mems-russia.com
RAMEMS organized a business tour about the leading MEMS institutions of French Silicon Valley - Russian MEMS Association
http://www.mems-russia.com/content/view/98/72
Executive Director, Russian MEMS Association, Dr.Sc. (Tech). Ndash; are microelectromechanical systems, as a rule, based on a single crystal and being a combination of mechanical and electronic semiconductor structures. MEMS technologies are being used in a wide range of micro devices such as movement (accelerometers, gyroscopes, etc.) and pressure sensors, micro generators, mirrors, microphones, etc. Due to the various construction and usage types… read all text. February 14, 2013. It is worth mentionin...
set-na.com
Other Products - Setna
http://set-na.com/products/other-products
Subscribe To Rss Feed. SETNA is the distributor for Eastern USA of the IR Imaging Microscopes of the AST’s line. These microscopes are employed for sub-surface observation, imaging, verification, inspection of materials and bond integrity. Overlay alignment measurement and verification. Die alignment measurement and verification, (flip chip/hybridization). Sub-surface feature based measurements. Thickness measurements based on focus adjust Z. 3D Stacking process development and control. Chester, NH 03036.
set-na.com
Applications - Setna
http://set-na.com/applications
Subscribe To Rss Feed. Surface Preparation for Bonding:. SnAg, SAC, Cu, Ni, Ag, In, Au – reflow or TC bonding. Au-to-Au (demonstrated as low as 100 C). SiO2 to SiO2 (demonstrated at Room Temp.). Removes all traces of post-development PR residue. Replaces Oxygen RIE or UV-Ozone reduce oxides on exposed metals instead of growing them! Activates photoresist surface for excellent wetting during aqueous processes. Removes organic contamination without damaging sensitive mask materials. (EUVL-safe! SET - Smart...
set-na.com
admin, Author at Setna
http://set-na.com/author/admin
Subscribe To Rss Feed. Comparison of Ontos7 Treated and Un-Treated Cu Plating Base. Ontos 7 Treated SAC bumps on Si Chip. High-accuracy Bonding Experience, Equipment, and Materials. SETNA is a Manufacturing and Marketing, Sales and Service Organization centered on our experience and know-how in high-accuracy bonding and the equipment, materials, competencies surrounding it. 343 Meadow Fox Lane. Chester, NH 03036. Visit our Technology Section. For Information about DAAHTA Alliance.
set-na.com
Ontos7 - Setna
http://set-na.com/ontos7
Subscribe To Rss Feed. Do you have a surface problem? Process engineers know that native oxides and organic contamination on surfaces can disrupt subsequent processes such as solder bonding, wire bonding, thin film deposition, hybrid assembly, etc. Traditional methods of surface preparation, such as wet etching, fluxing, or vacuum plasma treatment, all have their drawbacks. Atmospheric Plasma System for Surface Preparation. Ontos7 is capable of reducing or oxidizing chemistries. With reducing chemist...
abreniaux.com
Expériences - CV - Alexandre Breniaux
http://www.abreniaux.com/cv/jobs
Gestion d'infrastructures complexes. Virtualisation des postes de travail. Disaster Recovery Plan management. Numéro valable 10 minutes. Coût de l'appel : span data-dyb-anonymized-bind=costPerCall /span , puis span data-dyb-anonymized-bind=costPerMinute /span la minute. Changement d'entreprise suite à l'aquisition de LANexpert par Swisscom. Mise en place et test de Disaster Recovery Plan. Respect des engagements, des niveaux de services attendus et de la qualité de service. Site web de l'entreprise.
set-na.com
LDP150 - Setna
http://set-na.com/products/ldp150
Subscribe To Rss Feed. LDP150 Large Device Bonding Press. The LDP150 is an Electrical Press especially designed for bonding large light or radiation detectors (50 150 mm). It uses compression process at room temperature (thermo-compression option available). A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150. Up to 100,000N) and controlled force. Profile ensure bond join quality. Component Size / Tooling. Up to 40 mm.
abreniaux.com
Administrateur réseaux et systèmes SET SAS - CV - Alexandre Breniaux
http://www.abreniaux.com/cv/jobs/set-sas_0
Gestion d'infrastructures complexes. Virtualisation des postes de travail. Disaster Recovery Plan management. Numéro valable 10 minutes. Coût de l'appel : span data-dyb-anonymized-bind=costPerCall /span , puis span data-dyb-anonymized-bind=costPerMinute /span la minute. Administrateur réseaux et systèmes. Septembre 2007 à Décembre 2008. Fonction de helpdesk pour les utilisateurs internes. Gestion des postes de travail et de l'infrastructure. Projets d'évolution de l'infrastructure. Partager ce CV sur.
set-na.com
ACCµRA100 - Setna
http://set-na.com/products/acc100
Subscribe To Rss Feed. ACCµRA 100: Education and R&D oriented, High Accuracy Flip-Chip Bonder. The ACCµRA 100 is a semi-automatic flip-chip bonder that guarantees 0.5 µm placement accuracy. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA 100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes. Post-bonding accuracy* ( 0,5 μm). Easy to use and very flexible. Quick set-up of new applications. Data,...
set-na.com
Home Page Welcome Archives - Setna
http://set-na.com/category/home-page-welcome
Subscribe To Rss Feed. High-accuracy Bonding Experience, Equipment, and Materials. On Mar 10, 2014. High-accuracy Bonding Experience, Equipment, and Materials. SETNA is a Manufacturing and Marketing, Sales and Service Organization centered on our experience and know-how in high-accuracy bonding and the equipment, materials, competencies surrounding it. High-accuracy Bonding Experience, Equipment, and Materials. 343 Meadow Fox Lane. Chester, NH 03036. Visit our Technology Section.