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Tsukuba International Conference on Materials Science (TICMS)

Research exchanges and promotion of business-related materials science disciplines

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Tsukuba International Conference on Materials Science (TICMS) | ticonfms.tsukuba.ac.jp Reviews
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Research exchanges and promotion of business-related materials science disciplines
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invitation and scope,kenichi hino,ticms organizing committee,general chair,university of tsukuba,steering chair,masashi kijima,program,committee members,jae ii kim,dong a,university,anak khantachawana,jean christophe valmalette,university of,toulon,venue
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Tsukuba International Conference on Materials Science (TICMS) | ticonfms.tsukuba.ac.jp Reviews

https://ticonfms.tsukuba.ac.jp

Research exchanges and promotion of business-related materials science disciplines

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ticonfms.tsukuba.ac.jp ticonfms.tsukuba.ac.jp
1

TICMS & IWP Joint Workshop on Conjugated Polymers – Tsukuba International Conference on Materials Science (TICMS)

http://www.ticonfms.tsukuba.ac.jp/ticms_iwp

Tsukuba International Conference on Materials Science(TICMS) 2013. TICMS & IWP Joint Workshop on Conjugated Polymers. TICMS & IWP Joint Workshop on Conjugated Polymers. Workshop chair: Masashi Kijima (Univ. Tsukuba, Japan). Special Invited speaker: Uwe H. F. Bunz, (Ruprecht Karl Univ. Heidelberg, Germany). September 5th, 2013. University of Tsukuba (Daigakukaikan Conference Room), Japan. Abstract submission (deadline: July 31, 2013) is closed. IOP Conference Series: Materials Science and Engineering.

2

International Workshop on Science and Patents (IWP) 2013 – Tsukuba International Conference on Materials Science (TICMS)

http://www.ticonfms.tsukuba.ac.jp/iwp2013

Tsukuba International Conference on Materials Science(TICMS) 2013. International Workshop on Science and Patents (IWP) 2013. International Workshop on Science and Patents (IWP) 2013. De SILVA A. Prasanna, Prof. Queens Univ., UK. KOIZUMI, Hiroyasu, Prof. University of Tsukuba, Japan. YODA, Satoshi, Dr. AIST, Japan. KIEBOOMS Rafaël H. L., Dr. European Patent Office,The Netherlands. MOCHIDA, Madoka KEK, Japan. NAKAO, Reiko, Dr. AIST, Japan. UCHIDA, Natsuko University of Tsukuba, Japan. September 6 th, 2013.

3

Interdisciplinary Workshop on Science and Patents (IWP) 2015 — High School Section – Tsukuba International Conference on Materials Science (TICMS)

http://www.ticonfms.tsukuba.ac.jp/iwp2014

Tsukuba International Conference on Materials Science(TICMS) 2013. Interdisciplinary Workshop on Science and Patents (IWP) 2015 — High School Section. Interdisciplinary Workshop on Science and Patents (IWP) 2015 — High School Section. Interdisciplinary Workshop on Science and Patent 2015. 筑波大学数理物質系、応用理工学類後藤博正までメールで申し込み: E-mail: gotoh at ims.tsukuba.ac.jp. 英文アブストラクトを gotoh at ims.tsukuba.ac.jp. Download a template for abstract (MS-Word).

4

International Workshop on Science and Patents (IWP) 2014 – Tsukuba International Conference on Materials Science (TICMS)

http://www.ticonfms.tsukuba.ac.jp/iwp2014old

Tsukuba International Conference on Materials Science(TICMS) 2013. International Workshop on Science and Patents (IWP) 2014. International Workshop on Science and Patents (IWP) 2014. September 5th, 2014. University of Tsukuba ( University Hall, 30th Anniversary Hall. Registration fees are free for all participants, who registered his/her name and title, affiliation, and e-mail address by sending e-mail to goto[at]ims.tsukuba.ac.jp (change [at] to @) with a message subject of ‘IWP2014’.

5

Interdisciplinary Workshop on Science and Patents (IWP) 2015 – Tsukuba International Conference on Materials Science (TICMS)

http://www.ticonfms.tsukuba.ac.jp/iwp2015

Tsukuba International Conference on Materials Science(TICMS) 2013. Interdisciplinary Workshop on Science and Patents (IWP) 2015. Interdisciplinary Workshop on Science and Patents (IWP) 2015. Interdisciplinary Workshop on Science and Patent 2015. ヨーロッパ特許庁Dr, MBA, Rafael Kiebooms氏の来日を記念し、第一回IWPが2011年に行われ、以来現在までに科学全分野での交流と大学院生や、ポスドクなどの方をエンカレッジすることを目標として毎年開催されております。 一般研究者に加え、学部 (学類 (Undergraduate の方のご発表も募集します。 申し込み [英文アブストラクト 口頭発表用パワーポイント1枚] 後藤へメール. 申し込み締め切り2015 年7 月31 日. 8212;—— Call for papers!

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