wafergrind.com

Wafer Grinding

Wafer Grinding and Polishing. Wafer Pick and Place. Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications targeting unit cost reduction and maximum product yield. GDSI has perfected the process of mechanical stress reduction in ultra-thin wafers after a decade of R&D. Wafer Grinding and Polishing.

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Grinding And Dicing Services Inc.

925 B●●●●●sa Rd

San●●●ose , CA, 95133

US

no●●●●●●●●●●●●@worldnic.com

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Grinding And Dicing Services Inc.

Grinding And Dicing Services Inc.

925 B●●●●●sa Rd

San●●●ose , CA, 95133

US

jc●●●●●●@wafergrind.com

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Grinding And Dicing Services Inc.

Grinding And Dicing Services Inc.

925 B●●●●●sa Rd

San●●●ose , CA, 95133

US

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Wafer Grinding | wafergrind.com Reviews

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Wafer Grinding and Polishing. Wafer Pick and Place. Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications targeting unit cost reduction and maximum product yield. GDSI has perfected the process of mechanical stress reduction in ultra-thin wafers after a decade of R&D. Wafer Grinding and Polishing.

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2 media

3 request form

4 wafer automated inspection

5 wafer dicing

6 quality assurance

7 industries served

8 changing the future

9 featured services

10 speed to delivery

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Wafer Grinding | wafergrind.com Reviews

https://wafergrind.com

Wafer Grinding and Polishing. Wafer Pick and Place. Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications targeting unit cost reduction and maximum product yield. GDSI has perfected the process of mechanical stress reduction in ultra-thin wafers after a decade of R&D. Wafer Grinding and Polishing.

INTERNAL PAGES

wafergrind.com

1

MIL STD AOI wafer bump inspection quick turn service

http://www.wafergrind.com/wafer_automated_inspection.html

The versatility of our inspection systems allows us to inspect any repeating die on substrates up to 8" in diameter. The sensitivity of the system can be altered to pick up or ignore virtually anything of interest as small as 2 microns. We have enhanced our tools with both Solder Ball and Bond Pad inspection functions. You may find our content rich reports useful in identification of wafer fabrication process flaws. Pick Map/Yield Reports Exporting. Wafer Grinding and Polishing. Wafer Pick and Place.

2

Media - Wafer Grinding

http://www.wafergrind.com/media.html

Wafer Grinding and Polishing. Wafer Pick and Place. Rockwell Collins presents Grinding and Dicing Services Incorporated ("GDSI") with ASIC Supplier of the Year Award. Posted May 5th, 2010. Cedar Rapids, Iowa (April 15, 2010) Grinding and Dicing Services Inc. of San Jose, CA., was presented with the 2010 ASIC Supplier of the Year Award by Jeff Moore, Senior Vice President of Operations Rockwell Collins, during the company’s Annual Supplier Conference. Posted February 14th, 2007. Posted January 5th, 2007.

3

Wafer die sorting binning flip chip quick turn service

http://www.wafergrind.com/wafer_pick_place.html

GDSI inventories a variety of waffle pack pocket sizes to enable our customers the quick turn they desire. Since we cannot predict every possibility and we know that die rotation is not acceptable we also offer a Gel-pak option, which is an open platform that can accommodate any die size. Either of these two options will allow up to 8 bins to be picked in one pass to 2 packs. Waffle Packing Die Size 25x25 mil. Gel-packing Die Size 10x10 mil. Frame-to-Frame – placed on 8-inch OD frame. Wafer Pick and Place.

4

Sitemap - Wafer Grinding

http://www.wafergrind.com/sitemap.html

Wafer Grinding and Polishing. Wafer Pick and Place. Wafer Grinding and Polishing. Wafer Pick and Place. Wafer Grinding and Polishing.

5

Serving Military, Semiconductor, Medical & other industries

http://www.wafergrind.com/industries_served.html

Wafer Grinding and Polishing. Wafer Pick and Place. MEMS Manufacturers at the Device Level. Medical Device Manufacturers Implantable Devices. Military Applications Missle Guidance Systems. Wafer Grinding and Polishing.

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jazzsemi.com

TowerJazz Newsletter - June 2015

http://www.jazzsemi.com/newsletters/2015/06.html

Vision, Mission and Values. Process Services (TOPS™). Process Design Kits (PDKs). Ldquo;Shokunin” Mindset. Message from Mr. Russell Ellwanger—TowerJazz CEO and TPSCo Chairman. A Japanese Sharpening Stone. Scrap (DESTRUCTION) is simply not done. The "Shokunin" mind set permeates all levels of Japanese society and is the basis for why quality in Japanese factories is always of such a high level. Respect and responsibility for one’s work place and tools is taught from the youngest age. My family experienced...

iwlpc.com

Sponsors | IWLPC - International Wafer Level Packaging Conference

http://www.iwlpc.com/sponsors.cfm

Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. We couldn't have an event this good without the dedication and support of our sponsors and exhibitors. If you would like to see your company listed on this page, sign up to become a sponsor. Applied Materials is the global leader in providing innovative equipment, services and software to the semiconductor, flat panel display and solar photovoltaic industries. SUSS MicroTec is a leading supplier of equipment and process solu...

testedgeinc.com

TestEdge - Industry Partners

http://www.testedgeinc.com/industrypartners.html

Technoprobe is a microelectronic industry leader in design, development, manufacture, sale and support of advanced semiconductor wafer probe cards. Finley Design Services is a leading designer and supplier of quality load boards, probe cards, and DUT boards for the IC test industry. GDSI is a leading supplier to the IC industry for critical post-fabrication process requirements. Copy 2016 TestEdge, Inc.

towersemi.com

TowerJazz Newsletter - June 2015

http://www.towersemi.com/newsletters/2015/06.html

Vision, Mission and Values. Process Services (TOPS™). Process Design Kits (PDKs). Ldquo;Shokunin” Mindset. Message from Mr. Russell Ellwanger—TowerJazz CEO and TPSCo Chairman. A Japanese Sharpening Stone. Scrap (DESTRUCTION) is simply not done. The "Shokunin" mind set permeates all levels of Japanese society and is the basis for why quality in Japanese factories is always of such a high level. Respect and responsibility for one’s work place and tools is taught from the youngest age. My family experienced...

gotsige.com

TowerJazz Newsletter - June 2015

http://www.gotsige.com/newsletters/2015/06.html

Vision, Mission and Values. Process Services (TOPS™). Process Design Kits (PDKs). Ldquo;Shokunin” Mindset. Message from Mr. Russell Ellwanger—TowerJazz CEO and TPSCo Chairman. A Japanese Sharpening Stone. Scrap (DESTRUCTION) is simply not done. The "Shokunin" mind set permeates all levels of Japanese society and is the basis for why quality in Japanese factories is always of such a high level. Respect and responsibility for one’s work place and tools is taught from the youngest age. My family experienced...

automotivesensors2015.com

Exhibitors | Automotive Sensors and Electronics 2015

http://www.automotivesensors2015.com/exhibitors.html

Exhibit packages for Automotive Sensors and Electronics 2015 are available. For further information and questions about exhibiting, please click here. Http:/ www.allionusa.com. Http:/ www.alphaprecision.com. Alpha Precision also does specialty MicroBlast machining of many different shapes and sizes. Http:/ www.ams.com. On twitter or share. Http:/ www.autoharvest.org. Http:/ www.freescale.com. Http:/ www.geibrefining.com. Http:/ www.wafergrind.com. Core areas of service: Silicon, Glass, SiGe, SiC, PZT, Sa...

uhvsputtering.com

Welcome to UHV Sputtering Inc.

http://www.uhvsputtering.com/index.asp

Specializes in custom thin film coatings, bonding services and offers target materials. We are Northern California's most innovative vacuum coating service, with the nuts and bolts know-how to conform to your company's specific needs. UHV Sputtering Inc. continuously strengthens its service to provide diversity in its products and for future product expansion. Our mission is to provide the highest quality workmanship, products and materials at a fast delivery and competitive prices. Invites you to contact.

jazzsemiusa.com

TowerJazz Newsletter - June 2015

http://www.jazzsemiusa.com/newsletters/2015/06.html

Vision, Mission and Values. Process Services (TOPS™). Process Design Kits (PDKs). Ldquo;Shokunin” Mindset. Message from Mr. Russell Ellwanger—TowerJazz CEO and TPSCo Chairman. A Japanese Sharpening Stone. Scrap (DESTRUCTION) is simply not done. The "Shokunin" mind set permeates all levels of Japanese society and is the basis for why quality in Japanese factories is always of such a high level. Respect and responsibility for one’s work place and tools is taught from the youngest age. My family experienced...

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Wafer Grinding

Wafer Grinding and Polishing. Wafer Pick and Place. Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications targeting unit cost reduction and maximum product yield. GDSI has perfected the process of mechanical stress reduction in ultra-thin wafers after a decade of R&D. Wafer Grinding and Polishing.

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