4dchips.blogspot.com
Going Vertical - The 4D Chips Blog: EETimes: Momentum builds for 3-D chips
http://4dchips.blogspot.com/2011/04/eetimes-momentum-builds-for-3-d-chips.html
Going Vertical - The 4D Chips Blog. The era of increasing functionality by expanding die area is over. Much like boundary constrained urban areas, the only option is to Go Vertical. 4D Chips focuses on the community, technical challenges and business issues associated with building stacked die products. . EETimes: Momentum builds for 3-D chips. The wise folks over at EETimes. Have a nice piece. Identifying the "rise" (get it? I agree completely with this bit:. Subscribe to: Post Comments (Atom).
4dchips.blogspot.com
Going Vertical - The 4D Chips Blog: 2011/03
http://4dchips.blogspot.com/2011_03_01_archive.html
Going Vertical - The 4D Chips Blog. The era of increasing functionality by expanding die area is over. Much like boundary constrained urban areas, the only option is to Go Vertical. 4D Chips focuses on the community, technical challenges and business issues associated with building stacked die products. . Wow, Tabula Scores Some Serious $. Congratulations to the folks at Tabula. Links to this post. Subscribe to: Posts (Atom). Perspectives From the Leading Edge. Wow, Tabula Scores Some Serious $.
4dchips.blogspot.com
Going Vertical - The 4D Chips Blog: Wow, Tabula Scores Some Serious $$
http://4dchips.blogspot.com/2011/03/wow-tabula-scores-some-serious.html
Going Vertical - The 4D Chips Blog. The era of increasing functionality by expanding die area is over. Much like boundary constrained urban areas, the only option is to Go Vertical. 4D Chips focuses on the community, technical challenges and business issues associated with building stacked die products. . Wow, Tabula Scores Some Serious $. Congratulations to the folks at Tabula. Although, as mentioned previously. Anyway, back to Tabula, EETimes. Had a nice article. Subscribe to: Post Comments (Atom).
4dchips.blogspot.com
Going Vertical - The 4D Chips Blog: 2010/08
http://4dchips.blogspot.com/2010_08_01_archive.html
Going Vertical - The 4D Chips Blog. The era of increasing functionality by expanding die area is over. Much like boundary constrained urban areas, the only option is to Go Vertical. 4D Chips focuses on the community, technical challenges and business issues associated with building stacked die products. . Is it Packaging, or is it Fab? Theres an interesting story up on EDN. Titled Wafer-level packaging pushes past new mobile demands. Links to this post. Subscribe to: Posts (Atom).
4dchips.blogspot.com
Going Vertical - The 4D Chips Blog: 2011/04
http://4dchips.blogspot.com/2011_04_01_archive.html
Going Vertical - The 4D Chips Blog. The era of increasing functionality by expanding die area is over. Much like boundary constrained urban areas, the only option is to Go Vertical. 4D Chips focuses on the community, technical challenges and business issues associated with building stacked die products. . Another One Bites the Dust: National Semi. According to a story in the Wall Street Journal, TI. Plans to acquire National Semiconductor. Links to this post. EETimes: Momentum builds for 3-D chips.
3d-ics.com
3D IC Community
http://www.3d-ics.com/index.php
3D Packaging and TSV. Please contact us to see your advertisement here. Welcome to the community page of 3D-ICs. The industry is actively exploring 3D semiconductor technology for the next generation of logic and memory chips. This website is dedicated to keeping you informed about this exciting field. Our programs automatically mine the internet and provide you the latest news and literature. News, blogs and papers -. 3D Packaging and TSV News. Solution for PI, TI and SI Issues in 3D-ICs. Cooling Three-...
siliconservice.ro
Silicon Service
http://www.siliconservice.ro/partners.html
Students training/Research and development. Multiobjective partitioning for IC targeted at monolithic 3D technology. Fujitsu cooperation in development of Embedded systems solutions (HW and SW). The Association for Information Technology and Communications of Romania. Employer’s association of the software and services industry. Silicon Service SRL 53 Prof. D. Mangeron Blvd., Iasi, Romania.
4dchips.blogspot.com
Going Vertical - The 4D Chips Blog: 2010/02
http://4dchips.blogspot.com/2010_02_01_archive.html
Going Vertical - The 4D Chips Blog. The era of increasing functionality by expanding die area is over. Much like boundary constrained urban areas, the only option is to Go Vertical. 4D Chips focuses on the community, technical challenges and business issues associated with building stacked die products. . Great Blog: Perspectives From the Leading Edge. I recently came across another great blog, Perspectives From the Leading Edge. That focuses on vertical integration technology. Links to this post.
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