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Company Management | Pactech
http://pactech.co.nz/page/company_management.html
Company management expertise includes:. Contract creation and negotiation. Financial management including budgeting and reporting. Developing sales and marketing strategies and pricing models. HR including staff recruitment, development and management. Development and implementation of internal business processes and day-to-day business administration.
Home | Pactech
http://pactech.co.nz/index.html
Welcome to the PACTech website! PACTech services are about helping your organisation succeed with its technology. Success is not about the IT, its about the business practice and process! The IT is just the medium to execute the business goal. PACTech will work with your organisation advising on the right steps to take to make maximise the chances of being successful. This success has been achieved in a variety of roles in all aspects of business management including:.
Strategic Planning | Pactech
http://pactech.co.nz/page/strategic_planning.html
Successful business management strategies include:. Business analysis and business development for Zeonova Nature Technologies Ltd. Review of ECS business, and providing advice and strategies to the ICSOL board. Review of Retirement Solutions Ltd business and providing advice to the owners. Creation of business frame of reference, for establishing RealSports International, a new business in a new market. Creation of RealSports International business plans for investment funding both government and private.
Business Development | Pactech
http://pactech.co.nz/page/business_development.html
Successful business development completed include:. Founded and developed successful new businesses including RealSports, SiteSuite NZ and SystemsWorks. Setup and developed new business units including AssetWorks – a RentWorks business unit and SiteSuite Australasia - a SiteSuite company. At SystemsWork, I grew the consultancy services from 10% to 50% of the company’s annual turnover within three years. As Managing Director of SiteSuite Australasia, SiteSuite’s leading international distributor.
Business Start-up | Pactech
http://pactech.co.nz/page/business_start_up.html
Successful business start-up projects include:. Business Development Advisor to Zeonova Nature Technologies Ltd - natural industrial hand cleaning products - Zeosoft. Founding partner and Sales Director to iPayDirect Ltd - online payment portal for non for profit organisations. Advisor to ICOS group o nthe development of the ICOS live business. Advisor to The SMT Group Ltd on the restructure of PlanTrac software (Strategic and Operational Planning Software) and associated business.
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PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
Home - Pactech
Data Center Cable Solutions. FlexNet Copper Cabling Solution. Rapide DAC and AOC. Ethernet Bulk Cables & Accessories. CAT 5e / 6 / 6a. SAS and SATA Cables. SAS to SATA Cables. Direct Attach Copper (DAC). SATA Power Adapter Cables. PCIE Power Adapter Cables. AT Power Adapter Cables. ATX Power Adapter Cables. CPU & DC Fan Power Adapter Cables. Payment & Shipping. Data Center Cable Solutions. FlexNet Copper Cabling Solution. Rapide DAC and AOC. Ethernet Bulk Cables & Accessories. CAT 5e / 6 / 6a. Quick turn...
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
Home | Pactech
Welcome to the PACTech website! PACTech services are about helping your organisation succeed with its technology. Success is not about the IT, its about the business practice and process! The IT is just the medium to execute the business goal. PACTech will work with your organisation advising on the right steps to take to make maximise the chances of being successful. This success has been achieved in a variety of roles in all aspects of business management including:.
PacTech - Packaging Technologies GmbH
Wafer Level UBM Plating. Wafer Level Ball Drop. Wafer / Substrate Cleaning. Flip Chip Test Wafer. Test Wafer Pac 2.0. Test Wafer Pac 2.3. Test Wafer Pac 2.7. Wafer Level Photoresist / BCB Coating. Wafer Level UBM Plating. Wafer Thinning / Grinding. Wafer Sawing / Dicing. Tape & Reel. NEWS & EVENTS. Wafer Level UBM Plating. Wafer Level Ball Drop. Wafer / Substrate Cleaning. Flip Chip Test Wafer. Test Wafer Pac 2.0. Test Wafer Pac 2.3. Test Wafer Pac 2.7. Wafer Level Photoresist / BCB Coating. PacTech is a...
PACTECH Pty Ltd
Click on the flags below to view more information. We can also be reached at info@pactech.com.au.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
PACTech, une autre vision de votre projet informatique.
Redirection: http:/ 213.219.187.87/ pactech/.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
