test equipment manufacturer. This type of cooperation will become even more important with future increases in complexity. August 1, 2015.

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Leading Electrical Test Solutions

http://xcerra.com/bareboard

David G. Tacelli President and CEO. Mark J. Gallenberger Senior Vice President, Chief Operating Officer, Chief Financial Officer. Pascal Rondé Senior Vice President, Global Customer Team. Atg Luther & Maelzer. News & Events. IEEE European Test Symposium. GSA European Executive Forum. Contact & Support. Events & Presentations. PCB Test Solutions – Bare Board. Leading electrical test solutions for the PCB industry for. Remowed for speed, accuracy, versatility and ease of use. For rigid and flexible boards.

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Expanding the Limits of Test

http://xcerra.com/probes

David G. Tacelli President and CEO. Mark J. Gallenberger Senior Vice President, Chief Operating Officer, Chief Financial Officer. Pascal Rondé Senior Vice President, Global Customer Team. Atg Luther & Maelzer. News & Events. IEEE European Test Symposium. GSA European Executive Forum. Contact & Support. Events & Presentations. Expanding the limits of test. For in-circuit test and functional test, OEM and industrial. Higher quality, longer life, and better performance. ICT / FCT probe. The ICT/FCT product ...

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Experienced Leadership - Board of Directors

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David G. Tacelli President and CEO. Mark J. Gallenberger Senior Vice President, Chief Operating Officer, Chief Financial Officer. Pascal Rondé Senior Vice President, Global Customer Team. Atg Luther & Maelzer. News & Events. IEEE European Test Symposium. GSA European Executive Forum. Contact & Support. Events & Presentations. Experienced Leadership – Board of Directors. Roger W. Blethen. David G. Tacelli. Mark S. Ain. Roger J. Maggs. Bruce R. Wright. David G. Tacelli – President and CEO.

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Turnkey Solutions from the Only Global Provider

http://xcerra.com/pcba

David G. Tacelli President and CEO. Mark J. Gallenberger Senior Vice President, Chief Operating Officer, Chief Financial Officer. Pascal Rondé Senior Vice President, Global Customer Team. Atg Luther & Maelzer. News & Events. IEEE European Test Symposium. GSA European Executive Forum. Contact & Support. Events & Presentations. Turnkey solutions from the only global provider. Globally positioned engineering and manufacturing sites. Setting standards for board level manufacturing test. Tilt for low cost ICT.

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Flexible Interconnect Solutions

http://xcerra.com/connectors

David G. Tacelli President and CEO. Mark J. Gallenberger Senior Vice President, Chief Operating Officer, Chief Financial Officer. Pascal Rondé Senior Vice President, Global Customer Team. Atg Luther & Maelzer. News & Events. IEEE European Test Symposium. GSA European Executive Forum. Contact & Support. Events & Presentations. Superior durability in high life cycle applications. Widest range of applications. Well established in major markets:. Test & measurement. Contact & Support.

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Xcerra - Values

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David G. Tacelli President and CEO. Mark J. Gallenberger Senior Vice President, Chief Operating Officer, Chief Financial Officer. Pascal Rondé Senior Vice President, Global Customer Team. Atg Luther & Maelzer. News & Events. IEEE European Test Symposium. GSA European Executive Forum. Contact & Support. Events & Presentations. Taking care of the customers, the employees and the company. Be committed to great product, service, and other initiatives. Innovation, Creativity and Flexibility.

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Affordable and reliable products

http://xcerra.com/corporation

David G. Tacelli President and CEO. Mark J. Gallenberger Senior Vice President, Chief Operating Officer, Chief Financial Officer. Pascal Rondé Senior Vice President, Global Customer Team. Atg Luther & Maelzer. News & Events. IEEE European Test Symposium. GSA European Executive Forum. Contact & Support. Events & Presentations. Enabling our customers to win with affordable and reliable products. Handling, contacting and measurement solutions. Innovative and cost effective products. Xcerra Corporation was f...

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Leading Bare Board PCB Test Solution

http://xcerra.com/atg

David G. Tacelli President and CEO. Mark J. Gallenberger Senior Vice President, Chief Operating Officer, Chief Financial Officer. Pascal Rondé Senior Vice President, Global Customer Team. Atg Luther & Maelzer. News & Events. IEEE European Test Symposium. GSA European Executive Forum. Contact & Support. Events & Presentations. Atg Luther & Maelzer. Leading Bare Board PCB Test Solutions. From prototyping to HVM. Renowned for speed, accuracy, versatility and ease of use. Visit www.atg-LM.com.

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Semiconductor Test

http://xcerra.com/semiconductors

David G. Tacelli President and CEO. Mark J. Gallenberger Senior Vice President, Chief Operating Officer, Chief Financial Officer. Pascal Rondé Senior Vice President, Global Customer Team. Atg Luther & Maelzer. News & Events. IEEE European Test Symposium. GSA European Executive Forum. Contact & Support. Events & Presentations. Most comprehensive test solution for the semiconductor industry. Integrated test cell solutions. Semiconductor Test – ATE. Read more about LTX-Credence Tester. With all the critical...

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Deep and Broad Expertise

http://xcerra.com/advantage

David G. Tacelli President and CEO. Mark J. Gallenberger Senior Vice President, Chief Operating Officer, Chief Financial Officer. Pascal Rondé Senior Vice President, Global Customer Team. Atg Luther & Maelzer. News & Events. IEEE European Test Symposium. GSA European Executive Forum. Contact & Support. Events & Presentations. Xcerra brings together a deep and broad expertise in test solutions for the electronics industry. Optimizing the overall test cell. Shortening time to high-volume production. Mark J...

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Welcome to the Xcerra Blog - Xcerra Blog

5G: Plunging into open-ended test requirements. Mobile broadband technology is beginning to crawl from commonly known 4th Generation Wireless (4G) transmission standards to fifth generation wireless IMT2020 standardization, also known as 5G. This 5G network technology will influence semiconductor test in two directions, an evolutionary track and a revolutionary paradigm shift. September 21, 2016. Is a final test solution for WLCSP devices needed? June 22, 2016. May 3, 2016. April 19, 2016. Today, everybo...

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xcharms | Happy Magic to the Children

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