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Flip Chip and Chip to Chip bonding, Die Bonders, Direct Metallic Bonding: SET Corporation SA

For flip chip bonding, chip-to-chip bonding, chip-to-wafer and direct metallic bonding, SET offers flexible flip chip bonders and die bonders that can align and bond components with submicron post-bond accuracy.

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Flip Chip and Chip to Chip bonding, Die Bonders, Direct Metallic Bonding: SET Corporation SA | set-sas.fr Reviews
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For flip chip bonding, chip-to-chip bonding, chip-to-wafer and direct metallic bonding, SET offers flexible flip chip bonders and die bonders that can align and bond components with submicron post-bond accuracy.
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1 chip to chip bonding
2 bonding
3 chip bonding
4 die bonder
5 flip chip
6 direct metallic bonding
7 metallic bonding
8 die bonder
9 device bonder
10 die bonders
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Flip Chip and Chip to Chip bonding, Die Bonders, Direct Metallic Bonding: SET Corporation SA | set-sas.fr Reviews

https://set-sas.fr

For flip chip bonding, chip-to-chip bonding, chip-to-wafer and direct metallic bonding, SET offers flexible flip chip bonders and die bonders that can align and bond components with submicron post-bond accuracy.

INTERNAL PAGES

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1

SET - Missions & Values

http://www.set-sas.fr/en/pag-424068-Missions---Values.html

SET Insights / e-News. Strong focus on High End Device Bonding and Nano Imprinting Solutions. SET offers a complete range of accurate Device Bonders – manual, automated and production – that cover every high end bonding needs and requirements. The experience acquired for over 30 years of development benefits to our Nano Imprint Solutions. Customized Solutions to specific needs. Our priority is helping our customers; from the process definition to the application support and their needs evolutions.

2

SET - Conference Proceedings

http://www.set-sas.fr/en/pag-424057-Proceedings.html

SET Insights / e-News. SET Insights / e-News. At SET, we attach great importance to the quality of information we provide to our customers. Therefore on a regular basis new conference proceedings will be posted. You can register your interest by completing the inquiry form below. The latest conference proceedings that match your interests will be automatically sent to you. FROM / PRESENTED AT. High Accuracy Flip-Chip Equipement. Presented by Nicolas Raynaud from SET. At ORION - Moscow. May 28th, 2014.

3

SET Newsroom: Product News, Technical Papers, Press Releases

http://www.set-sas.fr/en/pag-423769-News---Events.html

SET Insights / e-News. SET Insights / e-News. SET was present at ECTC, a major conference on packaging, in Las Vegas from May 31. 2016It permitted to attend several interesting presentations, in particular those from CEA-Leti and discuss with researchers and customers. To learn more on Minalogic: www.minalogic.org. ACCµRA100 HIGH ACCURACY BONDER. It is the perfect equipment for universities and R&D institutes. ACCµRA OPTO FLIP CHIP BONDER. ACCµRA M FLIP CHIP BONDER. The ACCμRA M is a manual flip-chi...

4

SET - Customer Trainings & Application Support

http://www.set-sas.fr/en/pag-427789-Customer-Trainings.html

SET Insights / e-News. Our highly competent support teams provide in-depth trainings. Which enable our customers to derive maximum benefit from our Die Bonders. Training is conducted either at SET facilities or at our customers’ own production facilities. We propose two types of trainings: User. We also provide Application Support to enable you to get the best performances out of our bonders. For more information about the schedule or the content of each training, please contact:. 33 (0)450 35 83 92.

5

SET Newsletter - SET insights: Technical Papers, Product News

http://www.set-sas.fr/en/pag-424049-SET-Insights---e-News.html

SET Insights / e-News. SET Insights / e-News. Our e-newsletter, titled SET. Contains information about new product options. It also encompasses the latest technical papers written by some of our clients regarding cutting-edge bonding applications. Below are the published issues of SET. We hope you will enjoy reading them! SET Insights N°15. SET Insights N°14. SET Insights N°13. SET Insights N°12. SET Insights N°9. SET Insights N°8. SET Insights N°7. SET Insights N°6. SET Insights N°5. SET Insights N°4.

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mems-russia.com mems-russia.com

RAMEMS organized a business tour about the leading MEMS institutions of French Silicon Valley - Russian MEMS Association

http://www.mems-russia.com/content/view/98/72

Executive Director, Russian MEMS Association, Dr.Sc. (Tech). Ndash; are microelectromechanical systems, as a rule, based on a single crystal and being a combination of mechanical and electronic semiconductor structures. MEMS technologies are being used in a wide range of micro devices such as movement (accelerometers, gyroscopes, etc.) and pressure sensors, micro generators, mirrors, microphones, etc. Due to the various construction and usage types… read all text. February 14, 2013. It is worth mentionin...

set-na.com set-na.com

Other Products - Setna

http://set-na.com/products/other-products

Subscribe To Rss Feed. SETNA is the distributor for Eastern USA of the IR Imaging Microscopes of the AST’s line. These microscopes are employed for sub-surface observation, imaging, verification, inspection of materials and bond integrity. Overlay alignment measurement and verification. Die alignment measurement and verification, (flip chip/hybridization). Sub-surface feature based measurements. Thickness measurements based on focus adjust Z. 3D Stacking process development and control. Chester, NH 03036.

set-na.com set-na.com

Applications - Setna

http://set-na.com/applications

Subscribe To Rss Feed. Surface Preparation for Bonding:. SnAg, SAC, Cu, Ni, Ag, In, Au – reflow or TC bonding. Au-to-Au (demonstrated as low as 100 C). SiO2 to SiO2 (demonstrated at Room Temp.). Removes all traces of post-development PR residue. Replaces Oxygen RIE or UV-Ozone reduce oxides on exposed metals instead of growing them! Activates photoresist surface for excellent wetting during aqueous processes. Removes organic contamination without damaging sensitive mask materials. (EUVL-safe! SET - Smart...

set-na.com set-na.com

admin, Author at Setna

http://set-na.com/author/admin

Subscribe To Rss Feed. Comparison of Ontos7 Treated and Un-Treated Cu Plating Base. Ontos 7 Treated SAC bumps on Si Chip. High-accuracy Bonding Experience, Equipment, and Materials. SETNA is a Manufacturing and Marketing, Sales and Service Organization centered on our experience and know-how in high-accuracy bonding and the equipment, materials, competencies surrounding it. 343 Meadow Fox Lane. Chester, NH 03036. Visit our Technology Section. For Information about DAAHTA Alliance.

set-na.com set-na.com

Ontos7 - Setna

http://set-na.com/ontos7

Subscribe To Rss Feed. Do you have a surface problem? Process engineers know that native oxides and organic contamination on surfaces can disrupt subsequent processes such as solder bonding, wire bonding, thin film deposition, hybrid assembly, etc. Traditional methods of surface preparation, such as wet etching, fluxing, or vacuum plasma treatment, all have their drawbacks. Atmospheric Plasma System for Surface Preparation. Ontos7 is capable of reducing or oxidizing chemistries. With reducing chemist...

abreniaux.com abreniaux.com

Expériences - CV - Alexandre Breniaux

http://www.abreniaux.com/cv/jobs

Gestion d'infrastructures complexes. Virtualisation des postes de travail. Disaster Recovery Plan management. Numéro valable 10 minutes. Coût de l'appel : span data-dyb-anonymized-bind=costPerCall /span , puis span data-dyb-anonymized-bind=costPerMinute /span la minute. Changement d'entreprise suite à l'aquisition de LANexpert par Swisscom. Mise en place et test de Disaster Recovery Plan. Respect des engagements, des niveaux de services attendus et de la qualité de service. Site web de l'entreprise.

set-na.com set-na.com

LDP150 - Setna

http://set-na.com/products/ldp150

Subscribe To Rss Feed. LDP150 Large Device Bonding Press. The LDP150 is an Electrical Press especially designed for bonding large light or radiation detectors (50 150 mm). It uses compression process at room temperature (thermo-compression option available). A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150. Up to 100,000N) and controlled force. Profile ensure bond join quality. Component Size / Tooling. Up to 40 mm.

abreniaux.com abreniaux.com

Administrateur réseaux et systèmes SET SAS - CV - Alexandre Breniaux

http://www.abreniaux.com/cv/jobs/set-sas_0

Gestion d'infrastructures complexes. Virtualisation des postes de travail. Disaster Recovery Plan management. Numéro valable 10 minutes. Coût de l'appel : span data-dyb-anonymized-bind=costPerCall /span , puis span data-dyb-anonymized-bind=costPerMinute /span la minute. Administrateur réseaux et systèmes. Septembre 2007 à Décembre 2008. Fonction de helpdesk pour les utilisateurs internes. Gestion des postes de travail et de l'infrastructure. Projets d'évolution de l'infrastructure. Partager ce CV sur.

set-na.com set-na.com

ACCµRA100 - Setna

http://set-na.com/products/acc100

Subscribe To Rss Feed. ACCµRA 100: Education and R&D oriented, High Accuracy Flip-Chip Bonder. The ACCµRA 100 is a semi-automatic flip-chip bonder that guarantees 0.5 µm placement accuracy. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA 100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes. Post-bonding accuracy* ( 0,5 μm). Easy to use and very flexible. Quick set-up of new applications. Data,...

set-na.com set-na.com

Home Page Welcome Archives - Setna

http://set-na.com/category/home-page-welcome

Subscribe To Rss Feed. High-accuracy Bonding Experience, Equipment, and Materials. On Mar 10, 2014. High-accuracy Bonding Experience, Equipment, and Materials. SETNA is a Manufacturing and Marketing, Sales and Service Organization centered on our experience and know-how in high-accuracy bonding and the equipment, materials, competencies surrounding it. High-accuracy Bonding Experience, Equipment, and Materials. 343 Meadow Fox Lane. Chester, NH 03036. Visit our Technology Section.

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Сетевые сообщества Самарской области. Среда, 2 мая 2012 г. Больше половины участников "Тотального диктанта" получили "неуд". Организаторы подвели итоги акции по проверке грамотности "Тотальный диктант", сообщает пресс-служба фонда "Тотальный диктант". 21 апреля в акции "Тотальный диктант -2012" приняли участие 15 тысяч человек из 85 городов. Среди них были не только россияне - на знание русского языка решили проверить себя жители Берлина и Бостона, Лондона и Парижа. 10% - на "хорошо",. Координатор акции ...

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Домен www.set-samara.ru зарегистрирован. Через сервис регистрации доменов и хостинга *.ru-tld.ru. Регистрация доменов в зоне:. RU от 88 руб. Рф от 88 руб. SU от 280 руб. 2008-2014 Сервис регистрации доменов и хостинга *.RU-TLD.RU.

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Flip Chip and Chip to Chip bonding, Die Bonders, Direct Metallic Bonding: SET Corporation SA

SET Insights / e-News. SET The World’s Leading Supplier of High Accuracy Bonders. FC300R. The Union of Precision and Automation for 3D Integration. Watch the FC300R video! To keep up-to-date with recent developments on Device Bonding :. Sign-up and read SET Insights. Chip­-to­-Wafer Direct ­Metallic Bonding technology developed at Leti used in customized 300 mm Device Bonder. SEMICON Taiwan 2015, September 2-4, 2015 - TWTC Nangang Exhibition Hall, Taipei, Taiwan. Discover our brand new machine!

set-scc.com set-scc.com

OTM Consultancy - SET-SCC

SET Supply Chain Consulting offers professional and effective supply chain consulting services. In addition to a comprehensive knowledge of Supply Chain, Logistics and 4PL processes, SET Supply Chain Consulting can also provide working experience of Transportation Management Systems - in particular OTM (Oracle Transportation Management) and i2 s TMS. SET Supply Chain Consulting can offer you;. OTM implementation and Application Maintenance. Configuration and Modification of OTM Agents.

set-scene.com set-scene.com

setscene

Mistake of a Set/Movie. HZO Film & Medien. Mistake of a Set/Movie. HZO Film & Medien. 10000 movie sets out of 210 films of cinema history. This helps getting acquainted with movies in a new, innovative manner:. Where are scenes of comedies or horror movies set? Do some directors prefer specific sets, locations, settings? Which movies have been set in trains, a skyscraper, a wine cellar, etc? What's the use of it? For studying scenography, lighting design and the practice of décor at the scenery.

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SET - HR Gruppe

SET Schiffbau- u. Entwicklungsgesellschaft Tangermünde mbH. WIR BEGRÜSSEN SIE AUF UNSERER INTERNETPRÄSENZ. Die Firmensitze befinden sich in Tangermünde und Genthin. Die Fertigkeiten der SET ist schwerpunktmäßig ausgerichtet auf Neu- und Umbau von Fahrgastschiffen, Polizeibooten und Frachtschiffen. Die Firma SET erledigt Kundenaufträge von der Konstruktion über die Werkstattplanung bis hin zur Montage von ausgerüsteten Binnenschiffen. SET Schiffbau u. Entwicklungs-. Tel: 49 39322 993 -0. Fax: 49 39322 2442.

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Schwimmbadtechnik aus einer Hand. Golden Wave" für Silent. SET Energietechnik GmbH beim „Golden Wave“ 2013 ausgezeichnet Eine . Wir bieten Ihnen alles aus einer Hand. Beratung bei der Planung von Schwimmbädern, computergesteuerte Auswahl-Analysen zu optimal passenden SET Isolierungs- und Luftführungssystemen, Entfeuchtungsgeräten und Wärmepumpen. Und zur Realisierung Ihrer Wellness-Oase kompetente SET-Fachhändler in Ihrer Nähe.

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