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Debris free in-glass laser marking. Quad Beams marking system. Wafer film laser marking. Character height 0.2mm.Mark landing accuracy /-20um. PCB Laser Depaneling System. Cutting in different shapes. Thermal and mechanical stress free cutting process. Debris free inglass marking. Debris free glass marking.Marking inside glass thickness 0.3mm. Post sawed Wafer level marking. Marking accuracy /-15um with character height 50um. Quad beams marking system. Theme: Spacious by ThemeGrill.

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<META> DESCRIPTION

Debris free in-glass laser marking. Quad Beams marking system. Wafer film laser marking. Character height 0.2mm.Mark landing accuracy /-20um. PCB Laser Depaneling System. Cutting in different shapes. Thermal and mechanical stress free cutting process. Debris free inglass marking. Debris free glass marking.Marking inside glass thickness 0.3mm. Post sawed Wafer level marking. Marking accuracy /-15um with character height 50um. Quad beams marking system. Theme: Spacious by ThemeGrill.

<META> KEYWORDS

1 menu

2 about us

3 technology

4 scanvision

5 power feedback system

6 lab facilities

7 solutions

8 leds micro marking

9 pcb laser depaneling

10 wafer micro marking

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menu,about us,technology,scanvision,power feedback system,lab facilities,solutions,leds micro marking,pcb laser depaneling,wafer micro marking,inconel laser micromachining,diamonds laser marking,gallery,led micro marking,powered by wordpress

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Home - Hylax | hylax.com Reviews

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Debris free in-glass laser marking. Quad Beams marking system. Wafer film laser marking. Character height 0.2mm.Mark landing accuracy /-20um. PCB Laser Depaneling System. Cutting in different shapes. Thermal and mechanical stress free cutting process. Debris free inglass marking. Debris free glass marking.Marking inside glass thickness 0.3mm. Post sawed Wafer level marking. Marking accuracy /-15um with character height 50um. Quad beams marking system. Theme: Spacious by ThemeGrill.

INTERNAL PAGES

hylax.com

1

Lab facilities - Laser Equipment Manufacturer

http://www.hylax.com/lab-facilities

Laser equipment manufacturer and application development center. Multiple laser scanhead DSP controller. Quad beams laser marker system. Surface polishing laser machine. Laser ablation of gold coating. Laser ablation for selective plating. Reject part laser dot marker. Chip resistor laser trimming – extreme narrow line. Sawn die on wafer ring laser marking. Wafer ring blue tape laser marking. Copper laminate wafer laser dicing. Bare silicon wafer laser scribing. PCB and flex circuit. Besides that we have...

2

HT5000 Fiber laser - Laser Equipment Manufacturer

http://www.hylax.com/ht5000-fiber-laser

Laser equipment manufacturer and application development center. Multiple laser scanhead DSP controller. Quad beams laser marker system. Surface polishing laser machine. Laser ablation of gold coating. Laser ablation for selective plating. Reject part laser dot marker. Chip resistor laser trimming – extreme narrow line. Sawn die on wafer ring laser marking. Wafer ring blue tape laser marking. Copper laminate wafer laser dicing. Bare silicon wafer laser scribing. PCB and flex circuit.

3

PCB laser depaneling - Laser Equipment Manufacturer

http://www.hylax.com/pcb-laser-depaneling

Laser equipment manufacturer and application development center. Multiple laser scanhead DSP controller. Quad beams laser marker system. Surface polishing laser machine. Laser ablation of gold coating. Laser ablation for selective plating. Reject part laser dot marker. Chip resistor laser trimming – extreme narrow line. Sawn die on wafer ring laser marking. Wafer ring blue tape laser marking. Copper laminate wafer laser dicing. Bare silicon wafer laser scribing. PCB and flex circuit.

4

HT2000 UV series - Laser Equipment Manufacturer

http://www.hylax.com/ht2000-uv-series

Laser equipment manufacturer and application development center. Multiple laser scanhead DSP controller. Quad beams laser marker system. Surface polishing laser machine. Laser ablation of gold coating. Laser ablation for selective plating. Reject part laser dot marker. Chip resistor laser trimming – extreme narrow line. Sawn die on wafer ring laser marking. Wafer ring blue tape laser marking. Copper laminate wafer laser dicing. Bare silicon wafer laser scribing. PCB and flex circuit.

5

Debris free in-glass laser marking - Laser Equipment Manufacturer

http://www.hylax.com/debris-free-inglass-laser-marking

Laser equipment manufacturer and application development center. Multiple laser scanhead DSP controller. Quad beams laser marker system. Surface polishing laser machine. Laser ablation of gold coating. Laser ablation for selective plating. Reject part laser dot marker. Chip resistor laser trimming – extreme narrow line. Sawn die on wafer ring laser marking. Wafer ring blue tape laser marking. Copper laminate wafer laser dicing. Bare silicon wafer laser scribing. PCB and flex circuit.

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