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js-engineering.com

JS Engineering Profile

Specialists in IC test chips for measurement of thermo-mechanical stresses in electronic packages. Characterization and analysis of the effects of stress on precision CMOS and bipolar integrated circuits. ,

http://www.js-engineering.com/

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CONTACTS AT JS-ENGINEERING.COM

JS Engineering

Richard Jaeger

Box●●●084

Au●●rn , AL, 36831

UNITED STATES

1334●●●●3100
rj@js-engineering.com

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JS Engineering

Richard Jaeger

Box●●●084

Au●●rn , AL, 36831

UNITED STATES

1334●●●●3100
rj@js-engineering.com

View this contact

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1430 W. ●●●●●●●●e St. NW

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PAGE TITLE
JS Engineering Profile | js-engineering.com Reviews
<META>
DESCRIPTION
Specialists in IC test chips for measurement of thermo-mechanical stresses in electronic packages. Characterization and analysis of the effects of stress on precision CMOS and bipolar integrated circuits. ,
<META>
KEYWORDS
1 engineering
2 mechanical engineering
3 electrical engineering
4 electronic engineering
5 stress analysis
6 stress test chips
7 integrated circuits
8 integrated circuit design
9 IC design
10 test chips
CONTENT
Page content here
KEYWORDS ON
PAGE
thermo mechanical evaluation,of electronic packages,auburn al,company headquarters,contact information,test chip supply,test chip application,calibration service,uniaxial calibration,hydrostatic calibration,background information,services
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iso-8859-1
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JS Engineering Profile | js-engineering.com Reviews

https://js-engineering.com

Specialists in IC test chips for measurement of thermo-mechanical stresses in electronic packages. Characterization and analysis of the effects of stress on precision CMOS and bipolar integrated circuits. ,

INTERNAL PAGES

js-engineering.com js-engineering.com
1

Wire Bond Test Chips

http://www.js-engineering.com/WireBondChips.html

Ted Stress State Sensors. For Wire Bond Applications. Measure the Complete Stress State. Both In-plane and Out-of-Plane. Insure Reliability of Your Packages. Your Company Packages the Devices and Extracts the Sress State Data. Extracts the Stress State Information for You. An Array of Die Sizes to Fit Your Application. 25 mm x 2.5 mm. 5 mm x 5 mm. 10 mm x 10 mm. Larger Die Available on Request. 15 mm x 15 mm. 20 mm x 20 mm. 15 mm x 25 mm. Wafer Thickness - 25 mils. Wafers can be thinned upon request.

2

Wire Bond Test Chips

http://www.js-engineering.com/FlipChips.html

Integrated Stress State Sensors for. Insure Reliability of Your Packages. Supplies the Die and Calibration Coefficients. Your Company Packages the Devices and Extracts Stress State Information. Extracts the Stress State Information for You. An Array of Die Sizes to Fit Your Application. 25 mm x 2.5 mm. 5 mm x 5 mm. 10 mm x 10 mm. Wafer Thickness - 25 mils. Other Thicknesses Available Upon Request. 25 mm x 2.5 mmTest Die. 200 um Pitch Perimeter Bumped. 5 mm x 5 mm Test Die. 200 um Pitch Perimeter Bumped.

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