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LTCC技术资料、行业资讯及产品介绍 - LTCC技术资料、行业资讯及产品介绍 | iltcc.com Reviews
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LTCC技术资料、LTCC行业资讯及LTCC产品介绍
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LTCC(低温共烧陶瓷)产业概况 - LTCC技术资料、行业资讯及产品介绍
http://www.iltcc.com/article/LTCCgaikuang.html
发布时间 2014-12-24 08:50:43 阅读 1407. 有人曾夸张地预言,以后的电子工业将简化为装配工业——把各种功能模块组装在一起即可。 低温共烧陶瓷技术 low temperature cofired ceramic LTCC. LTCC技术最早由美国开始发展,初期应用于军用产品,后来欧洲厂商将其引入车用市场,而后再由日本厂商将其应用于资讯产品中。 在全球LTCC市场占有率九大厂商之中,日商有Murata,Kyocera,TDK和Taiyo Yuden;美商有CTS,欧洲商有Bosch, CMAC,Epcos及Sorep-Erulec等。 随着未来LTCC制品市场中运用LTCC制作的组件数目逐渐被LTCC模块与基板所取代,终端产品产能过剩,价格和成本竞争日趋激烈,元器件的国产化必将提上议事日程,这为国内LTCC产品的发展提供了良好的市场契机。 南玻电子公司正在用进口粉料,开发出介电常数为9.1、18.0和37.4的三种生带,厚度从10µm到100µm,生带厚度系列化,为不同设计、不同工作频率的LTCC产品的开发奠定了基础。
LTCC过程（LTCC process） - LTCC技术资料、行业资讯及产品介绍
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发布时间 2014-12-23 10:22:17 阅读 1154. The LTCC processing is very similar to that of HTCC without the complex firing conditions, flattening fires and plating steps. A blanking die is used to create orientation marks and lamination tooling holes (and the final working dimension in case of to be preconditioned tapes). Note: It is preferred to rotate the single parts in turns 90° to compensate the different x/y-shrinking of the LTCC. Vias may be punched or drilled with a laser (low power). Both methods need to ...
LTCC设计规则(LTCC Design Rules)二——值 - LTCC技术资料、行业资讯及产品介绍
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LTCC设计规则(LTCC Design Rules)二 值. 发布时间 2014-12-23 10:44:44 阅读 988. Table Of Main Values. Edge To Feature in um. Line Width in um. Line Width in um (Fine Line Process). Line Spacing in um. Line Spacing in um (Fine Line Process). Line Pitch in um. Line To Cavity Wall Spacing in um. Via Diameter in um. Via Coverpad / Catchpad. Via diam. 25um. Via Spacing in um. Via Pitch in um. Via To Cavity Wall Spacing in um. Blind, buried, stacked. Blind, buried, stacked. Thermal Via Coverage in %. 05 x 0.5. 2% / /- 25%.
iLTCC网站合作 - LTCC技术资料、行业资讯及产品介绍
http://www.iltcc.com/article/LTCCshare.html
发布时间 2014-12-20 15:59:45 阅读 874. Http:/ www.imaoye.com. Http:/ www.iltcc.com. Http:/ www.ltcc.com.cn. Http:/ www.1mos.com. 版权所有 2012 - 2015 深圳市华源茂业科技有限公司 粤ICP备14091801号-2.
LTCC助推元件集成化 功能模块研制是重点 - LTCC技术资料、行业资讯及产品介绍
http://www.iltcc.com/article/LTCCyuanjianjichenghua.html
发布时间 2015-01-04 17:29:56 阅读 1391. LTCC功能组件和模块主要用于GSM、CDMA、PHS 手持电话系统 手机、无绳电话、WLAN 无线局域网 和蓝牙等通信产品，除40多兆的无绳电话外，这几类产品在大陆是近四五年才发展起来的。 近年来，清华大学新型陶瓷材料与精细工艺国家重点实验室实验室在全新的材料设计思想指导下，发展出了一种新型LTCC材料系统——— 硅铝氟氧化物基低温共烧陶瓷。 如各种制式的手机、蓝牙模块、GPS 全球定位系统 、PDA 掌上电脑 、数码相机、WLAN、汽车电子、光驱等。 继村田制作所2004年发布的.6mm×9.6mm×1.8mm业界最小的LAN 局域网 模块后，2005年京瓷又成功开发了可嵌入收集使用的无线LAN模块，尺寸为9.8mm×7.5mm×1.5mm，主要是采用LTCC技术，通过在基板内嵌入收发IC及滤波器等实现了模块的小型化。 上一篇 杜邦LTCC材料系统(DuPont Low Temperature Co-Fired Ceramic Material Systems).
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LTCC技术资料、行业资讯及产品介绍 - LTCC技术资料、行业资讯及产品介绍
发布时间 2015-01-04 17:29:56 阅读 1933 次. 杜邦LTCC材料系统(DuPont Low Temperature Co-Fired Ceramic Material Systems). 发布时间 2014-12-27 09:33:50 阅读 2237 次. 杜邦LTCC材料系统(DuPont Low Temperature Co-Fired Ceramic Material Systems),极端高温和其他恶劣环境可以促使电子材料到极限。 发布时间 2014-12-25 22:06:55 阅读 1544 次. 发布时间 2014-12-25 21:58:35 阅读 1422 次. 发布时间 2014-12-24 09:33:55 阅读 1522 次. 发布时间 2014-12-24 09:26:15 阅读 1976 次. 发布时间 2014-12-24 09:10:16 阅读 1595 次. 发布时间 2014-12-24 08:50:43 阅读 1959 次. LTCC设计规则(LTCC Design Rules)二 值.
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Illinois Technology Conference for Educators. This is the official blog of the 2006 Illinois Technology Conference for Educators to be held March 2 and 3 at the Pheasant Run Conference Center. Thursday, October 06, 2011. Connective writing is an important part of communicating. Posted by Will Richardson @ 1:23 PM. Links to this post. Thursday, June 02, 2011. I read this great piece in the New York Times. And it made me think. Posted by Will Richardson @ 11:01 AM. Links to this post. Links to this post.
Illinois Technology Conference for Educators
Illinois Technology Conference for Educators. This is the official blog of the 2007 Illinois Technology Conference for Educators to be held March 1 and 2 at the Pheasant Run Conference Center. To post to this blog, please e-mail Luke Allen. Requesting to be added to the IL-TCE 2007 blog. Saturday, June 30, 2007. The Blog for IL-TCE 2008: Learning Without Boundaries,. Is up and active. You can re-set your link to the new site; IL-TCE 2008. You may also join us on our NING site. Thursday, June 21, 2007.
