sasictech.com

SASIC Tech

SASIC addresses among others, such challenging processing steps as the bottom contact hole etch and clean, an improved particle removal process without aggressive mechanical forces, edge bead removal that not only removes the edge bead photoresist, but also cleans the edge from particles and photoresist stripping for the mask industry. Offer enabling technology to help our semiconductor customers achieve high yields and reduce defectivity. Provide unique and innovative products.

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SASIC Tech | sasictech.com Reviews

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SASIC addresses among others, such challenging processing steps as the bottom contact hole etch and clean, an improved particle removal process without aggressive mechanical forces, edge bead removal that not only removes the edge bead photoresist, but also cleans the edge from particles and photoresist stripping for the mask industry. Offer enabling technology to help our semiconductor customers achieve high yields and reduce defectivity. Provide unique and innovative products.

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SASIC Tech | sasictech.com Reviews

https://sasictech.com

SASIC addresses among others, such challenging processing steps as the bottom contact hole etch and clean, an improved particle removal process without aggressive mechanical forces, edge bead removal that not only removes the edge bead photoresist, but also cleans the edge from particles and photoresist stripping for the mask industry. Offer enabling technology to help our semiconductor customers achieve high yields and reduce defectivity. Provide unique and innovative products.

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sasictech.com

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SASIC Tech Products

http://www.sasictech.com/html/sasic-products.htm

Wet Clean Particle Remover, an advanced particle and defect removal solution where particles can be removed even without applying mechanical force. The Electroscrub1 basic is the original particle removal solution and has a pH after dilution of about pH 9.5. The Electroscrub2 is a version where in addition to Electroscrub1; a mild abrasive is added for improved particle removal. Etch and Clean with unique properties. SASIC, has developed several OrganoEtch and OrganoClean solutions with unique properties.

2

SASIC Tech Product Applications

http://www.sasictech.com/html/sasic_prod_appl.htm

Contact Hole Etchant and Cleaner. Conventional diluted HF or buffered HF as used for the bottom contact hole etch and clean expands the CD of the sidewalls unevenly, since the etch rate of various oxides varies quite substantially depending on the specific oxide. The Buffered OrganoEtch1 can etch the bottom oxide and clean the contact hole without expanding the contact hole CD unevenly. DRAM Stacked Capacitor Etchant. Wet Particle Clean Solutions. Currently, the patterns on the wafer are becoming so smal...

3

SASIC Tech History

http://www.sasictech.com/html/sasic_his.htm

Semiconductor Analytical Services and Consulting (since 1995). Semiconductor Equipment Systems, Airborne Contamination Monitoring Systems, Optical Dryers, Optical Wet benches (since1997). Cleaning Chemicals for the Hard-Drive Industry (since 2000). Cleaning Chemicals for the Semiconductor Industry (since 2007).

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SASIC addresses among others, such challenging processing steps as the bottom contact hole etch and clean, an improved particle removal process without aggressive mechanical forces, edge bead removal that not only removes the edge bead photoresist, but also cleans the edge from particles and photoresist stripping for the mask industry. Offer enabling technology to help our semiconductor customers achieve high yields and reduce defectivity. Provide unique and innovative products.

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