vanderbilt.edu
CPMT Technical Committee on Thermal Management & Thermo-Mechanical Design (TC-9)
http://www.vanderbilt.edu/IEEE-TC9
Ackaging, and M. Thermal Management and Thermo-Mechanical Design (TC-9). The Thermal Management and Thermomechanical Design Technical Committee is concerned with all aspects of thermal, thermo-mechanical, electro-thermal phenomena related to electronic/microelectronics packaging and electrical systems. The subjects of interest include:. Electronic Cooling and Thermal Management of Component and System. Thermal Design and Analysis. Thermal and Thermomechanical Measurements. Thermal Mismatches and Stressses.
es.cfturbo.com
CFturbo: Archivo de eventos
http://es.cfturbo.com/cfturbo/archivo-de-eventos.html
CFturbo - Software zum Entwurf von Turbomaschinen: radiale, halbaxiale Pumpen- und Ventilatorlaufrder und Spiralgehuse. Hora local (HEC/HECV): 13:35. Nuevo en CFturbo 10.2. Fundamentos de diseño de turbomáquinas. Diseño de turbomáquinas en CFturbo. AIAA Propulsion Energy 2016. Salt Lake City (USA). Presentación de CFturbo en la exhibición anexa. Optimization- and Stochastic days 2016. 23-24 Junio 2016, Weimar (Alemania). CFturbo es expositor en el evento. ASME Turbo Expo 2016. Seúl (Corea del Sur). ANSYS...
team-group.com.tn
Feed aggregator | teamgroup
http://www.team-group.com.tn/aggregator
IPC Tin Whiskers Conference, br/ sponsored by Lockheed Martin. Thu, 02/02/2012 - 16:10. April 17 - 19. Ft Worth, TX, USA. Thu, 02/02/2012 - 16:10. April 19 - 21. IPC Test and Inspection Conference. Thu, 02/02/2012 - 16:10. May 15 - 17. San Jose, CA, USA. IPC International Conference on Flexible Circuits. Thu, 02/02/2012 - 16:10. June 12 - 14. Irvine, CA, USA. IPC Midwest Conference and Exhibition. Thu, 02/02/2012 - 16:10. August 22 - 23. Schaumburg, IL, USA. IPC International Conference on HDI. IPC APEX ...
electronics-cooling.com
Organically Grown 3D Printable Heatsinks – Part 1: A Simple Iterative Procedure « Electronics Cooling Magazine – Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
http://www.electronics-cooling.com/2015/03/organically-grown-3d-printable-heatsinks-part-1-a-simple-iterative-procedure
Organically Grown 3D Printable Heatsinks – Part 1: A Simple Iterative Procedure. March 24th, 2015. More specifically, how could you use simulation to identify an arbitrary heatsink topology that is thermally efficient? The/an answer turned out to be very simple:. Start with a minimal section of heatsink base, a thin sliver. Simulate to see how hot it gets. Where its surface is hottest ‘grow’ the geometry there by a very small amount. Repeat until a design space has been filled. To visualise the rest of t...
fluxthermal.com
News — Flux Thermal Solutions
http://www.fluxthermal.com/news
Designer Heat Transfer Fluids. Designer Heat Transfer Fluids. March 31, 2015. SEMI-THERM 31 Electronics Cooling Conference was a success! March 31, 2015. Founding member Jacob Supowit presented his paper on the chemical analysis of inorganic aqueous advanced working fluids for heat pipes. The variety of presentations provided a very practical take on current challenges in electronics cooling. Combining industry applications and fundamental research is the secret to implementable innovation. Researchers a...
en.cfturbo.com
CFturbo: News archive
http://en.cfturbo.com/cfturbo/news-archive.html
CFturbo - Software zum Entwurf von Turbomaschinen: radiale, halbaxiale Pumpen- und Ventilatorlaufrder und Spiralgehuse. Current local time (CET/CEDT): 02:37. New in CFturbo 10.1. Turbomachinery design theory and CFturbo practicing (2 days). Turbomachinery design with CFturbo (1 day). ASME Turbo Expo 2016. CFturbo: Exhibition Hall, Booth 810. 12th International Conference on Turbochargers and Turbocharging. 17-18 May 2016, London (UK). CFturbo is exhibitor on the conference, booth 2. NEW: CFturbo 10.0.
4dchips.blogspot.com
Going Vertical - The 4D Chips Blog: 2010/02
http://4dchips.blogspot.com/2010_02_01_archive.html
Going Vertical - The 4D Chips Blog. The era of increasing functionality by expanding die area is over. Much like boundary constrained urban areas, the only option is to Go Vertical. 4D Chips focuses on the community, technical challenges and business issues associated with building stacked die products. . Great Blog: Perspectives From the Leading Edge. I recently came across another great blog, Perspectives From the Leading Edge. That focuses on vertical integration technology. Links to this post.
thermallive2015.com
Presenters & Sponsors - Thermal Live 2015Thermal Live 2015
http://thermallive2015.com/presenters-sponsors
Presenters & Sponsors. Presenters & Sponsors. If you’d like information about participating in. Thermal Live™ 2016, please fill out the form below. Fill out my online form. Presentation and Sponsorship Opportunities. Thermal Live 2016 will run from October 4th – 6th, with a range of participation levels to suit all budgets:. 2016 Thermal Management Product of the Year, FREE. Thermal Resources, $995. Roundtable Presentation, $4995. 45-minute discussion of practical, technical, non-commercial content.
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