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37329;相产品事业部. 65288;金相微切片设备及金相耗材）. Metallographic Equipment & Consumables. 31934;密研磨抛光材料事业部（光电研磨抛光材料）. Precision Lapping / Polishing Materials. 38075;石/金刚石研磨抛光材料. Diamond Grinding / Polishing Materails. 34013;宝石长晶与衬底片（LED晶棒与晶片）. 31934;密测试仪器事业部（PCB、CCL检测仪器）. Precision Testing Equipment for PCB and CCL. USA Office：XUYO TECHNOLOGIES LLC. Address:1000 N West Street, Suite 1200, Wilmington, Delaware 19801, USA. Web Site： www.xuyo.us. Hong Kong Office：XUYO TECHNOLOGIES, LTD. E-mail: sales@xuyo.com.cn.

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37329;相产品事业部. 65288;金相微切片设备及金相耗材）. Metallographic Equipment & Consumables. 31934;密研磨抛光材料事业部（光电研磨抛光材料）. Precision Lapping / Polishing Materials. 38075;石/金刚石研磨抛光材料. Diamond Grinding / Polishing Materails. 34013;宝石长晶与衬底片（LED晶棒与晶片）. 31934;密测试仪器事业部（PCB、CCL检测仪器）. Precision Testing Equipment for PCB and CCL. USA Office：XUYO TECHNOLOGIES LLC. Address:1000 N West Street, Suite 1200, Wilmington, Delaware 19801, USA. Web Site： www.xuyo.us. Hong Kong Office：XUYO TECHNOLOGIES, LTD. E-mail: sales@xuyo.com.cn.

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37329;相产品事业部. 65288;金相微切片设备及金相耗材）. Metallographic Equipment & Consumables. 31934;密研磨抛光材料事业部（光电研磨抛光材料）. Precision Lapping / Polishing Materials. 38075;石/金刚石研磨抛光材料. Diamond Grinding / Polishing Materails. 34013;宝石长晶与衬底片（LED晶棒与晶片）. 31934;密测试仪器事业部（PCB、CCL检测仪器）. Precision Testing Equipment for PCB and CCL. USA Office：XUYO TECHNOLOGIES LLC. Address:1000 N West Street, Suite 1200, Wilmington, Delaware 19801, USA. Web Site： www.xuyo.us. Hong Kong Office：XUYO TECHNOLOGIES, LTD. E-mail: sales@xuyo.com.cn.

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xuyo.cn

旭扬科技(亚洲)

http://www.xuyo.cn/met/consum/technovit2000.htm

Technovit 2000 LC 系统包括光固化镶嵌树脂、覆层清漆、固位膏和 Technotray CU 光固化机。 Technovit 2000 LC 是光固化、单组合、高度透明、以甲基丙烯酸酯为基质的镶嵌树脂。 Technovit 2000 LC 是高度紧密贴切的镶嵌材料，它是专为测试和预备敏感材料和微型元件而专业开发研制的。 Technovit 2000 LC 的主要应用领域为半导体技术、微电子技术、医学技术、光电技术和微系统技术。采用适当的光照程序, 可使聚合温度降至 50 左右。 Technotray CU 系蓝光聚合机，是与 Technotray 2000 LC 光固化树脂完全匹配的专用光固化机。版权所有 2001-2014 旭扬科技有限公司未经允许、不得转载.

xuyo.cn

旭扬科技(亚洲)

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xuyo.cn

旭扬科技(亚洲)

http://www.xuyo.cn/met/consum/dia_disc.htm

Metal Bonded Diamond Grinding Discs and Diamond Lapping Films. Bonded Diamond Discs, 8" (203mm). 4、光纤光学抛光 4 英寸(101.6 mm)和5 英寸 (127mm)可用. 8(203mm) Discs (Pk/5) 8 (203mm)研磨薄膜盘. Type B Discs (Pk/5). 版权所有 2001-2014 旭扬科技有限公司未经允许、不得转载.

xuyo.cn

旭扬科技(亚洲)

http://www.xuyo.cn/index.htm

金相、岩相、电路板、电子材料、晶圆、光纤、陶瓷电容、L.C.D/L.E.D等微组织前处理用切割、镶埋、研磨、抛光、金相显微镜、影像分析仪及各种耗材。 2、镶嵌材料高渗透度水晶胶Epoxy Resin、压克力粉. 光电产业之研磨抛光制程的相关产品,包括:工业天然及合成金刚石微粉、金刚石研磨液膏、精密研磨粉、抛光微粉、抛光液、抛光垫、光学玻璃板、钻石研磨锭. 版权所有 2001-2014 旭扬科技有限公司未经允许、不得转载.

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http://www.xuyo.cn/met/consum/sic_paper.htm

Silicon Carbide Waterproof Grinding Paper(Metallogarphic Use). XUYO公司的SICMET Paper 碳化硅耐水研磨砂纸是专门针对金相试料的研磨而开发。砂纸粒度对照表美制U.S.Industrial Grit、欧制European FEPA or P-Grading. 直径8英寸(203mm)金相专用碳化矽耐水研磨砂纸无背胶Plain Backed、背胶PSA Backed. 直径10英寸(254mm)金相专用碳化矽耐水研磨砂纸无背胶Plain Backed、背胶PSA Backed. 直径12英寸(305mm)金相专用碳化矽耐水研磨砂纸无背胶Plain Backed、背胶PSA Backed. 版权所有 2001-2014 旭扬科技有限公司未经允许、不得转载.

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金相、岩相、电路板、电子材料、晶圆、光纤、陶瓷电容、L.C.D/L.E.D等微组织前处理用切割、镶埋、研磨、抛光、金相显微镜、影像分析仪及各种耗材。 2、镶嵌材料高渗透度水晶胶Epoxy Resin、压克力粉. 光电产业之研磨抛光制程的相关产品,包括:工业天然及合成金刚石微粉、金刚石研磨液膏、精密研磨粉、抛光微粉、抛光液、抛光垫、光学玻璃板、钻石研磨锭. 版权所有 2001-2014 旭扬科技有限公司未经允许、不得转载.

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