imaps.org
IMAPS - HiTEN 2017 - International Conference on High Temperature Electronics Network
http://www.imaps.org/hiten
Session Chair Manual (PDF). Journal of Micro and Elect Pkg. International Conference and Exhibition on. High Temperature Electronics Network (HiTEN 2017). July 10-12, 2017. Cambridge, United Kingdom. Abstract Deadline Extended: January 31, 2017. Colinjohnston@materials.ox.ac.uk. Alison Crossley, University of Oxford (UK). Andy Longford, Panda Europe IMAPS UK (UK). Patrick McCluskey, CALCE (US). Denis Flandre, UCL (B). Bernd Michel, FHG-IZM (D). Randy Norman, Perma Works (US). Ovidiu Vermessan, SINTEF (N).
biomedicalchannelmarketplace.com
Class VI Compliant - Biomedical Channel Marketplace
http://biomedicalchannelmarketplace.com/Listing/Index/Adhesives__Adhesive_Products/Class_VI_Compliant/3485/483
IEEE Global Supplier Marketplace. Edit a Current Listing. Create a New Listing. Adhesives / Adhesive Products. Biomedical Education / Training. Online Graduate Degree Programs. Analytical / Monitoring Equipment. Design / Construction services. Testing / Certification / Training Services. Brazing / Heat-Treating Services. Cables / Wires / Assemblies. Capacitors / Resistors / Diodes. EMI / RFI Shielding / Filters. Fuses / Circuit Breakers. Hospital-Grade Cords / Plugs. PCBs / Embedded Computer Boards.
biomedicalchannelmarketplace.com
Conductive - Biomedical Channel Marketplace
http://biomedicalchannelmarketplace.com/Listing/Index/Adhesives__Adhesive_Products/Conductive/3485/484
IEEE Global Supplier Marketplace. Edit a Current Listing. Create a New Listing. Adhesives / Adhesive Products. Biomedical Education / Training. Online Graduate Degree Programs. Analytical / Monitoring Equipment. Design / Construction services. Testing / Certification / Training Services. Brazing / Heat-Treating Services. Cables / Wires / Assemblies. Capacitors / Resistors / Diodes. EMI / RFI Shielding / Filters. Fuses / Circuit Breakers. Hospital-Grade Cords / Plugs. PCBs / Embedded Computer Boards.
brinelco.com
Brinelco - Electronics Design & Engineering Services
http://www.brinelco.com/materials.html
Materials we currently use. Potting and encapsulating compounds can be specified by the customer or we can recommend suitable materials to be used for a particular application. Specifications of potting compound currently used. Additional resources for potting and encapsulation . Potting Solutions, LLC. Manufacturers of potting and coating compounds. Copps Industries, Inc.
stellaredit.com
Curriculum Vitae
http://www.stellaredit.com/Curriculum_Vitae.html
Expert Technical Editing and Science Writing. Valerie Coffey, Stellar Editorial Services. Freelance Science and Technology Writer/Editor. Riting of feature articles, science news, and industry news for. And academic clients, including American Institute of Physics. International planetarium script development for GOTO. 167; Writing and editing of market research reports for Optical Society of America. News writing, blogging, and social media networking on software, IT, and. Telecom for JAZD Markets.
masterbond-it.com
Schede Tecniche | MasterBond.com
http://www.masterbond-it.com/content/schede-tecniche
Adhesives, Sealants and Coatings. Le Schede Tecniche sono scritte da una squadra di ricerca e sviluppo della Master Bond in riguardo agli argomenti piu’ urgenti all’interno dell’industria adesiva. Sfoglia la nostra biblioteca di schede tecniche. If you're a human, don't change the following field). If you're a human, don't change the following field). Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications. Modulus, Poisson’s Ratio and Elongation. Adhesives for Space Applications.
imaps.org
IMAPS - ATW on Automotive Microelectronics and Packaging 2015
http://www.imaps.org/automotive
Session Chair Manual (PDF). Journal of Micro and Elect Pkg. 4th Advanced Technology Workshop and Tabletop Exhibition on. Automotive Microelectronics and Packaging. The Dearborn Inn, A Marriott Hotel. Dearborn, Michigan 48124 - USA. June 3-4, 2015. All photos courtesy of Heraeus. Kyocera America, Inc. Thank you to our Premier Sponsors:. And Thanks to our Media Sponsor:. Wednesday, June 3. Registration: 7:00 am - 6:00 pm. Continental Breakfast: 7:00 am - 8:00 am. Welcome and Introduction: 8:00 - 8:15 am.
electroiq.com
Toshiba develops world’s first 16-die stacked NAND flash memory with TSV tech | Solid State Technology
http://electroiq.com/blog/2015/08/toshiba-develops-worlds-first-16-die-stacked-nand-flash-memory-with-tsv-tech
LED PACKAGING AND TESTING. Toshiba develops world’s first 16-die stacked NAND flash memory with TSV tech. Today announced the development of the world’s first 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015. To be held from August 11 to 13 in Santa Clara, USA. 16-die Stacked NAND Flash Memory with TSV Technology (Photo: Business Wire). The prior art of stacked NAND flash memories. Easily post a comment below u...
electroiq.com
Materials and Equipment | Solid State Technology
http://electroiq.com/materials-and-equipment
LED PACKAGING AND TESTING. IFTLE 299 Siliconware's Ma Discusses Die Stacking Options for 2.5D. August 17, 2016. ASM’s Haukka ALD Award. August 01, 2016. Leveraging Reliability-Focused Foundry Rule Decks. July 27, 2016. July 18, 2016. Etch Abatement Needed at 200mm Fabs to Meet WSC Goals for 2020. July 13, 2016. Transition to ISO 9001:2015: Starting the Journey. October 21, 2015. MATERIALS AND EQUIPMENT ARTICLES. Advanced packaging: Hot topic at SEMICON Taiwan 2016. Worldwide semiconductor capital spendin...
electroiq.com
3D Integration | Solid State Technology
http://electroiq.com/3d-integration
LED PACKAGING AND TESTING. IFTLE 299 Siliconware's Ma Discusses Die Stacking Options for 2.5D. August 17, 2016. ASM’s Haukka ALD Award. August 01, 2016. Leveraging Reliability-Focused Foundry Rule Decks. July 27, 2016. July 18, 2016. Etch Abatement Needed at 200mm Fabs to Meet WSC Goals for 2020. July 13, 2016. Transition to ISO 9001:2015: Starting the Journey. October 21, 2015. Will fan-out packaging be sustainable long-term? TowerJazz and SMIC’s sales forecast to surge in 2016. Fan-Out Wafer Level Pack...
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