TLMICORP.COM
TLMI Corp | Wafer Bumping and Pad RedistributionTLMI Corp is a Full Service Wafer Bumping and Pad Redistribution company. Offering a wide range of copper, indium , gold, and solder bumping services.
http://www.tlmicorp.com/
TLMI Corp is a Full Service Wafer Bumping and Pad Redistribution company. Offering a wide range of copper, indium , gold, and solder bumping services.
http://www.tlmicorp.com/
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TLMI Corp | Wafer Bumping and Pad Redistribution | tlmicorp.com Reviews
https://tlmicorp.com
TLMI Corp is a Full Service Wafer Bumping and Pad Redistribution company. Offering a wide range of copper, indium , gold, and solder bumping services.
tlmicorp.com
TLMI Corp | Solder Bumping
http://tlmicorp.com/extra-view/copper-indium-and-bumping
RDL Layout Guidelines for wafer level chip scale packaging VIA 1 Repassivation Minimum. Layout Guidelines Copper Bumps (Solder, Nickel, Gold or Indium Cap) 1 Bump Height. Layout Guidelines Indium Bumps 1 Bump Height Average 35 µm std. (Capability: 5-50. Layout Guidelines Gold Bumps 1 Bump Height Average 18 µm and 25 µm. Layout Guidelines Solder Bumps 1 Standard Bump Height 100 µm (Available: 15 –. SEO and Web Design by White Hat Marketing Group Ausitn, TX".
TLMI Corp | Gold Bumping
http://tlmicorp.com/services-view/gold-bumping
18 µm and 25 µm std. (Capability: 2-50 µm). 5% (in die); 10% (in wfr); 15% (wfr to wfr). 50 µm Minimum (bump size dependence). 18 µm Minimum (bump height dependence). Bump to Passivation Overlap. 7 µm Per Side Minimum. Edge of Bump to Aluminum. 7 µm Per Side Minimum. Passivation Angle of Slope. Nitride, OxyNitride, Polyimide. 08 – 1.8 um. Bump Mask Layout and Procurement. TLMI In-house Capability: Requires GDSII, Stepping Distance, Wafer Map. 999 % pure Gold. 40 – 70 Vickers (Annealed). To post a comment.
TLMI Corp | Solder Bumping
http://tlmicorp.com/services-view/solder-bumping
100 µm (Available: 15 – 150 µm). 5% (in die); 15% (in wfr); 20% (wfr to wfr). 150 µm Standard ( Fine Pitch Available = 25 µm) Bump Height Dependence. 75 µm Std. (Bump Size Dependence). Bump to Passivation Overlap. 8 µm Per Side Minimum (10 um preferred). Edge of Bump to Aluminum. 7 µm Per Side Minimum. 20 µm (Bump size Dependence). Passivation Angle of Slope. Nitride, OxyNitride, Polyimide. Wafer Edge Exclusion Zone. Bump Mask Layout and Procurement. Sn/Pb any ratio, Low Alpha, Sn/Ag/Cu, Sn/Ag.
TLMI Corp | Solder Bumping
http://tlmicorp.com/extra-view/pad-redistribution
RDL Layout Guidelines for wafer level chip scale packaging VIA 1 Repassivation Minimum. Layout Guidelines Copper Bumps (Solder, Nickel, Gold or Indium Cap) 1 Bump Height. Layout Guidelines Indium Bumps 1 Bump Height Average 35 µm std. (Capability: 5-50. Layout Guidelines Gold Bumps 1 Bump Height Average 18 µm and 25 µm. Layout Guidelines Solder Bumps 1 Standard Bump Height 100 µm (Available: 15 –. SEO and Web Design by White Hat Marketing Group Ausitn, TX".
TLMI Corp | Other Services
http://tlmicorp.com/services-view/other-services
Click here to cancel reply. You must be logged in. To post a comment. SEO and Web Design by White Hat Marketing Group Ausitn, TX".
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Interconnect Solutions
http://www.privatran.com/interconnect.htm
Bull; Integration of cantilever springs in Al and Cu metal redistribution layers for advanced packaging technology for use in high thermal stress environments. Bull; Cu/Sn pillar bonding using custom epoxy formulation for thermal compression bonding. Bull; 3D chip stacking and extreme thinning of SOI wafers. Bull; Low profile ( 10 µm) die thickness and formation of inter-wafer through via. Whether your interface requires wire-bonding or advanced small-pitch bump bonding, the PrivaTran team can design and...
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TLMI Corp | Wafer Bumping and Pad Redistribution is coming soon
TLMI Corp | Wafer Bumping and Pad Redistribution
Looking for 300 MM Wafer Bumping? Looking For Quality and Dependability? ITAR and ISO 9000 Registered. Gold and Indium Bumping. Copper and Solder Bumping. When you are looking for Quality and dependability, rely on TLMI as your full-service wafer bumping partner. Pick and Place (outsourced). Our high quality process provides consistent, stable and advanced development and production capabilities. Peregrine Semiconductor expands into new building. August 14, 2015. August 14, 2015. August 12, 2015.
TL MicroSystems - Casual Web Hosting.....
Welcome to TL MicroSystems. We host the following webpages. Oregon Nordic Club Willamette Chapter. I Sold It Salem, Oregon.
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