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PacTech - Packaging Technologies GmbHThe official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
http://www.pactech.com/
The official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
http://www.pactech.com/
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Pac Tech Gmbh
Thomas Oppert
Am Schla●●●●●●●●st 15-17
Na●●en , 14641
DE
View this contact
Pac Tech Gmbh
Thomas Oppert
Am Schla●●●●●●●●st 15-17
Na●●en , 14641
DE
View this contact
1&1 Internet AG
Hostmaster EINSUNDEINS
Brau●●●●. 48
Kar●●●uhe , 76135
DE
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17
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1 & 1 INTERNET AG
WHOIS : whois.schlund.info
REFERRED : http://1and1.com
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PacTech - Packaging Technologies GmbH | pactech.com Reviews
https://pactech.com
The official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
TowerJazz Newsletter - June 2015
http://www.jazzsemi.com/newsletters/2015/06.html
Vision, Mission and Values. Process Services (TOPS™). Process Design Kits (PDKs). Ldquo;Shokunin” Mindset. Message from Mr. Russell Ellwanger—TowerJazz CEO and TPSCo Chairman. A Japanese Sharpening Stone. Scrap (DESTRUCTION) is simply not done. The "Shokunin" mind set permeates all levels of Japanese society and is the basis for why quality in Japanese factories is always of such a high level. Respect and responsibility for one’s work place and tools is taught from the youngest age. My family experienced...
אורטק: מוצרים
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מערכות יצור להרכבת והלחמת רכיבי SMD ורכיבי החדרה בתעשיית האלקטרוניקה. תחום ציוד אוטומטי לבדיקות ,AOI, SPI בדיקות X-Ray ומערכות מטרולוגיה. מחסנים אוטומטיים לאיכסון רכיבי SMT בתקשורת עם תוכניות וקווי ההרכבה. ציוד הרכבות, הלחמות והדבקות לתעשיות המיקרואלקטרוניקה, רכיבי תקשורת אופטית ומערכות סולריות מבוססות CPV וסיליקון. ציוד להרכבות ובדיקות לתעשיות האופטרוניקה והלייזרים. מכונות יעודיות המתוכננות על פי דרישת לקוח לביצוע תהליכי יצור ספציפיים. מערכות הדמיה היפרספקטרליות לחישה מרחוק ומצלמות IR. מערכות אוטומטיות ...
ECTC | IEEE Electronic Components and Technology Conference
http://www.ectc.net/sponsors/index.cfm
IEEE Electronic Components and Technology Conference. Intel Best Student Paper. Student Reception and Best Student Interactive Presentation. For more information contact:. Intel Best Student Paper. Student Reception and Best Student Interactive Presentation. About ECTC with Video.
TowerJazz Newsletter - June 2015
http://www.towersemi.com/newsletters/2015/06.html
Vision, Mission and Values. Process Services (TOPS™). Process Design Kits (PDKs). Ldquo;Shokunin” Mindset. Message from Mr. Russell Ellwanger—TowerJazz CEO and TPSCo Chairman. A Japanese Sharpening Stone. Scrap (DESTRUCTION) is simply not done. The "Shokunin" mind set permeates all levels of Japanese society and is the basis for why quality in Japanese factories is always of such a high level. Respect and responsibility for one’s work place and tools is taught from the youngest age. My family experienced...
TOTAL LINKS TO THIS WEBSITE
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Home - Pactech
Data Center Cable Solutions. FlexNet Copper Cabling Solution. Rapide DAC and AOC. Ethernet Bulk Cables & Accessories. CAT 5e / 6 / 6a. SAS and SATA Cables. SAS to SATA Cables. Direct Attach Copper (DAC). SATA Power Adapter Cables. PCIE Power Adapter Cables. AT Power Adapter Cables. ATX Power Adapter Cables. CPU & DC Fan Power Adapter Cables. Payment & Shipping. Data Center Cable Solutions. FlexNet Copper Cabling Solution. Rapide DAC and AOC. Ethernet Bulk Cables & Accessories. CAT 5e / 6 / 6a. Quick turn...
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
Home | Pactech
Welcome to the PACTech website! PACTech services are about helping your organisation succeed with its technology. Success is not about the IT, its about the business practice and process! The IT is just the medium to execute the business goal. PACTech will work with your organisation advising on the right steps to take to make maximise the chances of being successful. This success has been achieved in a variety of roles in all aspects of business management including:.
PacTech - Packaging Technologies GmbH
Wafer Level UBM Plating. Wafer Level Ball Drop. Wafer / Substrate Cleaning. Flip Chip Test Wafer. Test Wafer Pac 2.0. Test Wafer Pac 2.3. Test Wafer Pac 2.7. Wafer Level Photoresist / BCB Coating. Wafer Level UBM Plating. Wafer Thinning / Grinding. Wafer Sawing / Dicing. Tape & Reel. NEWS & EVENTS. Wafer Level UBM Plating. Wafer Level Ball Drop. Wafer / Substrate Cleaning. Flip Chip Test Wafer. Test Wafer Pac 2.0. Test Wafer Pac 2.3. Test Wafer Pac 2.7. Wafer Level Photoresist / BCB Coating. PacTech is a...
PACTECH Pty Ltd
Click on the flags below to view more information. We can also be reached at info@pactech.com.au.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
PACTech, une autre vision de votre projet informatique.
Redirection: http:/ 213.219.187.87/ pactech/.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
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