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PacTech - Packaging Technologies - HomeThe official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
http://www.pactech.info/
The official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
http://www.pactech.info/
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Pac Tech Gmbh
Thomas Oppert
Am Schla●●●●●●●●st 15-17
Na●●en , 14641
DE
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Pac Tech Gmbh
Thomas Oppert
Am Schla●●●●●●●●st 15-17
Na●●en , 14641
DE
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1&1 Internet AG
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Brau●●●●. 48
Kar●●●uhe , 76135
DE
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1&1 Internet AG
Hostmaster EINSUNDEINS
Brau●●●●. 48
Kar●●●uhe , 76135
DE
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1&1 Internet AG (R113-LRMS)
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PacTech - Packaging Technologies - Home | pactech.info Reviews
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The official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
Home | Pactech
Welcome to the PACTech website! PACTech services are about helping your organisation succeed with its technology. Success is not about the IT, its about the business practice and process! The IT is just the medium to execute the business goal. PACTech will work with your organisation advising on the right steps to take to make maximise the chances of being successful. This success has been achieved in a variety of roles in all aspects of business management including:.
PacTech - Packaging Technologies GmbH
Wafer Level UBM Plating. Wafer Level Ball Drop. Wafer / Substrate Cleaning. Flip Chip Test Wafer. Test Wafer Pac 2.0. Test Wafer Pac 2.3. Test Wafer Pac 2.7. Wafer Level Photoresist / BCB Coating. Wafer Level UBM Plating. Wafer Thinning / Grinding. Wafer Sawing / Dicing. Tape & Reel. NEWS & EVENTS. Wafer Level UBM Plating. Wafer Level Ball Drop. Wafer / Substrate Cleaning. Flip Chip Test Wafer. Test Wafer Pac 2.0. Test Wafer Pac 2.3. Test Wafer Pac 2.7. Wafer Level Photoresist / BCB Coating. PacTech is a...
PACTECH Pty Ltd
Click on the flags below to view more information. We can also be reached at info@pactech.com.au.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
PACTech, une autre vision de votre projet informatique.
Redirection: http:/ 213.219.187.87/ pactech/.
PacTech - Packaging Technologies - Home
BGA Rework and Reballing. Flip Chip Test Wafer. Test Chip 2.0. Test Chip 2.3. Test Chip 2.5. Test Chip 2.6. Turnkey Services in Asia. Solder Jetting and Rework. PACLINE e-Ni Plating Line. 2015 Sep 14 - 16; Graf-Zeppelin-Haus, Friedrichshafen, Germany; Booth C40 www.empc.com. 2015 Sep 22 - 24; Guangzhou Nanfung International Convention and Exhibition Center, Guangzhou, China; Booth T115 www.lenschina.cn. Wafer Level Packaging Services.
Pacific Technology
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Effektiv förpackningsproduktion och maskinutveckling. För läkemedels- och livsmedelsbranschen. Utveckling av förpackningsproduktion. PacTech är ett oberoende konsultföretag, specialiserat på maskinutveckling för effektiv produktion och förpackning av läkemedel, medical device, livsmedel och liknande produkter. Uppdragsgivare är såväl globala koncerner som nystartade innovatörsföretag och allt däremellan. Anlita PacTech för. Förbättring av befintliga. Industrialisering av nya produkter. Skriv ut denna sida.
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