nano-microworkshop.com
Nano and Micro Manufacturing Workshop
http://www.nano-microworkshop.com/program.html
Workshop on Nano and Micro Manufacturing. May 22-23, 2013 - Dearborn, Michigan. Attendees will have access to the Museum's attractions during the reception and after the banquet dinner. The Herrick Professor of Engineering, University of Michigan. Chief Engineer, Profusa. Emeritus Professor, Electrical Engineering and Computer Science, University of Michigan. Kensall D. Wise. Emeritus Professor, Electrical Engineering and Computer Science, University of Michigan. Speaking for Avram Bar-Cohen. CNST Group ...
nano-microworkshop.com
Nano and Micro Manufacturing Workshop
http://www.nano-microworkshop.com/proceedings/index.html
Nano and Micro Manufacturing Workshop Proceedings. Speaker Abstracts, Bios, and Slides. Speaker Abstracts, Bios, and Slides. Nano and Micro Manufacturing Workshop Website. Additional Funding Provided by MEDC.
iwlpc.com
IWLPC - International Wafer Level Packaging Conference
http://www.iwlpc.com/call_for_papers.cfm
Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. International Wafer-Level Packaging Conference. The SMTA and Chip Scale Review. Are pleased to announce plans for the 13th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product ap...New M...
nano-microworkshop.com
Nano and Micro Manufacturing Workshop
http://www.nano-microworkshop.com/sponsors.html
Workshop on Nano and Micro Manufacturing. A distinguishing feature of the Workshop on Nano/Micro Manufacturing is the emphasis on the needs of manufacturers and technology users. Through sponsorship we seek to enhance the attendee experience and support invited speakers. Banner at the event. Name/logo on promotional items. Your promotional items distributed at registration. Two registration fees waived per sponsor. Recognition at banquet and during opening remarks. National Science Foundation (NSF).
meptec.org
MEPTEC 2015 MEMS TECHNOLOGY SYMPOSIUM
http://meptec.org/meptec2015memste.html
Join our MEPTEC email list. MEMS enabled products are at the center of the Internet of Things revolution. The availability of large numbers of reliable and cost-effective MEMS sensors and actuators has enabled an explosion in the number of IoT applications to reach the market. The Internet of Things is pushing MEMs technology to new levels of performance and bringing forth new requirements. This year we are partnering on a new event, the First Annual “Internet. Discounted pricing for attending both the M...
tsensorssummit.org
TSensors Summit Stanford
http://www.tsensorssummit.org/tsensorssummitst.html
250 registered attendees from 100 organizations from 14 countries. 54 speakers, including Next Steps session. 5 startups in the making in the audience, three focused on processing data from sensors,. One on networked sensor infrastructure and one on a new sensor. Select feedback from attendees:. Presentations quality matched TED. Belief that the future is bright. Presented new sensor based applications with ultrahigh volume potential. The presentations at TSensors Summit covered all of them. 2 or 3 day S...
iwlpc.com
Hotel and Travel Accommodations | IWLPC - International Wafer Level Packaging Conference
http://www.iwlpc.com/accommodations.cfm
Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. Hotel and Travel Accommodations. DoubleTree by Hilton San Jose. Places you in the center of it all less than a half-mile from San Jose International Airport, 45 minutes from San Francisco International Airport (SFO), and an hour south of San Francisco and north of Monterey/Carmel. Incredibly close to both Santa Clara University and San Jose State University, our hotel is a great place to stay for visiting families and friends.
iwlpc.com
IWLPC - International Wafer Level Packaging Conference
http://www.iwlpc.com/index.cfm
Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. And Chip Scale Review. Are pleased to announce the 13th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. Program Finalized and Registration Now Open! View the Conference brochure (PDF) for details. October 18, 2016.
iwlpc.com
IWLPC - International Wafer Level Packaging Conference
http://www.iwlpc.com/speaker_info.cfm
Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. This information is for authors who were notified that their paper was selected for presentation at the International Wafer-Level Packaging Conference. Your paper was selected by the Technical Committee and scheduled for presentation at IWLPC 2016 in San Jose, California. To help you prepare your technical paper and presentation, download the Speaker Manual. Please complete and return the Speaker Agreement Form. Your paper w...