microplexinc.com

Microplex, ceramic packaging manufacturer for industrial, commercial, and military applications since 1987

Microplex continues to be a supplier of high aspect ratio Through Glass Via (TGV) and Through Silicon Via (TSV) microelectronic components. Please take a look at these processing capabilities and click their links for more details:. SILICON VIA FILL (TSV). High conductivity hermetic thru vias can be fabricated in silicon, as wafers or panels. These silicon substrates are available with specified oxide layers and intrinsic conductivities. Via fill conductor metals of gold or copper are available. Hermetic...

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Microplex Inc

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Microplex, ceramic packaging manufacturer for industrial, commercial, and military applications since 1987 | microplexinc.com Reviews

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Microplex continues to be a supplier of high aspect ratio Through Glass Via (TGV) and Through Silicon Via (TSV) microelectronic components. Please take a look at these processing capabilities and click their links for more details:. SILICON VIA FILL (TSV). High conductivity hermetic thru vias can be fabricated in silicon, as wafers or panels. These silicon substrates are available with specified oxide layers and intrinsic conductivities. Via fill conductor metals of gold or copper are available. Hermetic...

<META> KEYWORDS

1 ceramic via fill

2 electrical feed throughs

3 thick film circuits

4 etched gold circuits

5 the microplex cleanroom

6 website design by

7 alan kindred design

8 coupons

9 reviews

10 scam

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ceramic via fill,electrical feed throughs,thick film circuits,etched gold circuits,the microplex cleanroom,website design by,alan kindred design

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Microplex, ceramic packaging manufacturer for industrial, commercial, and military applications since 1987 | microplexinc.com Reviews

https://microplexinc.com

Microplex continues to be a supplier of high aspect ratio Through Glass Via (TGV) and Through Silicon Via (TSV) microelectronic components. Please take a look at these processing capabilities and click their links for more details:. SILICON VIA FILL (TSV). High conductivity hermetic thru vias can be fabricated in silicon, as wafers or panels. These silicon substrates are available with specified oxide layers and intrinsic conductivities. Via fill conductor metals of gold or copper are available. Hermetic...

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microplexinc.com

1

Thick Film Circuits

http://www.microplexinc.com/thick_fc.html

PtAg (Platinum/Silver) and others. 01 OHM to 100 GIGAOHM. To 0156 microfarads printed on substrate higher values available in SMT or wire bonded chips. To 150 microhenrys printed on substrate higher values available in SMT or wire bonded chips. 3 MILS Printed 1 MIL Etched. LTCC (low-temp co-fired ceramic). Silicon Hole Fill TSV. High Frequency Power Chip Resistors. Hermitic Boxes and Packages.

2

Chip Resistors

http://www.microplexinc.com/chip_r.html

Eliminate expensive multiple screenings. Wrap-around terminations provide assembly ease and reliability. Allows high density packaging. Can be wave-soldered directly to the back of a P.C. board. Can be color-coded for identification. High reliability-manufactured to meet MIL-R-55342C standards (see chart). High purity alumina substrate. Precision performance resulting from tight TCP, close tracking and excellent environmental performance. Silicon Hole Fill TSV. High Frequency Power Chip Resistors.

3

Hermetic Boxes and Packages

http://www.microplexinc.com/hermetic_bap.html

Hermetic Interconnects for Enclosures, Boxes, or Hermetic Packages. Our hermetic hole fill capability allows designs that eliminates glass feed throughs in hermetic connectors. It allows the use of non-hermetic connectors or other electrical connection schemes in boxes or enclosures that need hermeticity. A hermetic package can be made by attaching a ring frame to substrate with hermetic holes. Silicon Hole Fill TSV. High Frequency Power Chip Resistors. Hermitic Boxes and Packages.

4

Ceramic Hole Fill

http://www.microplexinc.com/ceramic_hf.html

Microplex Hermetic Hole Fill for Ceramic Thin Film Circuits. Microplex has developed an ultra reliable hermetic hole fill process, hermetic hole fill,. Hermetic hole fill vs. non-hermetic hole fill:. Hermetic eliminates or minimizes bake out after wet processing, resulting in increased throughput. Hermetic eliminates blistering and cap blowout. Hermetic presents an opportunity to combine a package and a substrate for custom applications. This process results in improved yields and increased profitability.

5

High Frequency Power Chip Resistors

http://www.microplexinc.com/high_fpcr.html

High Frequency Power Chip Resistors. Microplex has developed power chip resistors with a top to bottom interconnect that enhances microwave performance at high frequencies. The chip resistor end terminations are replaced with filled slots connecting the top and bottom terminations. This approach reduces the impedance at high frequencies. The resistance and inductance are lower because of the increase of conductor material compared to the wraparound terminations. High frequency power chip slot design.

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microplexinc.com

Microplex, ceramic packaging manufacturer for industrial, commercial, and military applications since 1987

Microplex continues to be a supplier of high aspect ratio Through Glass Via (TGV) and Through Silicon Via (TSV) microelectronic components. Please take a look at these processing capabilities and click their links for more details:. SILICON VIA FILL (TSV). High conductivity hermetic thru vias can be fabricated in silicon, as wafers or panels. These silicon substrates are available with specified oxide layers and intrinsic conductivities. Via fill conductor metals of gold or copper are available. Hermetic...

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