irsp2016.malab.com
invited speakers – IRSP 2016
http://irsp2016.malab.com/invited-speakers
14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. Andreas Aal, Volkswagen, Wolfsburg, Germany. Andre Clausner, Fraunhofer IKTS Dresden, Germany. Hajdin Ceric, University Vienna, Austria. Reinhold Dauskardt, Stanford University, Palo Alto/CA, US. Christoph Eberl, Fraunhofer IWM Freiburg, Germany. Reyes Elizalde, Ceit, San Sebastian, Spain. Ude Hangen, Hysitron, Aachen, Germany.
irsp2016.malab.com
downloads – IRSP 2016
http://irsp2016.malab.com/download
14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. Paul Ho, UT Austin/TX, USA. Jim Lloyd, SUNY Albany/NY, USA. Han-Ping Pu, TSMC, Taiwan. Manfred Reiche, Max Planck Institute Halle, Germany. Ellen Hieckmann, Technical University Dresden, Germany. Thomas Nuytten, IMEC Leuven, Belgium. Tengfei Jiang, University of Central Florida/FL, USA. Henry Proudhon, MINES ParisTech, France.
irsp2016.malab.com
venue and accommodation – IRSP 2016
http://irsp2016.malab.com/venue
14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. Hotel Elbresidenz Bad Schandau near Dresden, Germany. A block of rooms is reserved at the conference hotel. Reservations must be made by May. To guarantee a room. Please identify yourself as being with the IRSP. To get a room from the reserved block of rooms. Phone 49 36461 92007. Room allotment code: IRSP2016).
irsp2016.malab.com
topics – IRSP 2016
http://irsp2016.malab.com/topics
14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. On-chip and 3D interconnect stacks: Synthesis, functionality and performance. Scaling limitations of interconnects: Metals and dielectrics. Thermo-mechanical properties and stress: Measurements and simulation. Role of microstructure and interfaces on mechanical behaviour of nanostructures. Design and test for reliability.
irsp2016.malab.com
special journal issue – IRSP 2016
http://irsp2016.malab.com/invited-speakers-and-program
14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. Selected papers will be published in IEEE Transactions on Device and Materials Reliability (TDMR) and in Advanced Engineering Materials (AEM). The deadline for submission of manuscripts will be July 31, 2016. Scope of the conference. Co-chairs and scientific committee. Credit card payment form. Phone 49 351 88815 543.
irsp2016.malab.com
program – IRSP 2016
http://irsp2016.malab.com/program
14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. Scope of the conference. Co-chairs and scientific committee. Credit card payment form. Phone 49 351 88815 543. Fax 49 351 88815 509. Ehrenfried.zschech@ikts.fraunhofer.de.
irsp2016.malab.com
call for papers – IRSP 2016
http://irsp2016.malab.com/call-for-abstracts
14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics Experiment and Simulation. May 30 June 1, 2016 Dresden, Germany. Scope of the conference. One-page abstracts must be received by January 15, 2016. Address the abstracts to the Chair:. Ehrenfried.zschech@ikts.fraunhofer.de. Notice of acceptance of papers will be given by January. Accepted abstracts will be published in the conference program as submitted. Scope of the conference. Co-chairs and scientific committee.
