eu.finetech.de
BGA Rework | Flip Chip | Die Bonder SuppliersSupplier/Manufacturer of Flip Chip bonders, Die bonders, BGA / QFN / SMT rework stations, soldering equipment, smt rework and pick and place machines
http://eu.finetech.de/
Supplier/Manufacturer of Flip Chip bonders, Die bonders, BGA / QFN / SMT rework stations, soldering equipment, smt rework and pick and place machines
http://eu.finetech.de/
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BGA Rework | Flip Chip | Die Bonder Suppliers | eu.finetech.de Reviews
https://eu.finetech.de
Supplier/Manufacturer of Flip Chip bonders, Die bonders, BGA / QFN / SMT rework stations, soldering equipment, smt rework and pick and place machines
eu.finetech.de
FINEPLACER® sigma - Semi-automated Sub-Micron Bonder
http://eu.finetech.de/products/micro-assembly/fineplacerr-sigma.html
Production Platform, Maximum Yield. 05 micron, 300 mm wafer. Bonding forces up to 1000N. 300 mm wafer bonder. Flexible Sub-micron Die Bonder. Automated Flip Chip Bonder. Volumetric dispensing with high quality results. Platforms, Finetech develops highly customized equipment solutions according to specific application requirements. Proven technology where process reproducibility is critical. Proven technology where process reproducibility is critical. High Density Rework Station. Large field of view.
Trade Shows
http://eu.finetech.de/company/news-events/trade-shows.html?tx_ttnews[tt_news]=239&cHash=d756c5d1b50d80388903cc8647dec796
Production Platform, Maximum Yield. 05 micron, 300 mm wafer. Bonding forces up to 1000N. 300 mm wafer bonder. Flexible Sub-micron Die Bonder. Automated Flip Chip Bonder. Volumetric dispensing with high quality results. Platforms, Finetech develops highly customized equipment solutions according to specific application requirements. Proven technology where process reproducibility is critical. Proven technology where process reproducibility is critical. High Density Rework Station. Large field of view.
High Force ACF Bonder - Bonding forces up to 700 N with outstanding coplanarity
http://eu.finetech.de/products/micro-assembly/fineplacerr-pico-ma/fineplacerr-pico-ma-700n.html
Production Platform, Maximum Yield. 05 micron, 300 mm wafer. Bonding forces up to 1000N. 300 mm wafer bonder. Flexible Sub-micron Die Bonder. Automated Flip Chip Bonder. Volumetric dispensing with high quality results. Platforms, Finetech develops highly customized equipment solutions according to specific application requirements. Proven technology where process reproducibility is critical. Proven technology where process reproducibility is critical. High Density Rework Station. Large field of view.
Rework of BGA / CSP
http://eu.finetech.de/advanced-rework/applications/rework-of-bga-csp.html
Production Platform, Maximum Yield. 05 micron, 300 mm wafer. Bonding forces up to 1000N. 300 mm wafer bonder. Flexible Sub-micron Die Bonder. Automated Flip Chip Bonder. Volumetric dispensing with high quality results. Platforms, Finetech develops highly customized equipment solutions according to specific application requirements. Proven technology where process reproducibility is critical. Proven technology where process reproducibility is critical. High Density Rework Station. Large field of view.
FINEPLACER® pico ama - Automated Flip Chip Bonder
http://eu.finetech.de/products/micro-assembly/fineplacerr-pico-ama.html
Production Platform, Maximum Yield. 05 micron, 300 mm wafer. Bonding forces up to 1000N. 300 mm wafer bonder. Flexible Sub-micron Die Bonder. Automated Flip Chip Bonder. Volumetric dispensing with high quality results. Platforms, Finetech develops highly customized equipment solutions according to specific application requirements. Proven technology where process reproducibility is critical. Proven technology where process reproducibility is critical. High Density Rework Station. Large field of view.
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PIEK - IPC Training en Certificering
https://piek.international/nl
Schelsberg 111-113, 6413 AC, Heerlen, Netherlands. Phone: 31-(0)45 570 33 33. PIEK: Your knowledge provider for the electronics industry. Medical devices enter a new era. Do not miss out! IPC Certified Interconnect Designer. Hands-on practice using the latest equipment. Onze klanten en referenties. On-site training op uw locatie. Deelnemers Info Locatie Heerlen. Linken naar PIEK en Logo Bronnen. PIEK – IPC Training en Certificering. PIEK: Your knowledge provider for the electronics industry. Sinds kort b...
销售代表
http://www.finetech.asia/company/sales-and-service/salesrepresentatives.html
最大基板尺寸:460 x 310 mm. 最小的间距,最复杂的集成, 最大的阵列器件. RFID (Radio Frequency Identification)射频识别电子标签作为条形码的替代产品. 光学封装是主要组装，包括光学 透镜、棱镜、孔径、滤镜等 和电子部件 LD、PD、放大器、控制器等。 How to video: 3D-Stacking. How to video: Flipping. How to video: Manual Control. How to video: Sensor Assembly. 堆叠封装 PoP 是指纵向排列的逻辑和存储元件的集成电路封装形式, 它采用. 最大基板尺寸:460 x 310 mm. 最小的间距,最复杂的集成, 最大的阵列器件. Useful Enhancements for FINEPLACER. BGA reballing, preheating. How to - application video. How to - application video. Hong Kong SAR of China. 1 603 627 8989.
FINEPLACER® coreplus - 高效节能, 高性价比返修工作台
http://www.finetech.asia/products/advanced-rework/fineplacer-core-plus.html
最大基板尺寸:460 x 310 mm. 最小的间距,最复杂的集成, 最大的阵列器件. RFID (Radio Frequency Identification)射频识别电子标签作为条形码的替代产品. 光学封装是主要组装，包括光学 透镜、棱镜、孔径、滤镜等 和电子部件 LD、PD、放大器、控制器等。 How to video: 3D-Stacking. How to video: Flipping. How to video: Manual Control. How to video: Sensor Assembly. 堆叠封装 PoP 是指纵向排列的逻辑和存储元件的集成电路封装形式, 它采用. 最大基板尺寸:460 x 310 mm. 最小的间距,最复杂的集成, 最大的阵列器件. Useful Enhancements for FINEPLACER. BGA reballing, preheating. How to - application video. How to - application video. 成熟的热量管理, 采用顶部热风 加热和底部热风加热. 65 mm x 45 mm.
FINEPLACER® pico ma - 多功能贴片机
http://www.finetech.asia/products/micro-assembly/fineplacer-pico-ma.html
最大基板尺寸:460 x 310 mm. 最小的间距,最复杂的集成, 最大的阵列器件. RFID (Radio Frequency Identification)射频识别电子标签作为条形码的替代产品. 光学封装是主要组装，包括光学 透镜、棱镜、孔径、滤镜等 和电子部件 LD、PD、放大器、控制器等。 How to video: 3D-Stacking. How to video: Flipping. How to video: Manual Control. How to video: Sensor Assembly. 堆叠封装 PoP 是指纵向排列的逻辑和存储元件的集成电路封装形式, 它采用. 最大基板尺寸:460 x 310 mm. 最小的间距,最复杂的集成, 最大的阵列器件. Useful Enhancements for FINEPLACER. BGA reballing, preheating. How to - application video. How to - application video. 最大工作区域 450 mm x 122 mm*. VCSEL, PD,镜头组件封装.
Al-Bohacen Kft. - képviseletek
http://www.albohacen.hu/kepviselet.php
Tudta Ön, hogy mit jelent az ESD? Egy angol mozaikszó, jelentése: ESD = ElectroStatic Discharge = elektrosztatikus kisülés. Cégünk megoldást kínál e problémára. Amennyiben felkeltettük érdeklődését, tekintse meg ESD. S termékeink lapját ITT. Vagy vegye fel a kapcsolatot Kollégáinkkal, az ITT. Tudta Ön, hogy mi a JIG? Elsődleges célja tehát a folyamat ismételhetősége, pontossága és a termék felcserélhetősége. Ekre, hiszen a szerszám irányítása digitálisan programozott - a memóriában tárolható - így az irá...
关于我们
http://www.finetech-china.com/company/about-us.html
作为德国 Finetech 在中国的全资子公司,于 2006 年在中国上海成立。 Finetech 成立于 1992 年，最早专注于返修设备的生产。 在 2009 年十一月，Finetech 收购了德国 MARTIN，一家位于德国维斯灵专门生产返修台和点胶机的设备供应商。 Finetech 的核心业务包括精确贴片，倒装焊，光电器件贴装以及 SMT 返修。 Read more: eu.finetech.de. 纳入 Baumann 集团并定名为 Finetech GmbH and Co. KG. 通过 ISO 9001 认证。 Finetech Nippon Co., Ltd. 在日本东京成立. Finetech 柏林总部迁址至全新的现代化的 Finetech 生产研发大楼. 2017 Finetech (Shanghai) Electronics Co. Ltd.
Micro Assembly
http://www.finetechusa.com/products/micro-assembly.html
Production Platform, Maximum Yield. 05 micron, 300 mm wafer. Bonding forces up to 1000N. 300 mm wafer bonder. Flexible Sub-micron Die Bonder. Automated Flip Chip Bonder. Volumetric dispensing with high quality results. Platforms, Finetech develops highly customized equipment solutions according to specific application requirements. The perfect blend of performance and cost for Rework. Proven technology where process reproducibility is critical. High Density Rework Station. Future in Advanced Rework.
IPC Training and Certification Center - PIEK
https://piek.international/fr
IPC and PIEK Training Courses. IPC Design Training and Certification. IPC-A-600 Training & Certification. IPC-6012 Training & Certification. IPC-A-610 Training & Certification. IPC/WHMA-A-620 Training & Certification. IPC J-STD-001 Training & Certification. IPC-7711/7721 Training & Certification. Frequently Asked Questions (FAQ). IPC Training and Certification Center – PIEK. IPC Training and Certification Center – PIEK. About PIEK and IPC Training. PIEK is the partner of choice for the automotive sector,...
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HONOURING THE VISION, CREATIVITY, EXPERTISE AND EFFORT THAT POWERS EUROPE'S BEST MUSIC FESTIVALS. How the awards are decided. How the awards are decided. Welcome to the 2015 UK Festival Awards. The European Festival Awards is an illustrious celebration of the continent’s most vibrant live events and all of those who make them happen. With a set of attendees as eclectic as they are respected, the European Festival Awards is widely considered to be. Proud to be supported by:.
FINAL FANTASY XIV, The Lodestone
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Tuesday, 27 Mar 2018. Companies & Markets. ED’s forex list fiasco. Pension arrears surge to $550 million. Policyholders lose $3,2 billion. Bread price freeze threatens firms’ viability. Pensions crisis: State firms biggest offenders. Old Mutual records $219m profit. March 27, 2018. INTEGRATED financial services group, Old Mutual Zimbabwe Limited (OM) said its profit after tax went up 139 percent to $219 million profit surge in th. Zimbabwe on a charm offensive to win back mining investment. March 27, 2018.
ViewSonic - Finch Club - Home
How to use the portal. Welcome to the Finch Club. What is Finch Club? Finch Club is a dedicated on-line portal for all our Channel Partners: Distributors, Resellers, Retailers, E-tailers, DMR and many more. Finch club is a secure site where only our approved members can access and view specific ViewSonic information. This is not open to the general public. To be the preferred global brand of Visual Solution products. ViewSonic is dedicated to meeting the needs of our customers, generating profitable ...
BGA Rework | Flip Chip | Die Bonder Suppliers
Multi-chip, Multi-placement Die Bonder. Up to 3 µm accuracy. High volume manufacturing system. Automated Flexible Bonding Platform. Production Platform, Maximum Yield. 05 micron, 300 mm wafer. Bonding forces up to 1000N. Flexible Sub-micron Die Bonder. Volumetric dispensing with high quality results. Platforms, Finetech develops highly customized equipment solutions according to specific application requirements. Proven technology where process reproducibility is critical. High Density Rework Station.
Fisher Scientific Europe
Please contact Fisher Scientific. Please contact Fisher Scientific. Please contact Fisher Scientific. V A Graiciuno g. 8. Spectra building, 12th km Thessalonikis- N.Moudanion str. V A Graiciuno g. 8. V A Graiciuno g. 8. Please contact Fisher Scientific. Argenta Spółka z ograniczoną odpowiedzialnością Sp.k. Ul Polska 114, 60-401 Poznań. 48 506 231 456 / 48 571 445 765. Amex Import-Export S.R.L. Intrarea Titan, Nr. 10. Bucuresti, 030494, Bulevardul. 0040 21 340 17 27. FISHER Slovakia, spol. s r.o. Plot 64,...
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Andrea Ronqui Design, web, arte. Cliente: Argosfoto Job: Site/portfólio da empresa Produção de páginas, navegação e conteúdo a partir de template para wordpress. Personalização do template com adaptação dos CSSs, inserção de plug-ins conforme as necessidades do site (formulários, segurança, galerias de fotos etc.) http:/ argosfoto.com.br/. Blog: Histórias de um fotógrafo. Cliente: Vale Agência: Grecco Job: e-mail marketing. Blog: Histórias de um fotógrafo. Job: Site/portfólio da empresa. Produção de pági...
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SAMY - Mobile SPORTGERÄTE-GO-GO für Vereine, Schulen und Profisport
Lernen Sie unsere flexiblen Produkte kennen. Neues Video-Tutorial für SPIELFELD-TO-GO! Der englische Profi-Nachwuchs trainiert mit SAMY. SAMY unterstützt Mini-WM 2014. SAMY - So flexibel wie dein Sport 2016. Der Einkaufswagen ist leer.
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