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Embedded Intel® Solutions: designing with Intel® Embedded ProcessorsComprehensive technology information for engineers and embedded developers who design with Intel® Embedded Processors
http://www.embeddedintel.com/
Comprehensive technology information for engineers and embedded developers who design with Intel® Embedded Processors
http://www.embeddedintel.com/
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Embedded Intel® Solutions: designing with Intel® Embedded Processors | embeddedintel.com Reviews
https://embeddedintel.com
Comprehensive technology information for engineers and embedded developers who design with Intel® Embedded Processors
embeddedintel.com
Embedded Intel® - GENIVI Alliance Opens (Car) Door Even Further with New Compliance 2.0 Spec
http://www.embeddedintel.com/standards_watch.php?article=2414
Satisfying the Industrial IoT's Demand for High Performance at the Edge. Satisfying the Industrial IoT's Demand for High Performance at the Edge. KNL FPGA, a Perfect Match for Deep Learning Acceleration. Aquantia Announces Industry's First SFP Line of Products Enabling Connectivity for 2.5, 5 and 10GBASE-T Networking. X-ES Intel Xeon D SBCs Now with Up to 16 Cores and Native Extended Temp. Support! Numecent's Cloudpaging Technology to be Featured at IDF. Small Becomes a Bigger Deal. Open Standar...
Embedded Intel® Solutions: designing with Intel® Embedded Processors
http://www.embeddedintel.com/archive_special_features.php
Satisfying the Industrial IoT's Demand for High Performance at the Edge. Satisfying the Industrial IoT's Demand for High Performance at the Edge. KNL FPGA, a Perfect Match for Deep Learning Acceleration. Aquantia Announces Industry's First SFP Line of Products Enabling Connectivity for 2.5, 5 and 10GBASE-T Networking. X-ES Intel Xeon D SBCs Now with Up to 16 Cores and Native Extended Temp. Support! Numecent's Cloudpaging Technology to be Featured at IDF. Small Becomes a Bigger Deal. Open Standar...
Embedded Intel® - conga-TS77
http://www.embeddedintel.com/solution_providers.php?article=2445
Satisfying the Industrial IoT's Demand for High Performance at the Edge. Satisfying the Industrial IoT's Demand for High Performance at the Edge. KNL FPGA, a Perfect Match for Deep Learning Acceleration. Aquantia Announces Industry's First SFP Line of Products Enabling Connectivity for 2.5, 5 and 10GBASE-T Networking. X-ES Intel Xeon D SBCs Now with Up to 16 Cores and Native Extended Temp. Support! Numecent's Cloudpaging Technology to be Featured at IDF. Small Becomes a Bigger Deal. Open Standar...
Embedded Intel® Solutions: designing with Intel® Embedded Processors
http://www.embeddedintel.com/archive_news.php
Satisfying the Industrial IoT's Demand for High Performance at the Edge. Satisfying the Industrial IoT's Demand for High Performance at the Edge. KNL FPGA, a Perfect Match for Deep Learning Acceleration. Aquantia Announces Industry's First SFP Line of Products Enabling Connectivity for 2.5, 5 and 10GBASE-T Networking. X-ES Intel Xeon D SBCs Now with Up to 16 Cores and Native Extended Temp. Support! Numecent's Cloudpaging Technology to be Featured at IDF. Small Becomes a Bigger Deal. Open Standar...
Embedded Intel® Solutions: designing with Intel® Embedded Processors
http://www.embeddedintel.com/china/index.html
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Viva la Evolution | Transportation Systems
http://eecatalog.com/transportation/2011/06/02/viva-la-evolution
Download the latest issue of the Engineers' Guide to Transportation Systems. And subscribe to receive future issues and the quarterly email newsletter. ACCES I/O Products, Inc. ADL Embedded Solutions Inc. Advanced Micro Peripherals Inc. Advantech Co., Ltd. Advantech Co., Ltd. Advantest America, Inc. (ATE). Aitech Defense Systems Inc. Apache Design, an ANSYS subsidiary. ARBOR Solution, Inc. CES - Creative Electronic Systems SA. Clarion Corporation of America. Critical Link, LLC. ESOL Co., Ltd. OEMs have s...
USB: Engineering resource for implementing USB connectivity
http://eecatalog.com/usb
Download the latest issue of the Engineers’ Guide to USB Technologies. And subscribe to receive future issues and the quarterly email newsletter. ACCES I/O Products, Inc. Advantech Co., Ltd. Aitech Defense Systems Inc. Ampro ADLINK Technology, Inc. Cadence Design Systems, Inc. E-con Systems, Inc. Embedded Computing, Emerson Network Power. Express Logic, Inc. Fujitsu Microelectronics America, Inc. Future Technology Devices International Limited (USA). IPC - Association Connecting Electronics Industries.
Subscribe | EE Catalog
http://eecatalog.com/subscribe
Download the latest issue of the Engineers’ Guide to PC/104 and Embedded Small Form Factors. And subscribe to receive future issues and the quarterly email newsletter. Arrow Electronics, Inc. Absolute Analysis, Inc. ACCES I/O Products, Inc. Acoustic Technologies, Inc. Actions Semiconductor Co., Ltd. Adaptive Digital Technologies, Inc. ADL Embedded Solutions Inc. ADVA AG Optical Networking. Advanced Micro-Fabrication Equipment Inc. Advanced Micro Peripherals Inc. Advantech Co., Ltd. Advantech Co., Ltd.
embeddedsystemsengineering | EE Catalog
http://eecatalog.com/embeddedsystemsengineering
Download the latest issue of the Engineers’ Guide to PC/104 and Embedded Small Form Factors. And subscribe to receive future issues and the quarterly email newsletter. Arrow Electronics, Inc. Absolute Analysis, Inc. ACCES I/O Products, Inc. Acoustic Technologies, Inc. Actions Semiconductor Co., Ltd. Adaptive Digital Technologies, Inc. ADL Embedded Solutions Inc. ADVA AG Optical Networking. Advanced Micro-Fabrication Equipment Inc. Advanced Micro Peripherals Inc. Advantech Co., Ltd. Advantech Co., Ltd.
Toshiba develops world’s first 16-die stacked NAND flash memory with TSV tech | Solid State Technology
http://electroiq.com/blog/2015/08/toshiba-develops-worlds-first-16-die-stacked-nand-flash-memory-with-tsv-tech
LED PACKAGING AND TESTING. Toshiba develops world’s first 16-die stacked NAND flash memory with TSV tech. Today announced the development of the world’s first 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015. To be held from August 11 to 13 in Santa Clara, USA. 16-die Stacked NAND Flash Memory with TSV Technology (Photo: Business Wire). The prior art of stacked NAND flash memories. Easily post a comment below u...
Materials and Equipment | Solid State Technology
http://electroiq.com/materials-and-equipment
LED PACKAGING AND TESTING. IFTLE 299 Siliconware's Ma Discusses Die Stacking Options for 2.5D. August 17, 2016. ASM’s Haukka ALD Award. August 01, 2016. Leveraging Reliability-Focused Foundry Rule Decks. July 27, 2016. July 18, 2016. Etch Abatement Needed at 200mm Fabs to Meet WSC Goals for 2020. July 13, 2016. Transition to ISO 9001:2015: Starting the Journey. October 21, 2015. MATERIALS AND EQUIPMENT ARTICLES. Advanced packaging: Hot topic at SEMICON Taiwan 2016. Worldwide semiconductor capital spendin...
3D Integration | Solid State Technology
http://electroiq.com/3d-integration
LED PACKAGING AND TESTING. IFTLE 299 Siliconware's Ma Discusses Die Stacking Options for 2.5D. August 17, 2016. ASM’s Haukka ALD Award. August 01, 2016. Leveraging Reliability-Focused Foundry Rule Decks. July 27, 2016. July 18, 2016. Etch Abatement Needed at 200mm Fabs to Meet WSC Goals for 2020. July 13, 2016. Transition to ISO 9001:2015: Starting the Journey. October 21, 2015. Will fan-out packaging be sustainable long-term? TowerJazz and SMIC’s sales forecast to surge in 2016. Fan-Out Wafer Level Pack...
Events | Solid State Technology
http://electroiq.com/event-listing
LED PACKAGING AND TESTING. SOLID STATE TECHNOLOGY EVENTS. The Semiconductor Manufacturing and Design Industry's Premier Annual Event. June 12-15, 2016. Encore at the Wynn Las Vegas. MEMS and Sensors Industry Group Conference Asia 2016. September 01, 2016 - September 30, 2016. European MEMS Summit 2016. September 15, 2016 - September 16, 2016. October 25, 2016 - October 27, 2016. MEMS Executive Congress 2016. November 09, 2016 - November 10, 2016. Please visit these other Extension Media. VME, VPX and VXS.
Technology Papers | Solid State Technology
http://electroiq.com/whitepapers
LED PACKAGING AND TESTING. New In-Line and Non-Destructive Hybrid Technology for Semiconductor Metrology. Sponsored by XwinSys Technology Development Ltd. Specialized Materials Meet Critical Packaging Needs in MEMS Devices. Sponsored by Master Bond, Inc.,. Protecting Electronics with Parylene. NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements. Sponsored by XwinSys Technology Development Ltd. Adhesives for Electronic Applications. Sponsored by Master Bond, Inc.,. Potting and encapsulation c...
Advertise | Solid State Technology
http://electroiq.com/advertise
LED PACKAGING AND TESTING. Solid State Technology and SemiMD. P: 978.580.4205. Solid State Technology is a global and trusted source of technology, product and market information that has served influential semiconductor manufacturing and packaging decision makers. Since 1958. Our coverage also includes electronics technologies and markets that emerge alongside the semiconductor industry. As markets such as MEMS, LEDs and displays. Our global and qualified audience of buyers is the largest and most diver...
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Embedded Insights - Shedding Light on the Hidden World of Embedded Systems
Question of the Week. Comprehensive, searchable list of parts, tools and third-party IP. Real-time updates for select processors and development tools. Hidden interfaces: a new playground for embedded innovations. Published March 15th, 2012. One Picture Is Worth a Thousand Words. Published April 18th, 2012. Unit test tools and automatic test generation. Published March 19th, 2012. By Mark Pitchford at LDRA. This article is part of our ongoing Voices of Industry. The Embedded Insights Lowdown. Is a free b...
embeddedinstinct.com - Registered at Namecheap.com
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Embedded Instruction
Embedded Instruction for Early Learning. Several studies and projects are currently being conducted. Please click on the links below to learn more. The Impact of Professional Development on Preschool Teachers’ Use of Embedded Instruction Practices (EI Goal 3). Embedded Instruction for Early Learning – California. Embedded Instruction for Early Learning International. Visit our partner sites. Visit the AZ CEECS Website.
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embeddedinstrumentcontrollers.com
Embedded Instrument Controllers - www.EmbeddedInstrumentControllers.com
Embedded Intel® Solutions: designing with Intel® Embedded Processors
ARD-037-N Bar-type Panel PC for Passenger Information System Application. Congatec powers Luxoft's modular next-gen automotive reference platform. Intel Ships Industry's First 58G PAM4-Capable FPGA Built for Multi-Terabit Network Infrastructure and NFV. Intel- Core™ / Celeron- 6th Generation Stackable SBC. Compact, Modular and Fanless Industrial PC. Welcome to Extension Media's site for Embedded Intel Solutions. What's New with PCI-SIG. Engineering Automated Driving Systems for Safety. Intel Xeo...
英特尔嵌入式专区-为使用英特尔嵌入式处理器的工程师提供解决方案和设计资料！
第五届 英特尔杯 全国大学生软件创新大赛 暨HTML5程序开发邀请赛圆满落幕. 英特尔携手软件开发者 拥抱 透明计算 时代. How to making A Multicore System Work? Where i can find the author? BoringLogic 一 无聊逻辑分析仪 更新至R01.
Embedded Intellect Website
Welcome to Embedded Intellect Pty Ltd. We are an Australian business currently providing Integrated Technical Solutions for local and international markets. Our focus is on developing and implementing systems to meet your specific business requirements, looking to leverage our broad range of technological skills to provide high value-adding products and services. Is a Trademark of Embedded Intellect Pty Limited. Dot Aussie is a Registered Trademark of DOT AU Pty Limited.
Embedded Intellect Website
Welcome to Embedded Intellect Pty Ltd. We are an Australian business currently providing Integrated Technical Solutions for local and international markets. Our focus is on developing and implementing systems to meet your specific business requirements, looking to leverage our broad range of technological skills to provide high value-adding products and services. Is a Trademark of Embedded Intellect Pty Limited. Dot Aussie is a Registered Trademark of DOT AU Pty Limited.
Embedded Intelligence, Inc
USB-CAN-01 network interface card. Single channel, galvanically isolated CAN interface. USB 20 high speed (480 Mbit/sec) interface. Integrated 100MHz, 32-bit processor. Supports CAN bit rates up to 1 Mb/sec. Message transmit and receive time stamping with 1 microsecond resolution. Driver support for Windows and Linux. CANview bus monitoring software including CANopen message decoding provided for Windows and Linux. Agency approvals: CE, FCC, RoHS. 245 - in stock. PCIe-CAN-02 network interface card. Drive...
Embeddedintelligence.org
