reconass.eu
Related EU Projects
http://www.reconass.eu/index.php/project/related-eu-projects
Scientific Methodology and Work Packages. Pilot Test - External Explosion Videos. Pilot Test - Internal Explosion Videos. This project is funded by the European Union.
i-kubed.com
Portfolio | I-kubed
http://www.i-kubed.com/portfolio
Http:/ www.i-kubed.com/wp-content/themes/smartbox-installable/. Http:/ www.i-kubed.com/. 39 340 5075858 - 39 348 3426367. Via Salita dei Molini 2, 38123, Trento. You are here: Home. Intelligent Infrastructure Innovation (Ikubed) è un offspring dell’Intelligent Infrastructure Group del Dipartimento di Ingegneria Civile, Ambientale e Meccanica dell’Università degli Studi di Trento. I soci fondatori, nel corso degli anni, hanno seguito direttamente le seguenti attività:. È un progetto che ha coinvolto il no...
cmst.be
Projects - Centre for Microsystems Technology (CMST) - Ghent University (Belgium)
http://www.cmst.be/projects/projects.html
Below is a list of running and finished (. Projects, grouped by funding type. Bilateral projects are not listed due to non-disclosure commitments. MSCA-IF-EF-ST - Standard EF). Ca = coordination action. Ip = integrated project. Sa = support action. Strp = specific targeted research projects. Nmp = nanotechnologies, materials and new production technologies. National funding, but European dimension). Fiber To The Home. Laser via formation in flexible substrates. Embeddable thin-chip packages (E-TChip).
cmst.elis.ugent.be
Projects - Centre for Microsystems Technology (CMST) - Ghent University (Belgium)
http://cmst.elis.ugent.be/projects/projects.html
Below is a list of running and finished (. Projects, grouped by funding type. Bilateral projects are not listed due to non-disclosure commitments. MSCA-IF-EF-ST - Standard EF). Ca = coordination action. Ip = integrated project. Sa = support action. Strp = specific targeted research projects. Nmp = nanotechnologies, materials and new production technologies. National funding, but European dimension). Fiber To The Home. Laser via formation in flexible substrates. Embeddable thin-chip packages (E-TChip).