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News & Downloads. Ziptronix 3D IC Technology is. 3D SoC Cost Savings Estimator. Estimate the cost savings potential of building an SoC in 3D with our Ziptronix DBI. Process - Click Here. Ziptronix Licenses DBI Hybrid Bonding Patents to Sony for Advanced Image Sensor Applications. Fermilab Implements Ziptronix’s DBI Hybrid Bonding in High-End 3D Image Sensors. Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding. 5400 Glenwood Avenue, Suite G-05, Raleigh, NC 27612.

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News & Downloads. Ziptronix 3D IC Technology is. 3D SoC Cost Savings Estimator. Estimate the cost savings potential of building an SoC in 3D with our Ziptronix DBI. Process - Click Here. Ziptronix Licenses DBI Hybrid Bonding Patents to Sony for Advanced Image Sensor Applications. Fermilab Implements Ziptronix’s DBI Hybrid Bonding in High-End 3D Image Sensors. Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding. 5400 Glenwood Avenue, Suite G-05, Raleigh, NC 27612.

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News & Downloads. Ziptronix 3D IC Technology is. 3D SoC Cost Savings Estimator. Estimate the cost savings potential of building an SoC in 3D with our Ziptronix DBI. Process - Click Here. Ziptronix Licenses DBI Hybrid Bonding Patents to Sony for Advanced Image Sensor Applications. Fermilab Implements Ziptronix’s DBI Hybrid Bonding in High-End 3D Image Sensors. Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding. 5400 Glenwood Avenue, Suite G-05, Raleigh, NC 27612.

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Experienced early-stage venture capital firm. News & Events. Http:/ www.ziptronix.com. Ziptronix is a semiconductor materials processing company that provides room temperature, adhesive-free, covalent bonding of a wide variety of semiconductor materials. This technology enables wafer-to-wafer bonding and die-to-wafer bonding with high speed, high density interconnect. The company is focused on 3D integration of a wide variety of circuit types, including memory, processor and controller chips.

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News & Downloads. Ziptronix 3D IC Technology is. 3D SoC Cost Savings Estimator. Estimate the cost savings potential of building an SoC in 3D with our Ziptronix DBI. Process - Click Here. Ziptronix Licenses DBI Hybrid Bonding Patents to Sony for Advanced Image Sensor Applications. Fermilab Implements Ziptronix’s DBI Hybrid Bonding in High-End 3D Image Sensors. Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding. 5400 Glenwood Avenue, Suite G-05, Raleigh, NC 27612.

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