Logan Technologies, L.P. is a seller and broker of pre-owned, used, excess, and surplus semiconductor fabrication equipment, electronic test equipment, and spare parts. We deal in equipment and spare parts used in the fabrication, testing, and manufacturing of solar cells and semiconductors.
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Logan Technologies, LP
Billy Liles
3213 Bu●●●●●●●m Court
Te●●le , Texas, 76502
UNITED STATES
View this contact
Logan Technologies, LP
Billy Liles
3213 Bu●●●●●●●m Court
Te●●le , Texas, 76502
UNITED STATES
View this contact
Logan Technologies, LP
Billy Liles
3213 Bu●●●●●●●m Court
Te●●le , Texas, 76502
UNITED STATES
View this contact
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Semiconductor and Solar Cell Equipment and Parts - Logan Technologies, L.P. | logansemi.com Reviews
https://logansemi.com
Logan Technologies, L.P. is a seller and broker of pre-owned, used, excess, and surplus semiconductor fabrication equipment, electronic test equipment, and spare parts. We deal in equipment and spare parts used in the fabrication, testing, and manufacturing of solar cells and semiconductors.
logansemi.com
Misonix MyStaire MTS-22 Air Scrubber - Semiconductor Equipment - Logan Technologies, L.P.
http://www.logansemi.com/semiconductor/equipment/220/misonix-mystaire-mts-22-air-scrubber
Logan Technologies, L.P. Logan Technologies, L.P. is a seller and broker of new, pre-owned, used, excess, and surplus semiconductor fabrication equipment, electronic test equipment, and spare parts. We deal in equipment and spare parts used in the fabrication, testing, and manufacturing of solar cells and semiconductors. Misonix MyStaire MTS-22 Air Scrubber ( back to listings. Misonix MyStaire MTS-22 Air "Water" Scrubber Abatement System. 2 avalable. billyliles@aol.com. Office Phone: (254) 773-4070.
Semiconductor Equipment - Logan Technologies, L.P.
http://www.logansemi.com/semiconductor/equipment
Logan Technologies, L.P. Logan Technologies, L.P. is a seller and broker of new, pre-owned, used, excess, and surplus semiconductor fabrication equipment, electronic test equipment, and spare parts. We deal in equipment and spare parts used in the fabrication, testing, and manufacturing of solar cells and semiconductors. Edwards iF 30k vacuum and blower, Tested to 4.4x10-3 torr. billyliles@aol.com. Edwards IF 1800 Dry Pump. Edwards IF 1800 Dry pump stack, Tested good to 2.4x10-3 torr, Back . Misonix MyS...
Drytek/Lam Microwave Lower Assy - Semiconductor Parts - Logan Technologies, L.P.
http://www.logansemi.com/semiconductor/parts/148/dryteklam-microwave-lower-assy
Logan Technologies, L.P. Logan Technologies, L.P. is a seller and broker of new, pre-owned, used, excess, and surplus semiconductor fabrication equipment, electronic test equipment, and spare parts. We deal in equipment and spare parts used in the fabrication, testing, and manufacturing of solar cells and semiconductors. Drytek/Lam Microwave Lower Assy ( back to listings. Complete Microwave Lower electrode assy. New cost is $29000. Includes ceramic and chuck. 21.5 mm dia. Office Phone: (254) 773-4070.
TEPLA AUTO LOAD 300 - Semiconductor Equipment - Logan Technologies, L.P.
http://www.logansemi.com/semiconductor/equipment/134/tepla-auto-load-300
Logan Technologies, L.P. Logan Technologies, L.P. is a seller and broker of new, pre-owned, used, excess, and surplus semiconductor fabrication equipment, electronic test equipment, and spare parts. We deal in equipment and spare parts used in the fabrication, testing, and manufacturing of solar cells and semiconductors. TEPLA AUTO LOAD 300 ( back to listings. Tepla Auto Load 300 Plasma Processor, holds two boats of 4 to 6" wafers. S/N 1171. 245 GHz, 0 to 1000 Watts. Used for photoresist stripping.
Edwards IF 1800 Dry Pump - Semiconductor Equipment - Logan Technologies, L.P.
http://www.logansemi.com/semiconductor/equipment/236/edwards-if-1800-dry-pump
Logan Technologies, L.P. Logan Technologies, L.P. is a seller and broker of new, pre-owned, used, excess, and surplus semiconductor fabrication equipment, electronic test equipment, and spare parts. We deal in equipment and spare parts used in the fabrication, testing, and manufacturing of solar cells and semiconductors. Edwards IF 1800 Dry Pump ( back to listings. Edwards IF 1800 Dry pump stack, Tested good to 2.4x10-3 torr, Back pump speed 200 m3/hr, performance 1x10-2 torr, billyliles@aol.com.
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Semiconductor Equipment: June 2008
http://semequip.blogspot.com/2008_06_01_archive.html
In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Saturday, June 28, 2008. Strasbaugh 7AA wafer grinder. Axus Technology - CMP Equipment, Post-CMP Cleaning and Wafer Grinding Equipment. SEMICONDUCTOR AND MEMS PROCESS EQUIPMENT FOR CMP AND BACK GRINDING PROCESSES. Axus maintains an inventory of processing tools available, which are refurbished and configured to customer specifications. IPEC 472 and IPEC 372M. IPEC 776, Orbital Polisher. Axus Technology ma...
Semiconductor Equipment: Wire Bonder 3200
http://semequip.blogspot.com/2009/03/wire-bonder-3200.html
In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Monday, March 9, 2009. The Wire Bonder 3200 offers a 30 µm pitch process capability. With its increased Y bond range it copes with the widest range of substrates. The improved air bearing and the optimized bond head controller enhance the ultra fine pitch capabilities,. With unprecedented placement accuracy, over the entire bond range. A dual cartridge programmable heater further extends the operational a...
Semiconductor Equipment: February 2007
http://semequip.blogspot.com/2007_02_01_archive.html
In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Thursday, February 15, 2007. Stacked Packages Get Thinner. By John Baliga, Contributing Editor -. Document.write(get publication('Semiconductor International') ;. Semiconductor International, 11/1/2006. The micro contacts themselves are. There are two basic process flows, but they both start with a sheet of copper foil that can be up to 120 µm thick. A thin (1 µm) layer of nickel is plated on top, fol...
Semiconductor Equipment: March 2007
http://semequip.blogspot.com/2007_03_01_archive.html
In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Saturday, March 17, 2007. Fine Pitch Au Wire Bonding. Fine Pitch Au Wire Bonding. Fine pitch wire bonding for bonding high density die is measured in pitch. This is a pitch that every year gets a little smaller. The limiting factor on the Palomar Model 8000 is generally the capillary. The model 8000 can bond with as little as 4 grams of force! Model 8000 Wire Bonder. Wire = .6 mil (15 um) 99.99 Au.
Semiconductor Equipment: November 2008
http://semequip.blogspot.com/2008_11_01_archive.html
In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Saturday, November 1, 2008. Oerlikon Esec is one of the world′s leading suppliers of innovative wire bonding solutions. Owing to our many years of experience, we can satisfy a wide range of customer needs in terms of reliability, assembly productivity, excellent customer support and an excellent cost of ownership. Esec Wire Bonder 3200. In conventional wire bonder design, the bondhead is mounted on an ort...
About Glow Research - Glow Research
http://glowresearch.org/about-us
Research and Production Plasma Cleaning Systems. All systems are modular for easy assembly and repair. AutoGlow Control Board. Complete Inventory and Control System. In 2008, Glow Research took over the world-wide parts and service support for several of the older systems from Nordson MARCH the Plasmod, Super Plasmod, Jupiter II, Jupiter III and the PM-600. Our high reliability speaks for itself. Our Customers appreciate that. Replacement/repair components can be ordered through Glow Research. All system...
Semiconductor Equipment: September 2007
http://semequip.blogspot.com/2007_09_01_archive.html
In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Sunday, September 23, 2007. Saturday, September 15, 2007. WHAT IS FLIP CHIP? IBM introduced flip chip interconnection in the early sixties for their mainframe computers, and has continued to use flip chip since then. Delco Electronics developed flip chip for automotive applications in the seventies. Delphi Delco currently places over 300,000 flip chip die per day into automotive electronics. M...Worldwide...
Semiconductor Equipment: March 2009
http://semequip.blogspot.com/2009_03_01_archive.html
In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Monday, March 9, 2009. The Wire Bonder 3200 offers a 30 µm pitch process capability. With its increased Y bond range it copes with the widest range of substrates. The improved air bearing and the optimized bond head controller enhance the ultra fine pitch capabilities,. With unprecedented placement accuracy, over the entire bond range. A dual cartridge programmable heater further extends the operational a...
Used Semiconductor Equipment Mfrs. | Factory Automation Resource
http://www.factoryautomationresource.com/category/production-equipment/used-semiconductor-equipment.html
Custom Automation Equipment and Systems. Used Semiconductor Equipment Category. ClassOne Equipment sells used process and metrology semiconductor equipment from brands such as unaxis, KLA Tencor, Veeco, Oxford, Jeol, and Hitachi including thin film measurement equipment, surface metrology equipment, scanning electron microscopes, mask aligners, spin rinse dryers, photoresist coating systems, and more. AG Semiconductor Services Inc. Bittman Applied Technologies offers used semiconductor manufacturing equi...
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News, questions and commentary about politics and government in Ohio. Friday, December 08, 2006. Playing favorites, BWC style. Why is it that those who scream the loudest about the invisible hand of the marketplace are so often wanting to cheat as often as they can get away. That includes an 88 percent reduction in the base rate paid in 2005 by Armbruster Energy, a business owned by outgoing state Sen. Jeffry Armbruster, R-North Ridgeville. The bureau does not release dollar amounts of the savings. E-mai...
Blog de logansemal69 - Blog de logansemal69 - Skyrock.com
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Semiconductor and Solar Cell Equipment and Parts - Logan Technologies, L.P.
Logan Technologies, L.P. Logan Technologies, L.P. is a seller and broker of new, pre-owned, used, excess, and surplus semiconductor fabrication equipment, electronic test equipment, and spare parts. We deal in equipment and spare parts used in the fabrication, testing, and manufacturing of solar cells and semiconductors. SEMIX TAZMO SOG TR8171UD-TM. USED $84,500.00. ESI 2050 LASER TRIMMER. USED $69,500.00. AXCELIS GEMINI MICROWAVE ASHER. USED $35,000.00. Jeol 7505 Scanning Electron Microscope. We are th...
logansepicjourney.blogspot.com
Logan's Journey
Tuesday, November 22, 2011. I found some more photo's that I haven't put up yet. included is a shot of Logan in his casket. I hope to post more photo's of the service when I receive them from people. enjoy. Logan, Evan, Tracy, Brad and Charlotte. Sunday, November 20, 2011. Evan and I have so many people to thank. we don't want to embarrass anyone, so we thought it best to list what we are grateful for. Logan always told us we should look for the good in life and in people. Provided wood for our deck.
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