electronics-cooling.com

Electronics Cooling | Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting. Blowers / Fans / Filters. Test & Measurement. Materials, Compounds, Adhesives, Substrates. Developing a Thetajc Standard Under Steady-State Testing Conditions. Use of the Monte Carlo Method in Packaging Thermal Calculations. Beat the Heat in 3D Chip Stacks with Embedded Cooling. By: Pritish R. Parida, Mark Schultz and Timothy Chainer J. Watson Research Center, Yorktown Heights NY, USA INTRODUCTION In the Moore’s L...THE 3...

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Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting. Blowers / Fans / Filters. Test & Measurement. Materials, Compounds, Adhesives, Substrates. Developing a Thetajc Standard Under Steady-State Testing Conditions. Use of the Monte Carlo Method in Packaging Thermal Calculations. Beat the Heat in 3D Chip Stacks with Embedded Cooling. By: Pritish R. Parida, Mark Schultz and Timothy Chainer J. Watson Research Center, Yorktown Heights NY, USA INTRODUCTION In the Moore’s L...THE 3...

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Electronics Cooling | Electronics Cooling | electronics-cooling.com Reviews

https://electronics-cooling.com

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting. Blowers / Fans / Filters. Test & Measurement. Materials, Compounds, Adhesives, Substrates. Developing a Thetajc Standard Under Steady-State Testing Conditions. Use of the Monte Carlo Method in Packaging Thermal Calculations. Beat the Heat in 3D Chip Stacks with Embedded Cooling. By: Pritish R. Parida, Mark Schultz and Timothy Chainer J. Watson Research Center, Yorktown Heights NY, USA INTRODUCTION In the Moore’s L...THE 3...

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electronics-cooling.com

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California Energy Code Updated; New Regulations for Cooling Data Centers « Electronics Cooling Magazine – Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

https://www.electronics-cooling.com/2015/07/california-energy-code-updated-new-regulations-for-cooling-data-centers

California Energy Code Updated; New Regulations for Cooling Data Centers. July 28th, 2015. Blowers / Fans / Filters. The California Energy Code. Also known Title 24 of the CA Code of Regulations part 6, has been revised. The new revision implements new regulations for cooling data centers and server rooms in order to improve efficiency, reduce daily operation costs, reduce carbon footprints, and simplify cooling models. The new Title 24 code requires either air-side economization (using outside air to co...

2

New Fan Offers Industry Leading Static Pressure « Electronics Cooling Magazine – Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

https://www.electronics-cooling.com/2015/07/new-fan-offers-industry-leading-static-pressure

New Fan Offers Industry Leading Static Pressure. July 27th, 2015. Blowers / Fans / Filters. Sanyo Denki introduces the San Ace 172 9HV type. Ø 172 x 150 x 51 mm high static pressure fan. The San Ace 172 9HV type offers industry leading static pressure, or 1.6 times the static pressure that similar sized fans offer. Product & industry news. New Fan Delivers High Static Pressure and Energy Reduction. Air-Inlet Grill Reduces Axial and Centrifugal Fan Noise. Fan and blower manufacturer ebm-papst has released...

3

Mentor Graphics at Semi-Therm 31 – ‘Dolly the Heatsink’ and much more « Electronics Cooling Magazine – Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

https://www.electronics-cooling.com/2015/03/mentor-graphics-at-semi-therm-31-dolly-the-heatsink-and-much-more

Mentor Graphics at Semi-Therm 31 – ‘Dolly the Heatsink’ and much more. March 2nd, 2015. Semi-Therm, the world’s largest dedicated electronics thermal conference, will take place between March 15-19 at the Doubletree Hotel in San Jose, California. Now in it’s 31st year, this IEEE sponsored conference maintains its high standards in peer reviewed papers covering a range of disciplines within the electronics cooling field. Robin Bornoff, John Parry. Simulations. The details of ‘ Dolly. Reliability predictio...

4

Thermal Challenges in Today’s Commercial and Military Aviation « Electronics Cooling Magazine – Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

https://www.electronics-cooling.com/2011/03/thermal-challenges-in-today’s-commercial-and-military-aviation/comment-page-1

Thermal Challenges in Today’s Commercial and Military Aviation. March 1st, 2011. By Peter de Bock. Figure 2. Historic and future on-board power provided by engines. Adapted from Gerstler and Bunker [3″]. Increased Electrification Leads to Thermal Challenges. Thermal management solutions have to be developed at different hierarchically coupled levels:. Application level thermal management of the avionics at the chip, board, and electronics frame, heat is rejected to the system level thermal management.

5

Modeling and Experimentation: Characterization of Hot Spot Dissipation in 3D Stacks « Electronics Cooling Magazine – Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

https://www.electronics-cooling.com/2012/06/modeling-and-experimentation-characterization-of-hot-spot-disspiation-in-3d-stacks

Modeling and Experimentation: Characterization of Hot Spot Dissipation in 3D Stacks. June 21st, 2012. By Vladimir O. Cherman. Thermal test vehicle for 3D stacks. Figure 3: Top: Schematic cross-section of the test vehicle. Bottom: (left) Picture of the 2-level PCB. (right) Detail of the cavity in the PCB containing the die stack to reveal the wirebond connections from the PCB to the top and bottom die of the 3D stack. Thermal comparison of 2D versus 3D integration. Thermal impact of TSVs. Figure 6: (a) Co...

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impact.asu.edu

Data center thermal management energy efficient taskscheduling placement

https://impact.asu.edu/DataCenter.htm

Thermal Management of Data Centers. Through Thermal-Aware Job Scheduling. Sandeep K. S. Gupta. The Future Is Now. 8220; Dynamic thermal management of the data center. 8211; Developed in conjunction with Arizona State University. Developed abstract heat flow model for data center and verified with CFD simulation. Developed thermal aware scheduling based on the abstract heat flow model and verified with CFD simulation. Published a paper on thermal aware scheduling for data centers in DASC 2006. Accepted to...

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Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting. Blowers / Fans / Filters. Test & Measurement. Materials, Compounds, Adhesives, Substrates. Developing a Thetajc Standard Under Steady-State Testing Conditions. Use of the Monte Carlo Method in Packaging Thermal Calculations. Beat the Heat in 3D Chip Stacks with Embedded Cooling. By: Pritish R. Parida, Mark Schultz and Timothy Chainer J. Watson Research Center, Yorktown Heights NY, USA INTRODUCTION In the Moore’s L...THE 3...

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