
zs-handling.org
Handling Systems for Manufacturing | High-Tech by Zimmermann & SchilpNon-contact handling technologies for photovoltaic, semiconductor and glass industries.
http://www.zs-handling.org/
Non-contact handling technologies for photovoltaic, semiconductor and glass industries.
http://www.zs-handling.org/
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Zimmermann & Schilp Handhabungstechnik GmbH
Micha●●●●●chilp
Reg●●●urg , Germany, 93055
DE
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Zimmermann & Schilp Handhabungstechnik GmbH
Michael Schilp
Budape●●●●●●Str. 2
Reg●●●urg , Germany, 93055
DE
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Handling Systems for Manufacturing | High-Tech by Zimmermann & Schilp | zs-handling.org Reviews
https://zs-handling.org
Non-contact handling technologies for photovoltaic, semiconductor and glass industries.
핸들링 시스템 - 홈페이지 - ZS-Handling
http://www.zs-handling.org/핸들링-시스템
광전지산업: 결정 실리콘(cSi) 또는 박막모듈을 기반으로 합니다. 평면디스플레이 산업: G1에서 G10에 이르는 기판들, 두께 6mm에 달하는 유리들. 반도체산업: 두께 450mm에 달하는 표준 웨이퍼, 두께 40μm에 달하는 박판 웨이퍼. 특수 솔루션: 예를 들면 표장기술, 전자부품 조합. 낮은 파손율 – 높은 생산량. New Distribution Partner in Japan.
Customer satisfaction is our priority - Support
http://www.zs-handling.org/support
Customer satisfaction is our priority. If you have any questions, problems or if you are looking for the best solution for a certain application we will be glad to make you participate in our extensive technical know-how and long-term experience in non-contact handling. The support can be contacted at service@zs-handling.com. Or through the support hotline 49 941 60389 900. Support is available Monday through Friday 8.00 (8 am) to 17.00 (5 pm) CET.
Sales | Handling systems | Zimmermann & Schilp Handhabungstechnik GmbH
http://www.zs-handling.org/sales-handling-systems
Unites States / North America. Our sales staff is available at any time to answer any question. We are also available for on-site, at your company's facilities, consultation. Together with our international sales network and our independant distribution partners and resellers, we are your contact for ultra-pure handling.
Handhabungssysteme von ZS-Handling - High-Tech für die Produktion
http://www.zs-handling.org/Handhabungssysteme
Geringste Bruchrate ( 50ppm). Hoher Durchsatz (bis zu 3 Wafer/s). Geringer Bauraum und Energieverbrauch. Top- und Backside Handling. Ultrasaubere und -sichere Handhabung. Neuer Vertriebspartner in Japan.
Systèmes de manipulation et haute technologie par Zimmermann & Schilp
http://www.zs-handling.org/systemes-de-manipulation
Silicium crytallin (cSi) ou modules à couche mince. Substrates de G1 à G10, verres plats jusqu'a 6mm épaisseur. Barreaux de silicium jusqu'à 450 mm, épaisseur minimale 40µm. P ex techniques d'emballage et de conditionnement, insertion électronique. Production plus élevée. Exploitation plus élevée. Ultra-pure: pas de contamination. Ultra-vite: production plus élevée. Ultra-douce: plus haut exploit. Simplification de la production. New Distribution Partner in Japan.
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Handling Systems for Manufacturing | High-Tech by Zimmermann & Schilp
Lowest breakage Rate ( 50ppm). High Throughput (up to 3 wafers/sec). Small Footprint. Low Energy Consumption. Top- and Backside Handling. Ultra-Pure and Ultra-Safe Handling. New Distribution Partner in Japan. Arched/Angle Bar Ultrasonic Suspension.
Handling Systems for Manufacturing | High-Tech by Zimmermann & Schilp
Lowest breakage Rate ( 50ppm). High Throughput (up to 3 wafers/sec). Small Footprint. Low Energy Consumption. Top- and Backside Handling. Ultra-Pure and Ultra-Safe Handling. New Distribution Partner in Japan. Arched/Angle Bar Ultrasonic Suspension.
Handhabungssysteme von ZS-Handling - High-Tech für die Produktion
Geringste Bruchrate ( 50ppm). Hoher Durchsatz (bis zu 3 Wafer/s). Geringer Bauraum und Energieverbrauch. Top- und Backside Handling. Ultrasaubere und -sichere Handhabung. Neuer Vertriebspartner in Japan.
Handhabungssysteme von ZS-Handling - High-Tech für die Produktion
Geringste Bruchrate ( 50ppm). Hoher Durchsatz (bis zu 3 Wafer/s). Geringer Bauraum und Energieverbrauch. Top- und Backside Handling. Ultrasaubere und -sichere Handhabung. Neuer Vertriebspartner in Japan.
Handling Systems for Manufacturing | High-Tech by Zimmermann & Schilp
Lowest breakage Rate ( 50ppm). High Throughput (up to 3 wafers/sec). Small Footprint. Low Energy Consumption. Top- and Backside Handling. Ultra-Pure and Ultra-Safe Handling. New Distribution Partner in Japan. Arched/Angle Bar Ultrasonic Suspension.
Handling Systems for Manufacturing | High-Tech by Zimmermann & Schilp
Lowest breakage Rate ( 50ppm). High Throughput (up to 3 wafers/sec). Small Footprint. Low Energy Consumption. Top- and Backside Handling. Ultra-Pure and Ultra-Safe Handling. New Distribution Partner in Japan. Arched/Angle Bar Ultrasonic Suspension.
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