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FLIPCHIP.COM

FlipChip International - Complete Wafer and IC Services

FlipChip International is a world leading WLCSP bumping supplier, with wafer dicing and thinning capabilities, ASIC, ASPP and ASSP design, and a complete IC service from design to packaging.

http://www.flipchip.com/

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CONTACTS AT FLIPCHIP.COM

FlipChip International, LLC

John Nielsen

3701 E.●●●●●●●ity Dr.

Ph●●ix , Arizona, 85034

United States

1.60●●●●4788
jo●●●●●●●●●●@flipchip.com

View this contact

FlipChip International, LLC

John Nielsen

3701 E.●●●●●●●ity Dr.

Ph●●ix , Arizona, 85034

United States

1.60●●●●4788
jo●●●●●●●●●●@flipchip.com

View this contact

FlipChip International, LLC

John Nielsen

3701 E.●●●●●●●ity Dr.

Ph●●ix , Arizona, 85034

United States

1.60●●●●4788
jo●●●●●●●●●●@flipchip.com

View this contact

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PAGE TITLE
FlipChip International - Complete Wafer and IC Services | flipchip.com Reviews
<META>
DESCRIPTION
FlipChip International is a world leading WLCSP bumping supplier, with wafer dicing and thinning capabilities, ASIC, ASPP and ASSP design, and a complete IC service from design to packaging.
<META>
KEYWORDS
1 semiconductor company
2 semiconductor company in phoenix
3 semiconductor company in arizona
4 semiconductor company in United States
5 electroplating
6 electro plating
7 bump and die
8 bumping services
9 flip chip
10 flipchip
CONTENT
Page content here
KEYWORDS ON
PAGE
about us,mission statement,policies,flipchip news,global sales,careers,site map,patent information,social networks,linkedin,wafer level packages,bumping,design,die services,ic assembly,package options,final test,system in package,chipsett,applications
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FlipChip International - Complete Wafer and IC Services | flipchip.com Reviews

https://flipchip.com

FlipChip International is a world leading WLCSP bumping supplier, with wafer dicing and thinning capabilities, ASIC, ASPP and ASSP design, and a complete IC service from design to packaging.

INTERNAL PAGES

flipchip.com flipchip.com
1

Package Options

http://www.flipchip.com/icassembly

Click the package to view a PDF file with more information. TDFN 6L (0.75). TDFN 10L (0.75). TQFN 20L (0.75). TQFN 16L (0.75). TQFN 40L (0.75). TQFN 48L (0.75).

2

Probe

http://www.flipchip.com/icassembly/finaltest

FlipChip International offers wafer level test in FCI-Shanghai and through US-based partners. IC Final Test of all FCI-Shanghai packages also available. Types of test services available:. Full test plan design on open platform, software development, hardware development, hardware purchase, test solution debug and production volume probe and final test. Implementation of established test plan on specific platform, consigned equipment and production volume probe and final test. TSK, TEL and EG4090.

3

Site Map

http://www.flipchip.com/site-map

FlipChip International’s Environmental Policy. System in Package (SiP). Electroplated CU EDC (Various Offerings). EliteUBM – Electroless Ni/Au. SFC Bump on I/O. SFC Repassivation (Spheron or BCB). SFC Redistribution (Spheron or BCB). Cu Pillar Bump – Repassivation (Spheron ). Spheron WLCSP Bump on I/O and Redistribution. UltraCSP WLCSP Bump on I/O and Redistribution. Electroplated Cu Spheron WLCSP Redistribution.

4

ChipsetT

http://www.flipchip.com/services/sip/chipsett

A new ultra thin. Advanced embedded die packaging solution suitable for single and multi-die System in Package applications. Based on Fujikura WABE Technology, this product family offers unrivaled package form factor reduction compared with alternative embedded die technologies while maintaining industry leading reliability performance. An innovative package platform that opens new doors to system layout and design freedom through its inherent enhanced functional density. Full 3-D Package Integration.

5

FlipChip International Patent Informationi

http://www.flipchip.com/services/patent-information

The purchase of any of the following wafer bumping services or products instruments listed in the table below are covered by one or more U.S. Patents and their foreign counterparts as indicated in the table below. If you do not see a particular FCI product listed below, please feel free to contact Dawn Cuevas at 602-431-6637 for further information on its intellectual property status. FCI Service and Product Type. 6,445,069 and patents pending. 6,578,755; 7,118,833; 7,126,164 and patents pending.

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LINKS TO THIS WEBSITE

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DesktopExpos Packaging Equipment & Supplies Show

http://www.desktopexpo.com/tsPACKAGING.htm

Equipment and Supplies Expo. Exhibit and Advertise On This Site. Point and click on the companies named below. For a specific brand or product? Use your browser's EDIT. Menu and select FIND. To receive exhibiting information. On how to exhibit globally. Gulf States Business Solutions Group. Folding carton packaging design. Selective flux dot coating. Solder and Flux bearing leads. Multilayer and double-sided PCB fab facility. Research, Industrial and Medical. Electronic Assembly Process and Productivity.

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DesktopExpos Packaging Equipment & Supplies Show

http://www.desktopexpos.com/tsPACKAGING.htm

Equipment and Supplies Expo. Exhibit and Advertise On This Site. Point and click on the companies named below. For a specific brand or product? Use your browser's EDIT. Menu and select FIND. To receive exhibiting information. On how to exhibit globally. Gulf States Business Solutions Group. Folding carton packaging design. Selective flux dot coating. Solder and Flux bearing leads. Multilayer and double-sided PCB fab facility. Research, Industrial and Medical. Electronic Assembly Process and Productivity.

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E&G Technology Partners - FC & WLP Consulting

http://www.egtechpartners.com/serv01.htm

You Have Access To:. Greater than 25 years of flip chip and WLP experience from recognized industry experts. The inventor and marketer of the Ultra CSP. WLP which has 60% market share today. Flip Chip and WLP Technology Selection. Selecting the best available technology for your product application and then assisting you with the sourcing of that technology based on your requirements. Flip Chip and WLP Technology Sourcing. Advanced IC Package Failure Analysis and Problem Resolution. Is a registered trade...

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VizPro - News

http://www.vizualpro.com/news.html

Is now on Facebook. Nearly Naked Theatre Postcards. Just completed printing postcards and programs for Nearly Naked Theatre's. Muckle Man, they are dedicated to producing the Valley's most challenging and provocative productions. Check out our gallery. For a view of this piece. State Farm Rally Towels. Just completed printing rally towels for Linda Maxcy. For a view of this piece. Gila River Health Care Banners. Just completed designing and printing banners and posters for Gila River Health Care. This wa...

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Global Trade Expo Packaging Equipment & Supplies

http://www.globaltradeexpo.com/dbPACKAGING.htm

Include Your Company In These Trade Shows. To Locate and View Supplier. Scroll down and click on the company's name. Selective flux dot coating. Solder and Flux bearing leads. Multilayer and double-sided PCB fab facility. High speed component handling. Research, Industrial and Medical. Electronic Assembly Process and Productivity. Eutectic and Epoxy bonders. SMT stensil cleaning systems. Bond test and die handling equipment. Connecting Buyers and Sellers. This site is on the highway of.

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Electronic Industry Links

http://www.dummycomponents.com/Industry-Links

Hand Solder Training Kits. Cleaning and Conformal Coating. Training Aids, Tools and Supplies. Hand Solder Training Kits. Cleaning and Conformal Coating. Training Aids, Tools and Supplies. Intertronics is dedicated to. Providing quality material, consumable and equipment solutions to the electronics manufacturing and other technology based industries, incorporating the highest levels of technical support and customer service. www.intertronics.co.uk. Located in the heart of the Silicon Valley, Tessera.

iwlpc.com iwlpc.com

IWLPC - International Wafer Level Packaging Conference

http://www.iwlpc.com/exhibitor_info.cfm

Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. Sponsor or Exhibit Today! View available Sponsorship and Exhibitor Opportunities. Dates: October 18-19, 2016. Location: DoubleTree by Hilton Hotel, San Jose, CA. October 19: 9:30am-3:30 pm. Why Exhibit at IWLPC? A focused international audience. In this highly competitive marketplace. And concepts to the market. With existing customers and generate new leads. View the latest floor plan. Two Free Lunches Per Day. 8' D x 10' W).

w.practicalcomponents.com w.practicalcomponents.com

Electronic Industry Links

http://w.practicalcomponents.com/Industry-Links

Hand Solder Training Kits. Cleaning and Conformal Coating. Training Aids, Tools and Supplies. Hand Solder Training Kits. Cleaning and Conformal Coating. Training Aids, Tools and Supplies. Intertronics is dedicated to. Providing quality material, consumable and equipment solutions to the electronics manufacturing and other technology based industries, incorporating the highest levels of technical support and customer service. www.intertronics.co.uk. Located in the heart of the Silicon Valley, Tessera.

globalexpocenter.com globalexpocenter.com

GlobalExpoCenter Packaging Equipment & Supplies Show

http://www.globalexpocenter.com/tsPACKAGING.htm

Equipment and Supplies Expo. Include Your Company On This Site. Point and click on the companies named below. For a specific brand or product? Use your browser's EDIT. Menu & select FIND. To receive exhibiting information. On how to exhibit globally. Gulf States Business Solutions Group. Folding carton packaging design. Selective flux dot coating. Solder and Flux bearing leads. Multilayer and double-sided PCB fab facility. Research, Industrial and Medical. Electronic Assembly Process and Productivity.

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FlipChip International - Complete Wafer and IC Services

FlipChip International attending the International Wafer-Level Packaging Conference in San Jose, California on October 13th & 14th. Phoenix, AZ Sep. 15, 2015. FlipChip International – (FCI), the global technology leader in flip chip bumping and Wafer-Level Packaging, will be returning and exhibiting at the International Wafer-Level Packaging Conference (IWLPC) in San Jose, California on October 13-14. Phoenix AZ, April 30, 2015. To read more…. FCI To Be Acquired by TianShui Huatian Technology Co., LTD.

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Even Normal days are an adventure. Skip to primary content. Skip to secondary content. November 27, 2012. Good ideas come in all shapes and sizes. In the grand scheme of things, the human race is a mass of little squiggling pink guys and girls crawling around in the dirt and tunneling through the air in little metal tubes. Sometimes they forget to smile. They forget to breathe and look at everyone else squiggling around them. Maybe there should be someone to remind them. How: Same Same, but Different.

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Flipchip Electronics Pvt. Ltd

Cable and wire Harnessing and Testing. RF Cable Assembly and Testing. Customized Power Supply Design. Flipchip Electronics Private Limited. An ISO 9001-2008 company, a state of art driven Electronic Manufacturing and Service Provider, located in Banglore, established in 2012. Flipchip is a division of Yash Technologies Pvt Ltd, a globally recognized Software Giant in Business driven technology solutions for ERP and SAP modules. Flipchip Electronics Pvt. Ltd.

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Video & Photos. 100 tutorials – classic flip chip papers to expert topics on today's technologies. NEW: Multi-Chip Benefit Analysis. Links to connect you with research labs, universities, industry organizations, suppliers and consultants. Technology photo album and flip chip and advanced packaging process and application videos. Video & Photos.

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