samtecmicroelectronics.com

Samtec Microelectronics

A unique blend of unmatched Signal Integrity. And IC Packaging expertise positions Samtec. To provide full channel system support, effectively streamlining, and thereby optimizing, the signal path - from the IC to the board and beyond. Accuracy to /-3 microns. Manual, semi-automated and automated. Ceramic, laminate, HiTCE and Si on Si substrates. Gold stud bump thermocompression flip chip. Solder flip chip (Eutectic, high Pb, Pb-free RoHs). Capillary and jet underfill. Accuracy to /-3 microns. Temperatur...

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Samtec

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New●●●any , Indiana, 47150

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812●●●733

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Samtec Microelectronics | samtecmicroelectronics.com Reviews

<META> DESCRIPTION

A unique blend of unmatched Signal Integrity. And IC Packaging expertise positions Samtec. To provide full channel system support, effectively streamlining, and thereby optimizing, the signal path - from the IC to the board and beyond. Accuracy to /-3 microns. Manual, semi-automated and automated. Ceramic, laminate, HiTCE and Si on Si substrates. Gold stud bump thermocompression flip chip. Solder flip chip (Eutectic, high Pb, Pb-free RoHs). Capillary and jet underfill. Accuracy to /-3 microns. Temperatur...

<META> KEYWORDS

1 ic packaging

2 micro interposers

3 signal integrity

4 design guidelines

5 full channel solutions

6 samtec

7 microelectronics

8 advanced ic packaging

9 streamlined interconnect path

10 flip chip

CONTENT

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ic packaging,micro interposers,signal integrity,design guidelines,full channel solutions,samtec,microelectronics,advanced ic packaging,streamlined interconnect path,flip chip,maximum density,thermocompression flip chip,design rules,die attach,epoxy attach

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Samtec Microelectronics | samtecmicroelectronics.com Reviews

https://samtecmicroelectronics.com

A unique blend of unmatched Signal Integrity. And IC Packaging expertise positions Samtec. To provide full channel system support, effectively streamlining, and thereby optimizing, the signal path - from the IC to the board and beyond. Accuracy to /-3 microns. Manual, semi-automated and automated. Ceramic, laminate, HiTCE and Si on Si substrates. Gold stud bump thermocompression flip chip. Solder flip chip (Eutectic, high Pb, Pb-free RoHs). Capillary and jet underfill. Accuracy to /-3 microns. Temperatur...

INTERNAL PAGES

samtecmicroelectronics.com

1

Samtec Microelectronics Group

http://www.samtecmicroelectronics.com/projects/SliderM04

Discrete Wire and IDC Cable.

2

Samtec Microelectronics Group

http://www.samtecmicroelectronics.com/projects/SliderSI06

High Speed Edge Card. Samtec's high speed edge card sockets are ideal for parallel, perpendicular, coplanar and pass-through board-to-board applications. Pitch availability is from 0,50 mm (.0197") to 2,00 mm (.0787"), with total pin counts from 10 to 164. The popular HSEC8 Series provides exceptional signal integrity performance with its Edge Rate contacts. Edge card cable-to-board options are also available.

3

Samtec Microelectronics Group

http://www.samtecmicroelectronics.com/projects/SliderM03

Micro Rugged Tiger Eye. Samtec’s Tiger Eye multi-finger, BeCu contact system is extremely reliable and offers high mating cycles. It is available in rugged board-to-board, discrete wire and IDC cable-to-board interconnect systems. Additional ruggedizing features are available including screw downs, which assure connectors can only become intentionally unmated.

4

Samtec Microelectronics Group

http://www.samtecmicroelectronics.com/projects/SliderR03

5

Samtec Microelectronics Group

http://www.samtecmicroelectronics.com/projects/SliderSI04

RF Cables and Components. Samtec Sudden Service sets us apart: 24-hour samples and quotes, no minimum order quantity on standards, and 2 to 3 day lead times on standards. RF products include standard 50Ω and 75Ω solutions with mix-and-match cable end terminations and Samtec original isolated signal systems. Experience the service first-hand and create your RF system in seconds using Samtec's RF Solutionator by clicking the link below.

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mirrorsemi.com

IC Assembly services for open cavity QFN packages. List of 50 IC prototype packaging and IC assembly companies world wide with services and equipment to assemble open cavity IC packages. Microelectronic assembly, microelectronic pkg, microelectronic packag

http://www.mirrorsemi.com/assembly.html

Die attach, wirebonding and assembly services are available from:. 632 W 24th Street. Tempe, AZ 85282. Liverpool, NY 13090. 6541 Via Del Oro. San Jose, CA 95119. Colorado Springs, CO 80919. 1400 S. Sherman Street. Richardson, TX 75081. 6650 N. Harrison Ave. Loveland, CO 980538. Milpitas, CA 95035. 3845 E. Miraloma Ave, Suite-B. Anaheim, CA 92806. York, PA 17402. 3401 W. Warren Avenue. Fremont, CA 94538. 14930 TI Blvd #100. Dallas, TX 75243. 1141 N. Cosby Way, Unit G. Anaheim, CA 92806. Nashua, NH 03063.

samtec.com

High-Speed Board-to-Board Connectors and Systems | Samtec

https://www.samtec.com/connectors/high-speed-board-to-board.aspx

Search Using A Valid Part Number. Access Real-time High Speed. Backplane / Micro Backplane. High Speed Cable Assemblies. Passive Optical Cable Systems. For technical or design help to find products for your application, contact the Application Support Group. Rugged High Speed Strips. Compression / One Piece. 050" X .100" Systems. Four Row / High Density. One Piece Rugged and Power. High Speed Card Systems. Backplane / Micro Backplane. High Speed Backplane Systems. 100" Pitch Square Post Systems. Board-to...

samtec.com

Ultra Micro High-Speed Connectors | Samtec

https://www.samtec.com/connectors/high-speed-board-to-board/ultra-micro.aspx

Search Using A Valid Part Number. Access Real-time High Speed. Backplane / Micro Backplane. High Speed Cable Assemblies. Passive Optical Cable Systems. For technical or design help to find products for your application, contact the Application Support Group. Rugged High Speed Strips. Compression / One Piece. 050" X .100" Systems. Four Row / High Density. One Piece Rugged and Power. High Speed Card Systems. Backplane / Micro Backplane. High Speed Backplane Systems. 100" Pitch Square Post Systems. Ultra fi...

samtec.com

Micro Pitch Board-to-Board Connectors and Systems | Samtec

https://www.samtec.com/connectors/micro-pitch-board-to-board.aspx

Search Using A Valid Part Number. Access Real-time High Speed. Backplane / Micro Backplane. High Speed Cable Assemblies. Passive Optical Cable Systems. For technical or design help to find products for your application, contact the Application Support Group. Rugged High Speed Strips. Compression / One Piece. 050" X .100" Systems. Four Row / High Density. One Piece Rugged and Power. High Speed Card Systems. Backplane / Micro Backplane. High Speed Backplane Systems. 100" Pitch Square Post Systems. 050 (1&#...

samtec.com

Micro Pitch Board-to-Board Connectors and Systems | Samtec

https://www.samtec.com/connectors/micro-pitch-board-to-board/micro-pitch.aspx

Search Using A Valid Part Number. Access Real-time High Speed. Backplane / Micro Backplane. High Speed Cable Assemblies. Passive Optical Cable Systems. For technical or design help to find products for your application, contact the Application Support Group. Rugged High Speed Strips. Compression / One Piece. 050" X .100" Systems. Four Row / High Density. One Piece Rugged and Power. High Speed Card Systems. Backplane / Micro Backplane. High Speed Backplane Systems. 100" Pitch Square Post Systems. Ultra sl...

samtec.com

Connectors | Board-to-Board, Arrays, Mezzanine, Rugged, Edge Card, Backplane, Board Stacking

https://www.samtec.com/connectors.aspx

Search Using A Valid Part Number. Access Real-time High Speed. Backplane / Micro Backplane. High Speed Cable Assemblies. Passive Optical Cable Systems. For technical or design help to find products for your application, contact the Application Support Group. Rugged High Speed Strips. Compression / One Piece. 050" X .100" Systems. Four Row / High Density. One Piece Rugged and Power. High Speed Card Systems. Backplane / Micro Backplane. High Speed Backplane Systems. 100" Pitch Square Post Systems. Intercon...

samtec.com

Micro Pitch Rugged Connectors | Samtec

https://www.samtec.com/connectors/micro-pitch-board-to-board/micro-rugged.aspx

Search Using A Valid Part Number. Access Real-time High Speed. Backplane / Micro Backplane. High Speed Cable Assemblies. Passive Optical Cable Systems. For technical or design help to find products for your application, contact the Application Support Group. Rugged High Speed Strips. Compression / One Piece. 050" X .100" Systems. Four Row / High Density. One Piece Rugged and Power. High Speed Card Systems. Backplane / Micro Backplane. High Speed Backplane Systems. 100" Pitch Square Post Systems. Micro pi...

samtec.com

Rugged and Power Connectors | Samtec

https://www.samtec.com/connectors/rugged-power/power-systems.aspx

Search Using A Valid Part Number. Access Real-time High Speed. Backplane / Micro Backplane. High Speed Cable Assemblies. Passive Optical Cable Systems. For technical or design help to find products for your application, contact the Application Support Group. Rugged High Speed Strips. Compression / One Piece. 050" X .100" Systems. Four Row / High Density. One Piece Rugged and Power. High Speed Card Systems. Backplane / Micro Backplane. High Speed Backplane Systems. 100" Pitch Square Post Systems. PowerStr...

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samtecmicroelectronics.com

Samtec Microelectronics

A unique blend of unmatched Signal Integrity. And IC Packaging expertise positions Samtec. To provide full channel system support, effectively streamlining, and thereby optimizing, the signal path - from the IC to the board and beyond. Accuracy to /-3 microns. Manual, semi-automated and automated. Ceramic, laminate, HiTCE and Si on Si substrates. Gold stud bump thermocompression flip chip. Solder flip chip (Eutectic, high Pb, Pb-free RoHs). Capillary and jet underfill. Accuracy to /-3 microns. Temperatur...

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