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SMT Issues & Answers

SMT Issues and Answers. Tuesday, July 13, 2010. Reflow Profile For Backward Compatibility. With tin lead eutectic composition one could easily get away by maintaining peak temperature between 190C to 225C, a variation of almost 35C and still achieve good reflow soldering results. This reflow process window narrows to 15C since the soldering needs to be done between 230C to 245C. With this tighter process window the importance of using product specific profile is becomes even more critical. Such a guess w...

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SMT Issues and Answers. Tuesday, July 13, 2010. Reflow Profile For Backward Compatibility. With tin lead eutectic composition one could easily get away by maintaining peak temperature between 190C to 225C, a variation of almost 35C and still achieve good reflow soldering results. This reflow process window narrows to 15C since the soldering needs to be done between 230C to 245C. With this tighter process window the importance of using product specific profile is becomes even more critical. Such a guess w...
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SMT Issues & Answers | rayprasad.blogspot.com Reviews

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SMT Issues and Answers. Tuesday, July 13, 2010. Reflow Profile For Backward Compatibility. With tin lead eutectic composition one could easily get away by maintaining peak temperature between 190C to 225C, a variation of almost 35C and still achieve good reflow soldering results. This reflow process window narrows to 15C since the soldering needs to be done between 230C to 245C. With this tighter process window the importance of using product specific profile is becomes even more critical. Such a guess w...

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SMT Issues & Answers: Baking and Bagging of PCBs for Lead Free Assemblies

http://rayprasad.blogspot.com/2010/07/baking-and-bagging-of-pcbs-for-lead.html

SMT Issues and Answers. Tuesday, July 13, 2010. Baking and Bagging of PCBs for Lead Free Assemblies. If your PCB supplier is not willing to bake and bag PCBs, it may be wise for you to take a conservative approach and bake the PCBs yourself if you are experiencing PCB delamination". April 14, 2011 at 12:44 AM. This comment has been removed by the author. June 1, 2011 at 9:26 PM. June 2, 2011 at 4:22 AM. This comment has been removed by the author. August 2, 2011 at 3:04 AM. November 1, 2011 at 2:58 AM.

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SMT Issues & Answers: Reflow Profile For Backward Compatibility

http://rayprasad.blogspot.com/2010/07/reflow-profile-for-backward.html

SMT Issues and Answers. Tuesday, July 13, 2010. Reflow Profile For Backward Compatibility. With tin lead eutectic composition one could easily get away by maintaining peak temperature between 190C to 225C, a variation of almost 35C and still achieve good reflow soldering results. This reflow process window narrows to 15C since the soldering needs to be done between 230C to 245C. With this tighter process window the importance of using product specific profile is becomes even more critical. Such a guess w...

3

SMT Issues & Answers: July 2010

http://rayprasad.blogspot.com/2010_07_01_archive.html

SMT Issues and Answers. Tuesday, July 13, 2010. Reflow Profile For Backward Compatibility. With tin lead eutectic composition one could easily get away by maintaining peak temperature between 190C to 225C, a variation of almost 35C and still achieve good reflow soldering results. This reflow process window narrows to 15C since the soldering needs to be done between 230C to 245C. With this tighter process window the importance of using product specific profile is becomes even more critical. Such a guess w...

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SMT Issues & Answers

SMT Issues and Answers. Tuesday, July 13, 2010. Reflow Profile For Backward Compatibility. With tin lead eutectic composition one could easily get away by maintaining peak temperature between 190C to 225C, a variation of almost 35C and still achieve good reflow soldering results. This reflow process window narrows to 15C since the soldering needs to be done between 230C to 245C. With this tighter process window the importance of using product specific profile is becomes even more critical. Such a guess w...

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