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SEMICONDUCTORMATERIALS.COM

Semiconductor Materials Inc.

Used Wire I.D. Saw Sales. Expert knowledge and vast experience in the ID slicing process. In the spring of 1963, John A. Boujikian, inventor of the inside diameter (I.D.) slicing blade founded Semiconductor Materials, Inc. (SMI). His development was the start of large-scale microchip era. Together our expert knowledge and vast experience in the ID slicing process concludes our true professional status. ID Diamond Slicing Blade. OD diamond cut off wheels (Metal and Resin Bond, Plated). Torrance, CA 90502.

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Semiconductor Materials Inc. | semiconductormaterials.com Reviews
<META>
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Used Wire I.D. Saw Sales. Expert knowledge and vast experience in the ID slicing process. In the spring of 1963, John A. Boujikian, inventor of the inside diameter (I.D.) slicing blade founded Semiconductor Materials, Inc. (SMI). His development was the start of large-scale microchip era. Together our expert knowledge and vast experience in the ID slicing process concludes our true professional status. ID Diamond Slicing Blade. OD diamond cut off wheels (Metal and Resin Bond, Plated). Torrance, CA 90502.
<META>
KEYWORDS
1 general information
2 services
3 main products
4 edge grinding wheels
5 other products
6 band saw blades
7 core drills
8 dressing stones
9 semiconductor materials inc
10 phone
CONTENT
Page content here
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PAGE
general information,services,main products,edge grinding wheels,other products,band saw blades,core drills,dressing stones,semiconductor materials inc,phone,rboujikiansmi@yahoo com,email semico@pacbell net
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Semiconductor Materials Inc. | semiconductormaterials.com Reviews

https://semiconductormaterials.com

Used Wire I.D. Saw Sales. Expert knowledge and vast experience in the ID slicing process. In the spring of 1963, John A. Boujikian, inventor of the inside diameter (I.D.) slicing blade founded Semiconductor Materials, Inc. (SMI). His development was the start of large-scale microchip era. Together our expert knowledge and vast experience in the ID slicing process concludes our true professional status. ID Diamond Slicing Blade. OD diamond cut off wheels (Metal and Resin Bond, Plated). Torrance, CA 90502.

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Semiconductor Materials Inc.

http://www.semiconductormaterials.com/diamond-wire.html

Used Wire I.D. Saw Sales. 22108 S. Vermont Avenue Suite 101. Torrance, CA 90502. Call to inquire: 310 3285350. Website designed and developed by Espiritu Corporation.

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Semiconductor Materials Inc.

http://www.semiconductormaterials.com/edge-graiding-wheel.html

Used Wire I.D. Saw Sales. Semiconductor Materials, Inc., multi-layered edge grinding wheels are specifically designed to produce maximum yields by contour grinding of semiconductor wafers. Manufactured from Stainless Steel. 22108 S. Vermont Avenue Suite 101. Torrance, CA 90502. Call to inquire: 310 3285350. Website designed and developed by Espiritu Corporation.

3

Semiconductor Materials Inc.

http://www.semiconductormaterials.com/core-drill.html

Used Wire I.D. Saw Sales. Metal or Resin Bond. All sizes available .050 -4.0. 22108 S. Vermont Avenue Suite 101. Torrance, CA 90502. Call to inquire: 310 3285350. Website designed and developed by Espiritu Corporation.

4

Semiconductor Materials Inc.

http://www.semiconductormaterials.com/cup-wheel.html

Used Wire I.D. Saw Sales. 22108 S. Vermont Avenue Suite 101. Torrance, CA 90502. Call to inquire: 310 3285350. Website designed and developed by Espiritu Corporation.

5

Semiconductor Materials Inc.

http://www.semiconductormaterials.com/product.html

Used Wire I.D. Saw Sales. Semiconductor Materials, Inc(SMI), patented multi-layered diamond I.D. slicing blades are specifically designed and manufactured to maximize wfer yields in all types of semiconductor materials. Only the finest 100% natural virigin DeBeers diamonds are used to minimize wafer surface and subsurface damage. All blades, except the Mark VIII are manufactured under U.S. Patents 3205624, 3488892, 3640027 and other corresponding foreign patents. SMI MARK III 2/1 270/325. 34" OD. x 1...

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Used Wire I.D. Saw Sales. Expert knowledge and vast experience in the ID slicing process. In the spring of 1963, John A. Boujikian, inventor of the inside diameter (I.D.) slicing blade founded Semiconductor Materials, Inc. (SMI). His development was the start of large-scale microchip era. Together our expert knowledge and vast experience in the ID slicing process concludes our true professional status. ID Diamond Slicing Blade. OD diamond cut off wheels (Metal and Resin Bond, Plated). Torrance, CA 90502.

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