Die Attach and Wire Bonding Automation Experts By automating every step of the IC assembly process we work to increase reliability and drive costs down. Production Process Management For each new product, we extend our stringent, ISO 9001 documented process to cover any new requirements and to ensure we build the products in the most … Continue reading "Home"
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Colorado Microcircuits, Inc.
Hal Chase
6650 Ha●●●●●●● Avenue
Lov●●●and , CO, 80538
UNITED STATES
View this contact
Colorado Microcircuits, Inc.
Hal Chase
6650 Ha●●●●●●● Avenue
Lov●●●and , CO, 80538
UNITED STATES
View this contact
Colorado Microcircuits, Inc.
Elton Bingham
6650 Ha●●●●●●● Avenue
Lov●●●and , CO, 80538
UNITED STATES
View this contact
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Home - Colorado Microcircuits | coloradomicrocircuits.com Reviews
https://coloradomicrocircuits.com
Die Attach and Wire Bonding Automation Experts By automating every step of the IC assembly process we work to increase reliability and drive costs down. Production Process Management For each new product, we extend our stringent, ISO 9001 documented process to cover any new requirements and to ensure we build the products in the most … Continue reading "Home"
coloradomicrocircuits.com
IC Packages
http://www.coloradomicrocircuits.com/index.php/ic-packages.html
How We Do It. High Frequency Custom Laminates. Lower upfront costs allow for each IC to have its own custom tuned package. Utilizes a cavity lid so nothing touches the surface of the IC. Leadframe Air Cavity Packages. Heat dissipation of leadframe with the frequency performance of an Air Cavity. Other sizes to be announced. High Power Flange Package Assembly. Ball and Wedge bonding. Wirebonding and Die Bonding. 2012 ı Colorado Microcircuits ı 6550 North Harrison Avenue, Loveland, CO 80538.
How We Do It
http://www.coloradomicrocircuits.com/index.php/how-we-do-it.html
How We Do It. How We Do It. Manage production flow and capital investments based on the "Theory of Constraints". The performance of any real system is limited by its constraints.". Can-do attitude. We excel at developing high-volume processes others say cannot (will not) be done. Creative risk sharing relationships with customers. Subcontract functions to experts when appropriate. Don't add costs (overhead) for functions that don't add value to the customer. US based engineering and manufacturing.
Wirebonding & Die Bonding
http://www.coloradomicrocircuits.com/index.php/wirebonding-a-die-bonding.html
How We Do It. Wirebonding and Die Bonding. By automating every step of the IC assembly process we work to increase reliability and drive costs down. For each new product, we extend our stringent, ISO 9001 documented process to cover any new requirements and to ensure we build the products in the most efficient way. High quality and extremely high yield rates are a natural outcome of our manufacturing process. Wirebonding and Die Bonding.
What We Do
http://www.coloradomicrocircuits.com/index.php/what-we-do.html
How We Do It. By automating every step of the IC assembly process we work to increase reliability and drive costs down. For each new product, we extend our stringent, ISO 9001 documented process to cover any new requirements and to ensure we build the products in the most efficient way. High quality and extremely high yield rates are a natural outcome of our manufacturing process. Wirebonding and Die Bonding. 2012 ı Colorado Microcircuits ı 6550 North Harrison Avenue, Loveland, CO 80538.
IC Assembly
http://www.coloradomicrocircuits.com/index.php/ic-assembly.html
How We Do It. A distinctive mix of Electrical, Mechanical, Chemical and Process Engineers will assist with selection of the right package, the right epoxies, and when necessary, development of a custom packages for specific needs. Our goal is to be your manufacturing partner, working directly with you to maximize circuit performance at the lowest possible cost, and to provide a seamless interface into manufacturing. Wirebonding and Die Bonding.
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IC Assembly services for open cavity QFN packages. List of 50 IC prototype packaging and IC assembly companies world wide with services and equipment to assemble open cavity IC packages. Microelectronic assembly, microelectronic pkg, microelectronic packag
http://www.mirrorsemi.com/assembly.html
Die attach, wirebonding and assembly services are available from:. 632 W 24th Street. Tempe, AZ 85282. Liverpool, NY 13090. 6541 Via Del Oro. San Jose, CA 95119. Colorado Springs, CO 80919. 1400 S. Sherman Street. Richardson, TX 75081. 6650 N. Harrison Ave. Loveland, CO 980538. Milpitas, CA 95035. 3845 E. Miraloma Ave, Suite-B. Anaheim, CA 92806. York, PA 17402. 3401 W. Warren Avenue. Fremont, CA 94538. 14930 TI Blvd #100. Dallas, TX 75243. 1141 N. Cosby Way, Unit G. Anaheim, CA 92806. Nashua, NH 03063.
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Home - Colorado Microcircuits
Low Cost - High Volume - Fully Automated. By automating every step on the IC assembly process. We work to increase reliability and drive costs down. Die Attach and Wire Bonding. By automating every step of the IC assembly process we work to increase reliability and drive costs down. Off-The-Shelf Co-fired Ceramic QFN. Low cost, air cavity packages. Custom Co-Fired Ceramic QFN. Custom Co-fired Ceramic QFN. From simple metal changes to full custom packages. Air Cavity Plastic QFN. We have the right people,...
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