
JFPMICROTECHNIC.COM
JFP MicrotechnicOur die bonders achieve high accuracy placement, using adjustable magnification optical device. Functionnalities : stamping, eutectic and epoxy. User friendly, flexible, our Die Bonders require only minimum training to operate. Very light Epoxy Die Bonder solution,. MPS requires minimal training to operate. The MPS fulfils accurate Picking and Placement of delicate devices. Tool holder design, rocking Head, provides an easy solution for gluing. Eutectic and Epoxy available. 3 Dimension Die Bonder.
http://www.jfpmicrotechnic.com/