We provide quick turn precision laser dicing of various materials. Customers include telecommunications, biotech, medical, the semiconductor industry and many others.
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American Precision Dicing
Paul Moran
642 Gi●●●●●● Court
San●●●ose , California, 95133
United States
View this contact
American Precision Dicing
Paul Moran
642 Gi●●●●●● Court
San●●●ose , California, 95133
United States
View this contact
American Precision Dicing
Paul Moran
642 Gi●●●●●● Court
San●●●ose , California, 95133
United States
View this contact
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American Precision Dicing - Fast Turn Laser Dicing | silicon-chips.com Reviews
https://silicon-chips.com
We provide quick turn precision laser dicing of various materials. Customers include telecommunications, biotech, medical, the semiconductor industry and many others.
American Precision Dicing, Inc. - Quick turn wafer dicing
http://www.wafer-dicing.com/index.htm
Creative solutions to challenging micromachining problems, using precision diamond dicing blades. To cut and machine a variety of hard brittle materials. To be one of the fastest quick turn dicing. Shops in the world, filling a critical customer need for fast, high quality work. For excellence has resulted in an impressive customer base of whom it feels extremely proud. To see what we can do. For you. Email. Or phone 408 254-1600. 169; 2000 - American Precision Dicing, Inc.
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此页面上的内容需要较新版本的 Adobe Flash Player。 是生产工业硅粉 金属硅粉 、金属硅、微硅粉和高纯度硅溶胶 液体二氧化硅 等硅制品的专业公司…… 了解更多. 电 话 0531-85600541 85604298. 页面版权 济南银丰硅制品有限责任公司 地址 山东济南西外环路美里湖开发区 Email: silicon@silicon-china.com.
Silicon Chip
LPCVD and PECVD Nitride. Thermal Oxide (Wet and Dry). Call 1-800-216-8349 / Fax 888-832-0340 or email chris@universitywafer.com. Please let us know what specs you need quoted by filling out the form below. Special 2 wafers $24.90 each. Undoped, Highly doped Thick and partial cassettes 1-12, All Grades and Coin roll! 3 and 4 Specials $100.00 each. All Diameter and Dimensions. 4 500um DSP $29.90 each. At, ST, X, Y, Z, Seeded and Seedless. Single Crystal - AllÂ. Undoped, N and P Doped. Â 4 also available.
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American Precision Dicing - Fast Turn Laser Dicing
APD proudly announces the availability of a wafer dicing process utilizing the Synova Laser Microjet. This is a wet laser process similar to a conventional semiconductor sawing process. This machine can process wafers up to 12" in diameter. It can place cuts with 1 micron accuracy. The width of the kerf will be the width of the water jet. Even though these machines can cut with a kerf smaller than 50 microns we are currently limited to a kerf no smaller than 80 microns. Hazardous materials, such as galli...
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