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IRSP 2016 – 14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics – Experiment and Simulation

14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. Reliability and Stress-Related Phenomena in Nanoelectronics. Download: 3rd announcement (.pdf). Scope of the conference. Co-chairs and scientific committee. Credit card payment form. Phone 49 351 88815 543. Fax 49 351 88815 509. Ehrenfried.zschech@ikts.fraunhofer.de.

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IRSP 2016 – 14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics – Experiment and Simulation | irsp2016.malab.com Reviews
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14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. Reliability and Stress-Related Phenomena in Nanoelectronics. Download: 3rd announcement (.pdf). Scope of the conference. Co-chairs and scientific committee. Credit card payment form. Phone 49 351 88815 543. Fax 49 351 88815 509. Ehrenfried.zschech@ikts.fraunhofer.de.
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2 menu
3 program
4 conference contact
5 downloads
6 experiment and simulation
7 platinum sponsors
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9 exhibitors / sponsors
10 navigation
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IRSP 2016 – 14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics – Experiment and Simulation | irsp2016.malab.com Reviews

https://irsp2016.malab.com

14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. Reliability and Stress-Related Phenomena in Nanoelectronics. Download: 3rd announcement (.pdf). Scope of the conference. Co-chairs and scientific committee. Credit card payment form. Phone 49 351 88815 543. Fax 49 351 88815 509. Ehrenfried.zschech@ikts.fraunhofer.de.

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1

co-chairs and scientific committee – IRSP 2016

http://irsp2016.malab.com/co-chairs-and-program-committee

14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. Co-chairs and scientific committee. Co-chairs and scientific committee. Ehrenfried Zschech, Fraunhofer IKTS, Dresden, Germany. Paul Ho, UT Austin/TX, US. Jon Molina, IMDEA Materials, Madrid, Spain. Tony Oates, TSMC, Taiwan. Valeriy Sukharev, Mentor Graphics, Fremont/CA, US. C K Hu, IBM Yorktown Heights/NY, US (co-chair).

2

call for papers – IRSP 2016

http://irsp2016.malab.com/call-for-abstracts

14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. One-page abstracts must be received by January 15, 2016. Address the abstracts to the Chair:. Ehrenfried.zschech@ikts.fraunhofer.de. Notice of acceptance of papers will be given by January. Accepted abstracts will be published in the conference program as submitted. Scope of the conference. Co-chairs and scientific committee.

3

scope of the conference – IRSP 2016

http://irsp2016.malab.com/scope-of-the-conference

14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. Scope of the conference. Scope of the conference. Scope of the conference. Co-chairs and scientific committee. Credit card payment form. Phone 49 351 88815 543. Fax 49 351 88815 509. Ehrenfried.zschech@ikts.fraunhofer.de.

4

program – IRSP 2016

http://irsp2016.malab.com/program

14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. Scope of the conference. Co-chairs and scientific committee. Credit card payment form. Phone 49 351 88815 543. Fax 49 351 88815 509. Ehrenfried.zschech@ikts.fraunhofer.de.

5

special journal issue – IRSP 2016

http://irsp2016.malab.com/invited-speakers-and-program

14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. Selected papers will be published in IEEE Transactions on Device and Materials Reliability (TDMR) and in Advanced Engineering Materials (AEM). The deadline for submission of manuscripts will be July 31, 2016. Scope of the conference. Co-chairs and scientific committee. Credit card payment form. Phone 49 351 88815 543.

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IRSP 2016 – 14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics – Experiment and Simulation

14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. Reliability and Stress-Related Phenomena in Nanoelectronics. Download: 3rd announcement (.pdf). Scope of the conference. Co-chairs and scientific committee. Credit card payment form. Phone 49 351 88815 543. Fax 49 351 88815 509. Ehrenfried.zschech@ikts.fraunhofer.de.

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