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受託分析のベストパートナー 日本マーテック株式会社受託分析のベストパートナー日本マーテック株式会社。分析・解析・評価・試験など260名の専門スタッフと最新の設備でご対応致します。
http://www.ma-tek.jp/
受託分析のベストパートナー日本マーテック株式会社。分析・解析・評価・試験など260名の専門スタッフと最新の設備でご対応致します。
http://www.ma-tek.jp/
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受託分析のベストパートナー 日本マーテック株式会社 | ma-tek.jp Reviews
https://ma-tek.jp
受託分析のベストパートナー日本マーテック株式会社。分析・解析・評価・試験など260名の専門スタッフと最新の設備でご対応致します。
ma-tek.jp
お問い合わせ｜日本マーテック株式会社
http://www.ma-tek.jp/mailform.html
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Mm ｘ 奥行 (. Mm ｘ 奥行 (. Mm ｘ 奥行 (. ESD(HBM, MM, ラッチアップ). 生体 医薬品 化粧品 食品. 生体 医薬品 化粧品 食品.
会社概要｜日本マーテック株式会社
http://www.ma-tek.jp/company/profile.html
Materials Analysis Technology Inc. (100 ). Materials Analysis Technology Inc. (略称 : MA-tek). Room 1A4, 1F, No.1, LiHsing Rd. I, Hsinchu Science Park, Hsinchu, Taiwan. NT$298,000,000 (約10億1,000万円). CEO 謝 詠芬 博士 (Dr. Hsieh Yong-Fen). 材料分析ラボ 台湾 新竹市 新竹科学工業園区. 信頼性試験ラボ 台湾 新竹市 新竹科学工業園区. EFA PFAラボ 台湾 竹北市 台元科技園区. EFA PFAラボ 台湾 新竹市 新竹科学工業園区. EFA PFAラボ 中国 上海市 張江高科技園区. 半導体 FPD デバイスの実プロセスに即した提案型の分析 解析サービスを行っております。 生体 医薬品 化粧品 食品. 生体 医薬品 化粧品 食品.
受託分析のベストパートナー 日本マーテック株式会社
http://www.ma-tek.jp/service
生体 医薬品 化粧品 食品分析. 特に独自開発した K-Kit にて、これまで対応不可能であった 液体の電子顕微鏡内観察を可能としました。 DLS ICP-MS LC-MS TGA DSC FT-IR. 特に透過型電子顕微鏡による分析 解析をコアの技術として、 最適な試料作成法を用い、様々な工業 電子材料に対応しております。 表面分析(D-SIMS,XPS) 取扱材料 太陽電池(各種),LED,LD,磁気ヘッド,カーボンナノチューブ,触媒, セラミック,金属材料,高分子材料,ナノ素材等 ( バイオ メディカルも対応). Spreading Resistance Probe (SRP). Scanning Capacitance Microscopy Service. Field Emission Auger Electron Spectroscopy (FE-AES) Service. High Resolution XRD Service. Delayer (chemicaldry etching and polish). Decap by laser etching. 生体 医薬品 化粧品 食品.
企業情報｜日本マーテック株式会社
http://www.ma-tek.jp/company
生体 医薬品 化粧品 食品. 生体 医薬品 化粧品 食品.
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Materials Analysis Technology Inc.
http://www.ma-tek.com/ir_governance.php?sub=decision
All service item list. Thickness measurement of epitaxial layers in LED QW structure. Application in Advanced IC,FinFET,process development. Delayer (chemicaldry etching and polish). Ultra-High Resolution 3D X-ray Microscope. Ultra High Resolution 3D Optical Microscope. Time Domain Reflectometry (TDR). TEM (Transmission Electron Microscope). TEM (Transmission Electron Microscope). Dual Beam FIB - Helios NanoLab 660. Dual Beam Plasma FIB, Helios P-FIB. SEM (Scanning Electron Microscopy).
Materials Analysis Technology Inc.
http://www.ma-tek.com/ir_service.php?sub=meeting
All service item list. Thickness measurement of epitaxial layers in LED QW structure. Application in Advanced IC,FinFET,process development. Delayer (chemicaldry etching and polish). Ultra-High Resolution 3D X-ray Microscope. Ultra High Resolution 3D Optical Microscope. Time Domain Reflectometry (TDR). TEM (Transmission Electron Microscope). TEM (Transmission Electron Microscope). Dual Beam FIB - Helios NanoLab 660. Dual Beam Plasma FIB, Helios P-FIB. SEM (Scanning Electron Microscopy).
Materials Analysis Technology Inc.
http://www.ma-tek.com/download_03.php
All service item list. Thickness measurement of epitaxial layers in LED QW structure. Application in Advanced IC,FinFET,process development. Delayer (chemicaldry etching and polish). Ultra-High Resolution 3D X-ray Microscope. Ultra High Resolution 3D Optical Microscope. Time Domain Reflectometry (TDR). TEM (Transmission Electron Microscope). TEM (Transmission Electron Microscope). Dual Beam FIB - Helios NanoLab 660. Dual Beam Plasma FIB, Helios P-FIB. SEM (Scanning Electron Microscopy).
Materials Analysis Technology Inc.
http://www.ma-tek.com/list_address.php
All service item list. Thickness measurement of epitaxial layers in LED QW structure. Application in Advanced IC,FinFET,process development. Delayer (chemicaldry etching and polish). Ultra-High Resolution 3D X-ray Microscope. Ultra High Resolution 3D Optical Microscope. Time Domain Reflectometry (TDR). TEM (Transmission Electron Microscope). TEM (Transmission Electron Microscope). Dual Beam FIB - Helios NanoLab 660. Dual Beam Plasma FIB, Helios P-FIB. SEM (Scanning Electron Microscopy).
Materials Analysis Technology Inc. > All service item list
http://www.ma-tek.com/service_detail.php?path=71
All service item list. Thickness measurement of epitaxial layers in LED QW structure. Application in Advanced IC,FinFET,process development. Delayer (chemicaldry etching and polish). Ultra-High Resolution 3D X-ray Microscope. Ultra High Resolution 3D Optical Microscope. Time Domain Reflectometry (TDR). TEM (Transmission Electron Microscope). TEM (Transmission Electron Microscope). Dual Beam FIB - Helios NanoLab 660. Dual Beam Plasma FIB, Helios P-FIB. SEM (Scanning Electron Microscopy). SIMS(Secondary Io...
Materials Analysis Technology Inc. > MA tek selects SIMS 7f-Auto
http://www.ma-tek.com/news_detail.php?id=104
All service item list. Thickness measurement of epitaxial layers in LED QW structure. Application in Advanced IC,FinFET,process development. Delayer (chemicaldry etching and polish). Ultra-High Resolution 3D X-ray Microscope. Ultra High Resolution 3D Optical Microscope. Time Domain Reflectometry (TDR). TEM (Transmission Electron Microscope). TEM (Transmission Electron Microscope). Dual Beam FIB - Helios NanoLab 660. Dual Beam Plasma FIB, Helios P-FIB. SEM (Scanning Electron Microscopy). Founded in 2002, ...
Materials Analysis Technology Inc.
http://www.ma-tek.com/download_01.php
All service item list. Thickness measurement of epitaxial layers in LED QW structure. Application in Advanced IC,FinFET,process development. Delayer (chemicaldry etching and polish). Ultra-High Resolution 3D X-ray Microscope. Ultra High Resolution 3D Optical Microscope. Time Domain Reflectometry (TDR). TEM (Transmission Electron Microscope). TEM (Transmission Electron Microscope). Dual Beam FIB - Helios NanoLab 660. Dual Beam Plasma FIB, Helios P-FIB. SEM (Scanning Electron Microscopy).
Materials Analysis Technology Inc. > Thickness measurement of epitaxial layers in LED QW structure
http://www.ma-tek.com/service_detail.php?path=69
All service item list. Thickness measurement of epitaxial layers in LED QW structure. Application in Advanced IC,FinFET,process development. Delayer (chemicaldry etching and polish). Ultra-High Resolution 3D X-ray Microscope. Ultra High Resolution 3D Optical Microscope. Time Domain Reflectometry (TDR). TEM (Transmission Electron Microscope). TEM (Transmission Electron Microscope). Dual Beam FIB - Helios NanoLab 660. Dual Beam Plasma FIB, Helios P-FIB. SEM (Scanning Electron Microscopy). SIMS(Secondary Io...
Materials Analysis Technology Inc.
http://www.ma-tek.com/ir_info.php?sub=revenue
All service item list. Thickness measurement of epitaxial layers in LED QW structure. Application in Advanced IC,FinFET,process development. Delayer (chemicaldry etching and polish). Ultra-High Resolution 3D X-ray Microscope. Ultra High Resolution 3D Optical Microscope. Time Domain Reflectometry (TDR). TEM (Transmission Electron Microscope). TEM (Transmission Electron Microscope). Dual Beam FIB - Helios NanoLab 660. Dual Beam Plasma FIB, Helios P-FIB. SEM (Scanning Electron Microscopy).
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ma-teetee's blog - Blog de ma-teetee - Skyrock.com
Un blog dédier a mes dadounés! 22/01/2010 at 9:05 AM. 07/03/2010 at 9:56 AM. Reprise d'obstacle : malheureusement pas. Subscribe to my blog! Tous d'abord ma petite teetee. Alors, je vous présente ma petite teetee. Nom : Teeming Rain. Race : Pur Sang Français facteur Selle Français A. Taille : 1m60 environ. Arriver a la fin de son debourrage! Teeming Rain par Michel Georges et PitPiguet par Lou Piguet. Please enter the sequence of characters in the field below. Posted on Friday, 22 January 2010 at 9:18 AM.
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受託分析のベストパートナー 日本マーテック株式会社
生体 医薬品 化粧品 食品. 2016-10-31 - JASIS 2016 MA-tekが開発したK-kit 大反響. 2015-11-11 - ISO27001 (情報セキュリティ認証プログラム) 取得のお知らせ. 2015-10-31 - 液体のTEM観察 K-kit のご紹介. 2015-06-01 - プラズマFIB導入のご案内 ３Dパッケージ、TSVなどへ対応. 生体 医薬品 化粧品 食品. 生体 医薬品 化粧品 食品.
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