pactech.biz
PacTech - Packaging Technologies - HomeThe official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
http://www.pactech.biz/
The official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
http://www.pactech.biz/
TODAY'S RATING
>1,000,000
Date Range
HIGHEST TRAFFIC ON
Monday
LOAD TIME
Pac Tech Gmbh
Thomas Oppert
Am Schla●●●●●●●●st 15-17
Na●●en , 14641
Germany DE
View this contact
Pac Tech Gmbh
Thomas Oppert
Am Schla●●●●●●●●st 15-17
Na●●en , 14641
Germany DE
View this contact
1&1 Internet AG
Hostmaster EINSUNDEINS
Brau●●●●. 48
Kar●●●uhe , 76135
Germany DE
View this contact
1&1 Internet AG
Hostmaster EINSUNDEINS
Brau●●●●. 48
Kar●●●uhe , 76135
Germany DE
View this contact
BUY YOUR DOMAIN
1&1 INTERNET AG BATCHCSR
WHOIS : whois.neulevel.biz
REFERRED :
PAGES IN
THIS WEBSITE
0
SSL
EXTERNAL LINKS
0
SITE IP
217.160.233.41
LOAD TIME
0 sec
SCORE
6.2
PacTech - Packaging Technologies - Home | pactech.biz Reviews
https://pactech.biz
The official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
Pacto de la CerámicaPacte Cerámic
Pacto de la Cerámica. Trabajamos por la creación de empleo y el desarrollo empresarial de los municipios cerámicos de Castellón y su área de influencia. Nuestro sueño es recuperar el entusiasmo por el trabajo y el espíritu empresarial que siempre han caracterizado y enriquecido a esta provincia. De la marca Km0. Sant Joan de Moró. Creación y Asesoramiento a empresas. EL CASTILLO DE ONDA SERÁ EL ESCENARIO DE LA FERIA MEDIEVAL DURANTE LOS DÍAS 7, 8 y 9 DE AGOSTO. Posted: 4 agosto, 2015. El consorcio pone e...
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
Home - Pactech
Data Center Cable Solutions. FlexNet Copper Cabling Solution. Rapide DAC and AOC. Ethernet Bulk Cables & Accessories. CAT 5e / 6 / 6a. SAS and SATA Cables. SAS to SATA Cables. Direct Attach Copper (DAC). SATA Power Adapter Cables. PCIE Power Adapter Cables. AT Power Adapter Cables. ATX Power Adapter Cables. CPU & DC Fan Power Adapter Cables. Payment & Shipping. Data Center Cable Solutions. FlexNet Copper Cabling Solution. Rapide DAC and AOC. Ethernet Bulk Cables & Accessories. CAT 5e / 6 / 6a. Quick turn...
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
Home | Pactech
Welcome to the PACTech website! PACTech services are about helping your organisation succeed with its technology. Success is not about the IT, its about the business practice and process! The IT is just the medium to execute the business goal. PACTech will work with your organisation advising on the right steps to take to make maximise the chances of being successful. This success has been achieved in a variety of roles in all aspects of business management including:.
PacTech - Packaging Technologies GmbH
Wafer Level UBM Plating. Wafer Level Ball Drop. Wafer / Substrate Cleaning. Flip Chip Test Wafer. Test Wafer Pac 2.0. Test Wafer Pac 2.3. Test Wafer Pac 2.7. Wafer Level Photoresist / BCB Coating. Wafer Level UBM Plating. Wafer Thinning / Grinding. Wafer Sawing / Dicing. Tape & Reel. NEWS & EVENTS. Wafer Level UBM Plating. Wafer Level Ball Drop. Wafer / Substrate Cleaning. Flip Chip Test Wafer. Test Wafer Pac 2.0. Test Wafer Pac 2.3. Test Wafer Pac 2.7. Wafer Level Photoresist / BCB Coating. PacTech is a...
PACTECH Pty Ltd
Click on the flags below to view more information. We can also be reached at info@pactech.com.au.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
PACTech, une autre vision de votre projet informatique.
Redirection: http:/ 213.219.187.87/ pactech/.
