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EPTech - Electronics Packaging Technology - 电子封装技术专业

EPTech.hit.edu.cn. 电话 0451-86418725, 13936655095. 哈尔滨市南岗区西大直街92号材料楼828,310,311,329;科技园微纳中心414,416,418.

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EPTech - Electronics Packaging Technology - 电子封装技术专业 | eptech.hit.edu.cn Reviews
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EPTech.hit.edu.cn. 电话 0451-86418725, 13936655095. 哈尔滨市南岗区西大直街92号材料楼828,310,311,329;科技园微纳中心414,416,418.
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1 电子封装技术专业
2 lectronics p
3 ackaging tech
4 nology
5 教 职 员
6 研 究 生
7 本 科 生
8 研究内容
9 研究设施
10 论文一览
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电子封装技术专业,lectronics p,ackaging tech,nology,教 职 员,研 究 生,本 科 生,研究内容,研究设施,论文一览,发明专利,藏书一览,技术资料,news,重要通知,相关链接,工大新闻,图 书 馆,icept,电子学会,行业协会,led联盟,资料下载,english,微 连 接,威海校区,深 研 院,研究生院,教学管理,科研管理,邮件服务,财务查询,联系我们,welcome to eptech,电子封装是将微元件再加工及组合构成微系统及工作环境的制造技术,专业历史
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EPTech - Electronics Packaging Technology - 电子封装技术专业 | eptech.hit.edu.cn Reviews

https://eptech.hit.edu.cn

EPTech.hit.edu.cn. 电话 0451-86418725, 13936655095. 哈尔滨市南岗区西大直街92号材料楼828,310,311,329;科技园微纳中心414,416,418.

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1

EPTech - Electronics Packaging Technology - 电子封装技术专业

http://eptech.hit.edu.cn/EPTech/Default.asp

EPTech.hit.edu.cn. 电话 0451-86418725, 13936655095. 哈尔滨市南岗区西大直街92号材料楼828,310,311,329;科技园微纳中心414,416,418.

2

EPTech - Faculty - 电子封装技术专业

http://eptech.hit.edu.cn/EPTech/EPT_Staffer.asp

EPTech.hit.edu.cn. 王春青 wangcq@hit.edu.cn. 田艳红 tianyh@hit.edu.cn. 刘 威 w liu@hit.edu.cn. 安 荣 anr@hit.edu.cn. 杭春进 hangcj@hit.edu.cn. 王晨曦 wangcx@hit.edu.cn. 孔令超 konglc@hit.edu.cn. 张 威 zhangw@hit.edu.cn. 郑 振 zhangzhen@hit.edu.cn. 李明雨 myli@hit.edu.cn. 0755-26033073 chenht@hit.edu.cn. 0755-26033281 jhj7005@hit.edu.cn. 电话 0451-86418725, 13936655095. 哈尔滨市南岗区西大直街92号材料楼828,310,311,329;科技园微纳中心414,416,418.

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EPTech - History - 电子封装技术专业

http://eptech.hit.edu.cn/EPTech/EPT_History.html

EPTech.hit.edu.cn. 专业学术带头人王春青教授现任中国半导体行业协会封装分会副理事长 中国电子学会理事及封装分会副理事长、SMT咨询专家委员会副理事长 第六届电子封装技术国际学术会议(ICEPT 2005)组织委员会主席、ICEPT'07、ICEPT'08共同主席 信息产业2020年中长期规划专家组成员 广东省无铅电子制造技术部省产学研联盟学术委员会副主任。 电话 0451-86418725, 13936655095. 哈尔滨市南岗区西大直街92号材料楼828,310,311,329;科技园微纳中心414,416,418.

4

EPTech - Publiations - 电子封装技术专业

http://eptech.hit.edu.cn/EPTech/EPT_Thesis.html

EPTech.hit.edu.cn. SMALL 2015,DOI: 10.1002/smll.201500896. Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit. Ying Zhong , Rong An , Chunqing Wang , * Zhen Zheng , etc. Key words: high temperature interconnection; TEM; intermetallics; sintering; nanoparticles. 电话 0451-86418725, 13936655095. 哈尔滨市南岗区西大直街92号材料楼828,310,311,329;科技园微纳中心414,416,418. Chunqing Wang, Invited Speech. Chunqing Wang, Invited Speech. Chunqing Wang*, Ying Ding. Micro Behavior...

5

Microjoining Lab, Microelectronics_Packaging_Assembly_Microjoining_Bonding_Soldering_Reliability_Leadfree_Fluxless

http://eptech.hit.edu.cn/Micro/English/Index.asp

Micro Welding and Joining, Electronics Packaging, Interconnection. Harbin Institute of Technology. School of Materials Science and Engineering. Harbin Institute of Technology. 92 West Dazhi Street. Laboratory of Electronics Packaging. Microjoining Laboratory, HIT.

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EPTech - Electronics Packaging Technology - 电子封装技术专业

EPTech.hit.edu.cn. 电话 0451-86418725, 13936655095. 哈尔滨市南岗区西大直街92号材料楼828,310,311,329;科技园微纳中心414,416,418.

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