curamik.com

curamik® ADVANTAGE - Features to customize your substrates

Explore a new dimension of usability. Features to customize your substrates for. Ni and NiAu Plating. Individual code content allows full traceability for the entire power module supply chain. Ni and NiAu Plating. Increases wettability of substrate surface. Protects surface from oxidation. Two different copper levels build cavities and steps. Allows double sided cooling and enables smaller modules. Chemical or mechanical treatments offer lower roughness for advanced bonding and joining technologies.

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curamik® ADVANTAGE - Features to customize your substrates | curamik.com Reviews

<META> DESCRIPTION

Explore a new dimension of usability. Features to customize your substrates for. Ni and NiAu Plating. Individual code content allows full traceability for the entire power module supply chain. Ni and NiAu Plating. Increases wettability of substrate surface. Protects surface from oxidation. Two different copper levels build cavities and steps. Allows double sided cooling and enables smaller modules. Chemical or mechanical treatments offer lower roughness for advanced bonding and joining technologies.

<META> KEYWORDS

1 curamik advantage

2 features to customize

3 your substrates

4 advanced reliability

5 smaller modules

6 enhanced traceability

7 superior workability

8 greater usability

9 easy mounting

10 better protection

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curamik advantage,features to customize,your substrates,advanced reliability,smaller modules,enhanced traceability,superior workability,greater usability,easy mounting,better protection,improved quality,data matrix code,explore,step etching,solder stop

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curamik® ADVANTAGE - Features to customize your substrates | curamik.com Reviews

https://curamik.com

Explore a new dimension of usability. Features to customize your substrates for. Ni and NiAu Plating. Individual code content allows full traceability for the entire power module supply chain. Ni and NiAu Plating. Increases wettability of substrate surface. Protects surface from oxidation. Two different copper levels build cavities and steps. Allows double sided cooling and enables smaller modules. Chemical or mechanical treatments offer lower roughness for advanced bonding and joining technologies.

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curamik.com

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Innovation: curamik® Performance

http://www.curamik.com/innovation.aspx

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Reliability: curamik® Thermal

http://www.curamik.com/reliability.aspx

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Power: curamik® CoolPerformance

http://www.curamik.com/power.aspx

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Name, Vorname *. CFX Berlin Software GmbH. Wo geht es hin? Benötigen Sie individuelle Beratung? Warum CFX Berlin und ANSYS-Produkte? Strömungsmechanik mit ANSYS CFD. Wir liefern Ihnen leistungsstarke und auf ANSYS-Software abgestimmte Arbeitsplatzlösungen, welche sich insbesondere durch ihre Geräuscharmut auszeichnen und dabei trotzdem extrem performant arbeiten. Schulungen and individuelle Beratung. Coaching für ANSYS-Nutzer via WebMeeting. Simulation, Messung and Optimierung im Auftrag. CFX Berlin unte...

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formstyles.de | Referenzen

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Die Liste deren, die auf unsere Arbeit vertrauen, wächst von Tag zu Tag und zeugt davon, dass Kundenorientierung unser oberstes Gebot ist.

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http://www.padar.it/Mappa.aspx

Nastro conduttivo per interconnessione celle. Prodotti DBC (Direct Bonded Copper). Materiali compositi in AlSiC per gestione calore. Terminali - Stampaggio di precisione. Materiali per Thick-Film e Tape Ceramici. Wafer Level Packaging Equipments. Monitor LCD e Touch Screen. Wafer Level Manufacturing Services. Sviluppo e Prototipazione Circuiti Integrati. Consulenza Tecnica e Ingegnerizzazione. Terminali - Stampaggio di precisione. Materiali compositi in AlSiC per gestione calore. Padar Tecnonergie - Roma...

padar.it

PADAR TECNOENERGIE

http://www.padar.it/contenuto.aspx?idMenu2=8

Nastro conduttivo per interconnessione celle. Prodotti DBC (Direct Bonded Copper). Materiali compositi in AlSiC per gestione calore. Terminali - Stampaggio di precisione. Materiali per Thick-Film e Tape Ceramici. Wafer Level Packaging Equipments. Monitor LCD e Touch Screen. Wafer Level Manufacturing Services. Sviluppo e Prototipazione Circuiti Integrati. Consulenza Tecnica e Ingegnerizzazione. Terminali - Stampaggio di precisione. Materiali compositi in AlSiC per gestione calore.

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http://www.padar.it/contenuto.aspx?idMenu2=7

Nastro conduttivo per interconnessione celle. Prodotti DBC (Direct Bonded Copper). Materiali compositi in AlSiC per gestione calore. Terminali - Stampaggio di precisione. Materiali per Thick-Film e Tape Ceramici. Wafer Level Packaging Equipments. Monitor LCD e Touch Screen. Wafer Level Manufacturing Services. Sviluppo e Prototipazione Circuiti Integrati. Consulenza Tecnica e Ingegnerizzazione. Terminali - Stampaggio di precisione. Materiali compositi in AlSiC per gestione calore.

bodospower.de

Bodo's Company Links

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John Coonrod of Rogers Corporation provides technical advice and information about RF/microwave materials: ROG Blog. EE Power is a digital publication focused on the power electronics industry. The publication features technical articles, design tips, and application notes from the industry’s leading power electronics engineers and application experts. www.eepower.com.

nanotest.eu

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Non-destructive analysis by IR thermography. Origin and scope of duties. Mission, vision, strategy. Thales Research and Technology France. Heraeus Materials Technology GmbH and Co KG. Dow Corning Electronics Europe. Mitsubishi Polyester Film GmbH. Conti Temic microelectronic GmbH. Chemnitzer Werkstoffmechanik GmbH (CWM). AMIC Angewandte Mikromesstechnik GmbH. EUCEMAN European Center for Micro- and Nanoreliability. BTU Cottbus - Senftenberg. Fraunhofer IKTS Branch Berlin. VDI/VDE Innovation Technik, Berlin.

padar.it

PADAR TECNOENERGIE

http://www.padar.it/Contatti.aspx

Nastro conduttivo per interconnessione celle. Prodotti DBC (Direct Bonded Copper). Materiali compositi in AlSiC per gestione calore. Terminali - Stampaggio di precisione. Materiali per Thick-Film e Tape Ceramici. Wafer Level Packaging Equipments. Monitor LCD e Touch Screen. Wafer Level Manufacturing Services. Sviluppo e Prototipazione Circuiti Integrati. Consulenza Tecnica e Ingegnerizzazione. Terminali - Stampaggio di precisione. Materiali compositi in AlSiC per gestione calore.

padar.it

PADAR TECNOENERGIE

http://www.padar.it/HomePageEn.aspx

Ribbon for Photovoltaic Cells Interconnection. Direct Bonded Copper (DBC) Products. AlSiC Composite Materials for Thermal Management. Leadframes - Specialised Stamping and Plating. Thick-Film Materials and Ceramic Tapes. Wafer Level Packaging Equipments. Wafer Level Manufacturing Services. Engineering and Prototyping of Integrated Circuits. Technical Consultancy and Engineering. Leadframes - Custom Stamping and Plating. AlSiC Composite Materials for Thermal Management. Direct Bonded Copper (DBC) Products.

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curamik® ADVANTAGE - Features to customize your substrates

Explore a new dimension of usability. Features to customize your substrates for. Ni and NiAu Plating. Individual code content allows full traceability for the entire power module supply chain. Ni and NiAu Plating. Increases wettability of substrate surface. Protects surface from oxidation. Two different copper levels build cavities and steps. Allows double sided cooling and enables smaller modules. Chemical or mechanical treatments offer lower roughness for advanced bonding and joining technologies.

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