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FOGALE SEMICON

FOGALE nanotech acquired ALTATECH. On April 15 2016. On December 16-18 2015. On October 6-8 2015. EUROPEAN MEMS SUMMIT 2015. 17-18 September - Milan. On June 17-18 2015. On July 14-16 2015. EMRS conference in Strasbourg. FOGALE invites you to EMRS conference in Strasbourg on May 15th at 9h45 for Optical Characterization and Defect inspection for 3D stacked IC technology. April 22 23, 2015. IMAPS-France Micro/Nano-electronics Packaging and Assembly, Design and manufacturing Forum. January 20-21, 2015.

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FOGALE NANOTECH

125, rue●●●●●●●●tellerie

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9 rue ●●●●●● Ravel

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FOGALE SEMICON | fogale-semicon.com Reviews
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FOGALE nanotech acquired ALTATECH. On April 15 2016. On December 16-18 2015. On October 6-8 2015. EUROPEAN MEMS SUMMIT 2015. 17-18 September - Milan. On June 17-18 2015. On July 14-16 2015. EMRS conference in Strasbourg. FOGALE invites you to EMRS conference in Strasbourg on May 15th at 9h45 for Optical Characterization and Defect inspection for 3D stacked IC technology. April 22 23, 2015. IMAPS-France Micro/Nano-electronics Packaging and Assembly, Design and manufacturing Forum. January 20-21, 2015.
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8 semicon europa
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FOGALE SEMICON | fogale-semicon.com Reviews

https://fogale-semicon.com

FOGALE nanotech acquired ALTATECH. On April 15 2016. On December 16-18 2015. On October 6-8 2015. EUROPEAN MEMS SUMMIT 2015. 17-18 September - Milan. On June 17-18 2015. On July 14-16 2015. EMRS conference in Strasbourg. FOGALE invites you to EMRS conference in Strasbourg on May 15th at 9h45 for Optical Characterization and Defect inspection for 3D stacked IC technology. April 22 23, 2015. IMAPS-France Micro/Nano-electronics Packaging and Assembly, Design and manufacturing Forum. January 20-21, 2015.

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FOGALE SEMICON

http://www.fogale-semicon.com/PHP/company.php

FOGALE nanotech, an engineering company created in 1983, is now a worldwide known reference in the field of high accuracy dimensional metrology. FOGALE nanotech provides process control and characterization solutions for MEMS and semiconductor manufacturers and labs around the world. FOGALE nanotech is a member of SEMI organization. FOGALE Headquarter is located in NÎMES, south of France. 3D integration: wafer on temporary carrier dimensional control. 3D integration: High Aspect ratio TSV measurement.

2

FOGALE SEMICON

http://www.fogale-semicon.com/PHP/applications-substrate.php

New SOI wafers and new materials require thickness mapping, bow and warp metrology solution for total and individual layer thickness measurement. Wafer on temporary carrier. Wafer on glass or silicon temporary carriers require total stack thickness measurement and top substrate individual thickness measurement. Wafer on saw frame and wafer on dicing frame. Product wafer dimensional control (measurement on defined patterns). Related products - T-MAP single or dual IR configuration.

3

FOGALE SEMICON

http://www.fogale-semicon.com/PHP/applications-tsv.php

Bringing 3D to production requires thorough process control in order to insure technically and economically competitive manufacturing. Metrology and inspection for TSV production. Metrology and inspection for temporary carrier processing and thinning. PROCESS CONTROL ALL IN ONE TOOL. Wafer on temporary bonding: ttv, bow, void detection, exentricity. Wafer thinning: rst, edge trim, µcrack detection, stress, defect review. TSV reveal: nails height and coplanarity. Wafer on dicing frame inspection capability.

4

FOGALE SEMICON

http://www.fogale-semicon.com/PHP/locations.php

125 rue de l'hostellerie - Bât A. 30900 NÎMES - FRANCE. Phone 33(0) 466 620 555. Fax 33(0) 466 627 160. SAN FRANCISCO, CA 94123. See the distributors of fogale.

5

FOGALE SEMICON

http://www.fogale-semicon.com/PHP/support.php

FOGALE Nanotech provides partnership and support systems. The customer department delivers high quality support for after-sale service, expertise support for specific requirements and training sessions. Demos and expertise service programs. Training: Equipments and theory.

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FOGALE SEMICON

FOGALE nanotech acquired ALTATECH. On April 15 2016. On December 16-18 2015. On October 6-8 2015. EUROPEAN MEMS SUMMIT 2015. 17-18 September - Milan. On June 17-18 2015. On July 14-16 2015. EMRS conference in Strasbourg. FOGALE invites you to EMRS conference in Strasbourg on May 15th at 9h45 for Optical Characterization and Defect inspection for 3D stacked IC technology. April 22 23, 2015. IMAPS-France Micro/Nano-electronics Packaging and Assembly, Design and manufacturing Forum. January 20-21, 2015.

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