pgent.net
Semiconductor Industry Resources
http://www.pgent.net/industry_resources.htm
PG Enterprises, Inc. Servicing the Semiconductor Industry Since 1976. Wire Bonding Services R&D, Prototype, Rework. We specialize in the sales and service of manual wire bonders. We have an extensive inventory of used semiconductor process and assembly. Where to find these products. Where to find these services. Other supplies for the Industry. Dicing / Wafer Saws. Kulicke and Soffa Industries. A division of K&S). Solid State Equipment Corp. Semiconductor Packaging Materials (SPM). Design, Strategy, News.
semequip.blogspot.com
Semiconductor Equipment: June 2008
http://semequip.blogspot.com/2008_06_01_archive.html
In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Saturday, June 28, 2008. Strasbaugh 7AA wafer grinder. Axus Technology - CMP Equipment, Post-CMP Cleaning and Wafer Grinding Equipment. SEMICONDUCTOR AND MEMS PROCESS EQUIPMENT FOR CMP AND BACK GRINDING PROCESSES. Axus maintains an inventory of processing tools available, which are refurbished and configured to customer specifications. IPEC 472 and IPEC 372M. IPEC 776, Orbital Polisher. Axus Technology ma...
semequip.blogspot.com
Semiconductor Equipment: Wire Bonder 3200
http://semequip.blogspot.com/2009/03/wire-bonder-3200.html
In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Monday, March 9, 2009. The Wire Bonder 3200 offers a 30 µm pitch process capability. With its increased Y bond range it copes with the widest range of substrates. The improved air bearing and the optimized bond head controller enhance the ultra fine pitch capabilities,. With unprecedented placement accuracy, over the entire bond range. A dual cartridge programmable heater further extends the operational a...
ortec.co.il
אורטק: מוצרים
http://ortec.co.il/products.html
מערכות יצור להרכבת והלחמת רכיבי SMD ורכיבי החדרה בתעשיית האלקטרוניקה. תחום ציוד אוטומטי לבדיקות ,AOI, SPI בדיקות X-Ray ומערכות מטרולוגיה. מחסנים אוטומטיים לאיכסון רכיבי SMT בתקשורת עם תוכניות וקווי ההרכבה. ציוד הרכבות, הלחמות והדבקות לתעשיות המיקרואלקטרוניקה, רכיבי תקשורת אופטית ומערכות סולריות מבוססות CPV וסיליקון. ציוד להרכבות ובדיקות לתעשיות האופטרוניקה והלייזרים. מכונות יעודיות המתוכננות על פי דרישת לקוח לביצוע תהליכי יצור ספציפיים. מערכות הדמיה היפרספקטרליות לחישה מרחוק ומצלמות IR. מערכות אוטומטיות ...
pgenterprises.net
Semiconductor Industry Resources
http://www.pgenterprises.net/industry_resources.htm
PG Enterprises, Inc. Servicing the Semiconductor Industry Since 1976. Wire Bonding Services R&D, Prototype, Rework. We specialize in the sales and service of manual wire bonders. We have an extensive inventory of used semiconductor process and assembly. Where to find these products. Where to find these services. Other supplies for the Industry. Dicing / Wafer Saws. Kulicke and Soffa Industries. A division of K&S). Solid State Equipment Corp. Semiconductor Packaging Materials (SPM). Design, Strategy, News.
semequip.blogspot.com
Semiconductor Equipment: February 2007
http://semequip.blogspot.com/2007_02_01_archive.html
In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Thursday, February 15, 2007. Stacked Packages Get Thinner. By John Baliga, Contributing Editor -. Document.write(get publication('Semiconductor International') ;. Semiconductor International, 11/1/2006. The micro contacts themselves are. There are two basic process flows, but they both start with a sheet of copper foil that can be up to 120 µm thick. A thin (1 µm) layer of nickel is plated on top, fol...
semequip.blogspot.com
Semiconductor Equipment: March 2007
http://semequip.blogspot.com/2007_03_01_archive.html
In Front of Line (FOL) process, there are three main process. Die Prep, Die Attach and Wire Bonding. Saturday, March 17, 2007. Fine Pitch Au Wire Bonding. Fine Pitch Au Wire Bonding. Fine pitch wire bonding for bonding high density die is measured in pitch. This is a pitch that every year gets a little smaller. The limiting factor on the Palomar Model 8000 is generally the capillary. The model 8000 can bond with as little as 4 grams of force! Model 8000 Wire Bonder. Wire = .6 mil (15 um) 99.99 Au.
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