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PacTech - Packaging Technologies - HomeThe official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
http://www.pactech.de/
The official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
http://www.pactech.de/
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PacTech - Packaging Technologies - Home | pactech.de Reviews
https://pactech.de
The official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
Locations - Nagase America Corporation
http://nagaseamerica.com/company/locations
Skip to main content. Food & Beverage. Paint & Coatings. Paper & Inks. Pharmaceutical & Diagnostics. News & Events. Nagase and Co., Ltd. As a global leader in innovative products and solutions in life sciences, electronics, chemicals, automotive, and plastics, Nagase is a global network of brands that includes 103 companies in 20 countries. To learn more, please contact us. North, Central, and South America. Nagase America Corp. New York Head Office. Nagase America Corp. Michigan Branch. Research and dev...
長瀬産業株式会社 | 企業情報 | 国内・海外のNAGASEグループ | ASEAN ＆ 中東 製造・加工
http://www.nagase.co.jp/company/group/other-asia
Nagase Singapore (Pte) Ltd. Middle East Representative Office. Nagase India Private Ltd. Nagase India Private Ltd. North India Branch (Gurgaon). Nagase India Private Ltd. South India Branch (Chennai). Dainichi Color (Vietnam) Co., Ltd. Nagase Vietnam Co., Ltd. Nagase Vietnam Co., Ltd. Ho Chi Minh City Branch. Sanko Gosei Technology (Thailand) Ltd. Automotive Mold Technology Co., Ltd. Nafuko Co.,Ltd. Majend Makcs Co., Ltd. Nagase (Thailand) Co., Ltd. Nagase (Thailand) Co., Ltd. Nagase (Siam) Co.,Ltd.
PADAR TECNOENERGIE
http://www.padar.it/Mappa.aspx
Nastro conduttivo per interconnessione celle. Prodotti DBC (Direct Bonded Copper). Materiali compositi in AlSiC per gestione calore. Terminali - Stampaggio di precisione. Materiali per Thick-Film e Tape Ceramici. Wafer Level Packaging Equipments. Monitor LCD e Touch Screen. Wafer Level Manufacturing Services. Sviluppo e Prototipazione Circuiti Integrati. Consulenza Tecnica e Ingegnerizzazione. Terminali - Stampaggio di precisione. Materiali compositi in AlSiC per gestione calore. Padar Tecnonergie - Roma...
PADAR TECNOENERGIE
http://www.padar.it/contenuto.aspx?idMenu2=8
Nastro conduttivo per interconnessione celle. Prodotti DBC (Direct Bonded Copper). Materiali compositi in AlSiC per gestione calore. Terminali - Stampaggio di precisione. Materiali per Thick-Film e Tape Ceramici. Wafer Level Packaging Equipments. Monitor LCD e Touch Screen. Wafer Level Manufacturing Services. Sviluppo e Prototipazione Circuiti Integrati. Consulenza Tecnica e Ingegnerizzazione. Terminali - Stampaggio di precisione. Materiali compositi in AlSiC per gestione calore.
PADAR TECNOENERGIE
http://www.padar.it/contenuto.aspx?idMenu2=7
Nastro conduttivo per interconnessione celle. Prodotti DBC (Direct Bonded Copper). Materiali compositi in AlSiC per gestione calore. Terminali - Stampaggio di precisione. Materiali per Thick-Film e Tape Ceramici. Wafer Level Packaging Equipments. Monitor LCD e Touch Screen. Wafer Level Manufacturing Services. Sviluppo e Prototipazione Circuiti Integrati. Consulenza Tecnica e Ingegnerizzazione. Terminali - Stampaggio di precisione. Materiali compositi in AlSiC per gestione calore.
SmD - Sensorik mit Druck - Netzwerkpartner
http://www.sensorik-smd.com/index.php/netzwerk/netzwerkpartner
ZIM Kooperationsnetzwerk SmD - Sensorik mit Druck. Sensorik für Industrie 4.0 und das Internet der Dinge. ADZ NAGANO GmbH, Ottendorf-Okrilla. Http:/ www.adz.de. BOS Technology GmbH, Berlin. Http:/ www.bos-berlin.de. Capitalis technology GmbH, Berlin. Http:/ www.capitalis-technology.com. DResearch Fahrzeugelektronik GmbH, Berlin. Http:/ www.dresearch-fe.de. GED Electronic Design GmbH, Frankfurt (Oder). Http:/ www.ged.de. MAF Microelectronic Assembly Frankfurt (Oder) GmbH. Http:/ www.maf-ffo.de.
PADAR TECNOENERGIE
http://www.padar.it/Contatti.aspx
Nastro conduttivo per interconnessione celle. Prodotti DBC (Direct Bonded Copper). Materiali compositi in AlSiC per gestione calore. Terminali - Stampaggio di precisione. Materiali per Thick-Film e Tape Ceramici. Wafer Level Packaging Equipments. Monitor LCD e Touch Screen. Wafer Level Manufacturing Services. Sviluppo e Prototipazione Circuiti Integrati. Consulenza Tecnica e Ingegnerizzazione. Terminali - Stampaggio di precisione. Materiali compositi in AlSiC per gestione calore.
PADAR TECNOENERGIE
http://www.padar.it/HomePageEn.aspx
Ribbon for Photovoltaic Cells Interconnection. Direct Bonded Copper (DBC) Products. AlSiC Composite Materials for Thermal Management. Leadframes - Specialised Stamping and Plating. Thick-Film Materials and Ceramic Tapes. Wafer Level Packaging Equipments. Wafer Level Manufacturing Services. Engineering and Prototyping of Integrated Circuits. Technical Consultancy and Engineering. Leadframes - Custom Stamping and Plating. AlSiC Composite Materials for Thermal Management. Direct Bonded Copper (DBC) Products.
Die Verbundpartner - brightlas.com
http://www.brightlas.com/die-verbundpartner.html
Lumics ist ein etablierter Hersteller von Hochleistungs-Diodenlasern und fasergekoppelten Diodenlasermodulen im Bereich 750 nm bis 1960 nm für anspruchsvolle industrielle und wissenschaftliche Anwendungen. 49 (0)30 67 80 67 60. 49 (0)30 67 80 67 626. X69;nfoDE1@lumics.com. Telefon: 49 (0)30 67 80 67 60. Fax: 49 (0)30 67 80 67 62 6. E-Mail: infoDE1@lumics.com. Direktdiodenlaser mit kW Leistungen (cw) für Materialbearbeitung mit sehr hoher Brillanz. Sehr schnelle Elektronik mit allen gängigen Schnittstellen.
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PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
Home | Pactech
Welcome to the PACTech website! PACTech services are about helping your organisation succeed with its technology. Success is not about the IT, its about the business practice and process! The IT is just the medium to execute the business goal. PACTech will work with your organisation advising on the right steps to take to make maximise the chances of being successful. This success has been achieved in a variety of roles in all aspects of business management including:.
PacTech - Packaging Technologies GmbH
Wafer Level UBM Plating. Wafer Level Ball Drop. Wafer / Substrate Cleaning. Flip Chip Test Wafer. Test Wafer Pac 2.0. Test Wafer Pac 2.3. Test Wafer Pac 2.7. Wafer Level Photoresist / BCB Coating. Wafer Level UBM Plating. Wafer Thinning / Grinding. Wafer Sawing / Dicing. Tape & Reel. NEWS & EVENTS. Wafer Level UBM Plating. Wafer Level Ball Drop. Wafer / Substrate Cleaning. Flip Chip Test Wafer. Test Wafer Pac 2.0. Test Wafer Pac 2.3. Test Wafer Pac 2.7. Wafer Level Photoresist / BCB Coating. PacTech is a...
PACTECH Pty Ltd
Click on the flags below to view more information. We can also be reached at info@pactech.com.au.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
PACTech, une autre vision de votre projet informatique.
Redirection: http:/ 213.219.187.87/ pactech/.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
Pacific Technology
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Effektiv förpackningsproduktion och maskinutveckling. För läkemedels- och livsmedelsbranschen. Utveckling av förpackningsproduktion. PacTech är ett oberoende konsultföretag, specialiserat på maskinutveckling för effektiv produktion och förpackning av läkemedel, medical device, livsmedel och liknande produkter. Uppdragsgivare är såväl globala koncerner som nystartade innovatörsföretag och allt däremellan. Anlita PacTech för. Förbättring av befintliga. Industrialisering av nya produkter. Skriv ut denna sida.
Roger: The UC San Diego Libraries Catalog
The UC San Diego Library Catalog. More Search Options ». Gov Doc. Number. For assistance please call the Library at (858) 534-3336. And select Option #1. New Books, Videos, etc. Suggest a title for purchase. View Roger help topics. Official Web site of the University of California, San Diego. UC San Diego, 9500 Gilman Dr., La Jolla, CA 92093 (858) 534-2230.
